User's Manual
Table Of Contents
- General Description
- Benefits
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Bluetooth Baseband Core
- Power Management Unit
- Microprocessor Unit
- Integrated Radio Transceiver
- Peripheral Transport Unit
- ADC Port
- PWM
- Triac Control
- Security Engine
- Electrical Characteristics
- RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
Document Number: 002-19043 Rev. PRELIMINARY Page 28 of 33
PRELIMINARY
CYBLE-413136-01
Packaging
The CYBLE-413136-01 is offered in tape and reel packaging. Figure 12 details the tape dimensions used for the CYBLE-413136-01.
Figure 12. CYBLE-413136-01 Tape Dimensions
Figure 13 details the orientation of the CYBLE-413136-01 in the tape as well as the direction for unreeling.
Figure 13. Component Orientation in Tape and Unreeling Direction
Table 20. Solder Reflow Peak Temperature
Module Part Number Package Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles
CYBLE-413136-01 14-pad SMT 260 °C 30 seconds 2
Table 21. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Module Part Number Package MSL
CYBLE-413136-01 14-pad SMT MSL 3