User's Manual

Document Number: 002-19043 Rev. PRELIMINARY Page 5 of 33
PRELIMINARY
CYBLE-413136-01
Pad Connection Interface
As shown in the bottom view of Figure 2 on page 4, the CYBLE-413136-01 has seven main connections that are connected to the
host board via castellated solder pads (“CSP”). The CYBLE-413136-01 also includes additional solder pad connections (“SP”) used
for debug or testing on the bottom side of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions
of the CYBLE-413136-01 module.
Figure 3. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. Antenna Area Keepout: The host board directly below the antenna area of the Cypress module (see Figure 2 on page 4) must
contain no ground or signal traces. This keep out area requirement applies to all layers of the host board.
2. Module Placement: The ideal placement of the Cypress Bluetooth module is in a corner of the host board with the PCB trace
antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Please
refer to AN96841 for module placement best practices.
3. Optional Keepout: To maximize RF performance, the area immediately around the Cypress Bluetooth module PCB trace antenna
may contain an additional keep out area, where no grounding or signal traces are contained. The keep out area applies to all layers
of the host board. The recommended dimensions of the host PCB keep out area are shown in Figure 4 (dimensions are in mm).
Figure 4. Optional Additional Host PCB Keep Out Area Around the CYBLE-413136-01 PCB Trace Antenna
Table 2. Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
CSP 7 Castellated Solder Pads 2.00 mm 1.30 mm 2.00 mm
SP 7 Solder Pads 0.65 mm (Radius) 0.65 mm (Radius) N/A
Castellated Solder Pad (CSP) and Solder Pad (SP) Connection (Seen from Bottom)
Optional Host PCB Keep Out Area Around Chip Antenna