User's Manual
Table Of Contents
- General Description
- More Information
- Contents
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Power Supply Connections and Recommended External Components
- Electrical Specifications
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
PRELIMINARY
CYBLE-224110-00
Document Number: 002-11264 Rev. *A Page 33 of 43
Environmental Specifications
Environmental Compliance
This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF)
directives. The Cypress module and components used to produce this module are RoHS and HF compliant.
RF Certification
The CYBLE-224110-00 module is certified under the following RF certification standards:
n FCC ID: WAP4110
n CE
n IC: 7922A-4110
n MIC
n KC
Environmental Conditions
Table 57 describes the operating and storage conditions for the Cypress BLE module.
ESD and EMI Protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure
near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground.
Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Table 57. Environmental Conditions for CYBLE-224110-00
Description Minimum Specification Maximum Specification
Operating temperature –40 °C 105 °C
Operating humidity (relative, non-condensation) 5% 85%
Thermal ramp rate
– 3 °C/minute
Storage temperature
–40 °C 105 °C
Storage temperature and humidity
– 105 ° C at 85%
ESD: Module integrated into system Components
[6]
–
15 kV Air
2.2 kV Contact
Note
6. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM.
