Datasheet

CY8CMBR3002, CY8CMBR3102
CY8CMBR3106S, CY8CMBR3108
CY8CMBR3110, CY8CMBR3116 Datasheet
Document Number: 001-85330 Rev. *G Page 33 of 37
Figure 24. 8-Pin SOIC (150 mil)
Thermal Impedances
Solder Reflow Specifications
Tab l e 20 illustrates the minimum solder reflow peak temperature to achieve good solderability.
Table 19. Thermal Impedances
Package Typical θ
JA
(°C/W)
8-pin SOIC 127 °C/W
16-pin SOIC 80 °C/W
16-pin QFN 33 °C/W
24-pin QFN 21 °C/W
Table 20. Solder Reflow Specifications
Package Maximum Peak Temperature Time at Maximum Temperature
8-pin SOIC 260 °C 30 s
16-pin SOIC 260 °C 30 s
16-pin QFN 260 °C 30 s
24-pin QFN 260 °C 30 s
51-85066 *F