Data Sheet
Table Of Contents
- CYBT-213066-02, CYBT-213067-02, EZ-BT Module
- General Description
- Benefits
- More Information
- Contents
- Overview
- Pad Connection Interface
- Recommended Host PCB Layout
- Module Connections
- Connections and Optional External Components
- Critical Components List
- Antenna Design
- Bluetooth Baseband Core
- Power Management Unit
- Integrated Radio Transceiver
- Microcontroller Unit
- Peripherals and Communication Interfaces
- Electrical Characteristics
- Chipset RF Specifications
- Timing and AC Characteristics
- Environmental Specifications
- Regulatory Information
- Packaging
- Ordering Information
- Acronyms
- Document Conventions
- Document History Page
- Sales, Solutions, and Legal Information
PRELIMINARY
CYBT-213066-02
CYBT-213067-02
EZ-BT Module
Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document Number: 002-30628 Rev. ** Revised June 18, 2020
CYBT-213066-02, CYBT-213067-02, EZ-BT Module
General Description
The CYBT-213066-02/CYBT-213067-02 is a dual-mode Bluetooth
BR/EDR and Low Energy (BLE) wireless module solution. The
CYBT-213066-02/CYBT-213067-02 includes an onboard crystal oscillator, passive components, and the Cypress CYW20819 silicon
device.
The CYBT-213066-02/CYBT-213067-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial
communication protocols (UART, SPI, I
2
C, I
2
S/PCM). The CYBT-213066-02/CYBT-213067-02 includes a royalty-free stack
compatible with Bluetooth 5.0 in a 12.0 × 16.61 × 1.70 mm module form-factor.
The CYBT-213066-02/CYBT-213067-02 includes an integrated PCB trace antenna, is qualified by Bluetooth SIG, and includes
regulatory certification approval for FCC, ISED, MIC, and CE.
The CYBT-213066-02 includes integrated serial flash used for OTA functionality.
Module Description
■ Module size: 12.00 mm × 16.61 mm × 1.70 mm
■ Complies with Bluetooth Core Specification version 5.0 and
includes support for BR, EDR 2/3 Mbps, eSCO, BLE, LE
2 Mbps, as well as Bluetooth Mesh.
❐ QDID: TBD
❐ Declaration ID: TBD
■ Certified to FCC, ISED, MIC, and CE standards
■ 256-KB on-chip Flash, 176-KB on-chip RAM
■ 512-KB integrated serial flash for OTA
■ Industrial temperature range: –30 °C to +85 °C
■ Integrated Arm
®
Cortex
®
-M4 microprocessor core with
floating point unit (FPU)
RF Characteristics
■ Maximum TX output power: +4.0 dBm
■ BLE RX Receive Sensitivity: –95.0 dBm
Power Consumption
■ TX current consumption
❐ BLE silicon: 5.8 mA (radio only, 0 dBm)
■ RX current consumption
❐ Bluetooth silicon: 5.9 mA (radio only)
■ Cypress CYW20819 silicon low power mode support
❐ PDS: 16.5 μA with 176 KB RAM retention
❐ ePDS: 8.7 μA
❐ HIDOFF (wake on external or timed interrupt): 1.75 μA
Functional Capabilities
■ Up to 18 GPIOs (CYBT-213066-02)
■ Up to 22 GPIOs (CYBT-213067-02)
■ I
2
C, I2S, UART, and PCM interfaces
■ Two Quad-SPI interfaces
■ Auxiliary ADC with up to 15 analog channels
■ Programmable key scan 20 × 8 matrix
■ General-purpose timers and six PWMs
■ Real-time clock (RTC) and watchdog timers (WDT)
■ Bluetooth Basic Rate (BR) and Enhanced Data Rate (EDR)
Support
■ BLE protocol stack supporting generic access profile (GAP)
Central, Peripheral, Observer, or Broadcaster roles
Benefits
CYBT-213066-02/CYBT-213067-02 is fully integrated and
certified solution that provides all necessary components
required to operate Bluetooth communication standards.
■ Proven hardware design ready to use
■ Ultra-flexible supermux I/O design allows maximum flexibility
for GPIO function assignment
■ Over-the-air update capable for development or field updates
■ Bluetooth SIG qualified.
■ ModusToolbox™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test
your Bluetooth application










