Pipelined Sync SRAM Specification Sheet

CY7C1440AV33
CY7C1442AV33
CY7C1446AV33
Document #: 38-05383 Rev. *E Page 19 of 31
Capacitance
[19]
Parameter Description Test Conditions
100 TQFP
Max.
165 FBGA
Max.
209 FBGA
Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V
V
DDQ
= 2.5V
6.5 7 5 pF
C
CLK
Clock Input Capacitance 3 7 5 pF
C
I/O
Input/Output Capacitance 5.5 6 7 pF
Thermal Resistance
[19]
Parameter Description Test Conditions
100 TQFP
Package
165 FBGA
Package
209 FBGA
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
25.21 20.8 25.31 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
2.28 3.2 4.48 °C/W
AC Test Loads and Waveforms
Note:
19. Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1ns
≤ 1ns
(c)
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50Ω
Z
0
= 50Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤ 1ns
≤ 1ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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