Specifications

Telit GE864 and GC864
Product Description
80273ST10008A Rev. 3 - 10/02/06
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2.20 Mounting the GE864 on your Board
2.20.1 General
The Telit GE864 modules has been designed in order to be compliant with a standard lead-free SMT
process.
2.20.2 Module finishing & dimensions
2.20.3 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
2.20.4 PCB pad design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Lead-free Alloy
Surface finishing Sn/Ag/Cu for all solder pads
Pin A1