Datasheet

GRST6340LV
DDR2-667, PC2-5300, Fully Buffered, ECC, 1.5V, 240-pin DIMMs
GRST6340LV 20-Apr-09
Products in Family
GRST6340LV/4GB (2 x 2GB Low-Voltage 2R DIMMs)
GRST6340LV/8GB (2 x 4GB Low-Voltage 2R DIMMs)
GRST6340LV/16GB (2 x 8GB Low Voltage 2R DIMMs)
Features Description
240-pin JEDEC-compliant DIMMs
133.35 mm wide by 30.35 mm high (1.195” x 5.25”)
Data Transfer Rate: 5.3 Gigabytes/sec
Operating Voltage (Nominal): VDD = 1.5 V; VCC = 1.5V
Full DIMM Heat Spreader
Fully RoHS Compliant
Each GRST6340LV upgrade consists of a matched set of
two DDR2-667 Low-Voltage (1.5V) FB-DIMMs. One
Advanced Memory Buffer (AMB) is used as the interface
between the system memory bus and DIMM DRAMs.
One 2K-bit EEPROM is used for Serial Presence Detect.
For improved thermal performance, a Full DIMM Heat
Spreader with thermal interface material (TIM) is attached
to the front and back of the DIMM.
Dataram Product Sun Microsystems Product Supported in these Sun Microsystems systems:
GRST6340LV/4GB
GRST6340LV/8GB
GRST6340LV/16GB
T6340-X-22
T6340-X-24
T6340-X-28
Sun SPARC T6340 Server Module
Notes
Tolerances on all dimensions
except where otherwise
indicated are ±.13 (.005).
All dimensions are expressed
in millimeters
Copyright © 2009 Dataram Corporation | U.S.A. Headquarters [phone] | Offices in Europe and Asia | www.dataram.com
The information contained in this document has been carefully checked and is believed to be reliable and accurate. However, Dataram assumes no responsibility for errors.