Datasheet

DTM67220
1GB 200-Pin 1Rx8 Unbuffered Non-ECC DDR2 SO-DIMM
Document 06833, Revision A, 28-Sep-11, Dataram Corporation 

 2011 Page 11
54
DRAM Case temperature Rise from Ambient due to Active Power-
Down with Slow PDN Exit (DT3Pslow). (Degree C).
1.1 0x2C
DRAM Case Temperature Rise from Ambient due to Page Open Burst
Read/DT4R4W Mode Bit (DT4R/DT4R4W Mode Bit). (Degree C).
0x4A
Bit 0. "0" if DT4W is greater than DT4R - 0
55
DT4R, ( Bits 1:7 ) - 14.8
56
DRAM Case Temperature Rise from Ambient due to Burst Refresh
(DT5B). (Degree C).
23.5 0x2F
57
DRAM Case Temperature Rise from Ambient due to Bank Interleave
Reads with Auto-Precharge (DT7). (Degree C).
31 0x3E
58
Thermal Resistance of PLL Package from Top to Ambient (Psi T-A
PLL). (C/Watt).
UNUSED 0x00
59
Thermal Resistance of Register Package from Top to Ambient ( Psi T-
A Register). (C/Watt).
UNUSED 0x00
60
PLL Case Temperature Rise from Ambient due to PLL Active (DT PLL
Active). (Degree C).
UNUSED 0x00
Register Case Temperature Rise from Ambient due to Register Ac-
tive/Mode Bit (DT Register Active/Mode Bit).
0x00
Bit 0.If "0"Unit for Bits 2:7 is 0.75C - 0.75
Bit 1. RFU. Default: 0 - 0
61
Register Active,( Bits 2:7 ) - 0
62 SPD Revision Revision 1.2 0x12
63 Checksum for Bytes 0-62 0x41
64 Module Manufacturer’s JEDEC ID Code Dataram ID 0x7F
65 Module Manufacturer’s JEDEC ID Code Dataram ID 0x91
66-71 Module Manufacturer’s JEDEC ID Code UNUSED 0x00
72 Module Manufacturing Location UNUSED 0x00
73 Module Part Number D 0x44
74 Module Part Number A 0x41
75 Module Part Number T 0x54
76 Module Part Number A 0x41
77 Module Part Number R 0x52
78 Module Part Number A 0x41
79 Module Part Number M 0x4D
80 Module Part Number 0x20
81 Module Part Number 6 0x36
82 Module Part Number 7 0x37