Data Sheet

Page 14 of 16
DEASINO
Preheat
Main Heat
Peak
Tsmax
TLmax
tpmax
Temperature
Time
Temperature
Time
Temperature
Time
Degree
sec
Degree
sec
Degree
sec
150
10
220
90
258
9
230
40
Parameter
Value
Unit
Average ramp-up rate
3
Degree/sec
Average ramp-down rate
6
Degree/sec
Max. Time 25degree to Peak Temperature
8
Min.
<Table 6: Soldering temperature parameters>
6.Contact information
COMPANY: SHEZHEN DEASINO TECHNOLOGY .,LTD (深圳市鼎欣茂科技有限公司)
ADDRESS: Floor3B. 4Building. YongQi Technology Park. YinTian Industrial Zone. XiXiang.Baoan
District Shenzhen
TEL:[phone]
FAX:[phone]
Addendum
FCCID: 2AV9TDS-52810-01
(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF
Module. For 15 B (§15.107 and if applicable §15.107) compliance, the host manufacturer is
required to show compliance with 15 while the module is installed and operating.
Furthermore the module should be transmitting and the evaluation should confirm that the
module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the
integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new
host device per definition in §15.101.
Integrator is reminded to assure that these installation instructions
will not be made available to the end user of the final host device.
The final host device, into which this RF Module isintegrated" hasto be labelled
with an auxilliary lable stating the FCC IDofthe RF Module,
such as "Contains FCC ID: 2AV9TDS-52810-01
"This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions:
(1)this devicemay not cause harmful interference, and
(2)this devicemust accept any interference received, including
interference thatmay cause undesired operation."