EM12-G Hardware Design LTE-A Module Series Rev. EM12_Hardware_Design_ Date: 2018-09-28 Status: Preliminary www.quectel.
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LTE-A Module Series EM12-G Hardware Design About the Document History Revision Date Author Description Draft 2018-09-28 Oscar LIU/ Reed Wang Initial EM12-G_Hardware_Design 2 / 62
LTE-A Module Series EM12-G Hardware Design Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ...................................................................................................................................
LTE-A Module Series EM12-G Hardware Design 5 Antenna Interfaces............................................................................................................................. 43 5.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 43 5.1.1. Operating Frequency ..................................................................................................... 44 5.2. GNSS Antenna Interface..........................
LTE-A Module Series EM12-G Hardware Design Table Index TABLE 1: FREQUENCY BANDS AND GNSS TYPE OF EM12 MODULE ........................................................ 11 TABLE 2: KEY FEATURES OF EM12 ............................................................................................................... 13 TABLE 3: DEFINITION OF I/O PARAMETERS ................................................................................................. 18 TABLE 4: PIN DESCRIPTION .................................
LTE-A Module Series EM12-G Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 15 FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 17 FIGURE 3: POWER SUPPLY LIMITS DURING RADIO TRANSMISSION....................................................... 23 FIGURE 4: REFERENCE CIRCUIT OF VCC.............
LTE-A Module Series EM12-G Hardware Design 1 Introduction This document defines EM12 module and describes its air interface and hardware interfaces which are connected with customers’ applications. This document can help customers to quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM12 module. To facilitate its application in different fields, reference design is also provided for customers’ reference.
LTE-A Module Series EM12-G Hardware Design encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help.
LTE-A Module Series EM12-G Hardware Design fréquences radio de la CNR-102, la proximité humaine à l'antenne ne doit pas être inférieure à 20 cm (8 pouces) pendant le fonctionnement normal. IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into.
LTE-A Module Series EM12-G Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM12-G module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE-A Module Series EM12-G Hardware Design 2 Product Concept 2.1. General Description EM12-G is a LTE/UMTS/HSPA+ wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface. EM12-G supports embedded operating systems such as Windows CE, Linux and Android, and also provides GNSS1) and voice functionality2) to meet customers’ specific application demands.
LTE-A Module Series EM12-G Hardware Design B40+40 (CA_40C only); B41+41; B66+66 (CA_66C only);12,29,30,5; B2+B14;B14+B30;B14+B66; (Note: B29, B32 is only for secondary component carrier) DL 3×CA DL inter-band 3CA: 1+3+7, 1+3+19, 1+3+20, 1+3+5, 1+3+8, 1+3+28,1+7+20,1+3+5, 2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30 , 3+7+20, 3+7+28 , 3+7+8, 4+5+30, 4+12+30, 4+29+30 , 5+66+2, 13+66+2, 66+12+30,66+29+30,66+5+30; B2+B14+B66; DL 2 intra-band plus inter-band 3CA: 2+2+5, 2+2+13 , 3+3+7, 3+7+7, 3+3+20 , 3+3+28,3+3+1
LTE-A Module Series EM12-G Hardware Design Wireless POS System Smart Metering System Wireless Router and Switch Other Wireless Terminal Devices 2.2. Key Features The following table describes the detailed features of EM12-G. Table 2: Key Features of EM12-G Feature Details Function Interface PCI Express M.2 Interface Power Supply Supply voltage: 3.135V~4.4V Typical supply voltage: 3.
LTE-A Module Series EM12-G Hardware Design Audio Feature Support one digital audio interface: PCM interface WCDMA: AMR/AMR-WB LTE: AMR/AMR-WB Support echo cancellation and noise suppression PCM Interface Used for audio function with external codec Support 16-bit linear data format Support long frame synchronization and short frame synchronization Support master and slave modes, but must be the master in long frame synchronization USB Interface Compliant with USB 3.0 and 2.
LTE-A Module Series EM12-G Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EM12-G. VCC FULL_CARD_POWER_OFF# Control WWAN_LED# Baseband PCM Control GPIOs Tx/Rx Blocks PRx QLINK W_DISABLE1# WAKE_ON_WAN# ANT_MAIN Tx USB2.0&USB3.0 (U)SIM1&(U)SIM2 Transceiver PCI Express M.2 Key-B Interface 38.4MHz XO ET PMIC RESET# W_DISABLE2# PCIE* ANT_GNSS DRx ANT_DIV NAND + DDR2 SDRAM Figure 1: Functional Diagram 2.4.
LTE-A Module Series EM12-G Hardware Design 3 Application Interfaces The physical connections and signal levels of EM12-G comply with PCI Express M.2 specifications. This chapter mainly describes the definition and application of the following interfaces/signals/pins of EM12-G: Power supply (U)SIM interfaces USB interface PCIE interface* PCM and I2C interfaces Control and indicator signals Tunable antenna control interface* Configuration pins NOTE “*” means under development.
LTE-A Module Series EM12-G Hardware Design 3.1. Pin Assignment The following figure shows the pin assignment of EM12-G. The top side contains EM12-G module and antenna connectors. No.
LTE-A Module Series EM12-G Hardware Design 3.2. Pin Description The following tables show the pin definition and description of EM12-G on the 75-pin application. Table 3: Definition of I/O Parameters Type Description IO Bidirectional DI Digital input DO Digital output OD Open drain PI Power input PO Power output Table 4: Pin Description Pin No. 1 M.2 Socket 2 WWAN Module Pinout CONFIG_3 EM12-G Pin Name I/O 3.3V VCC 3 GND GND PI Power supply 3.
LTE-A Module Series EM12-G Hardware Design 7 USB_D+ USB_DP IO USB 2.0 differential data bus (+) 8 W_DISABLE1# W_DISABLE1# DI Airplane mode control. Active low. 9 USB_D- USB_DM IO USB 2.0 differential data bus (-) OD It is an open collector and active low signal. It allows the module to provide RF status indication via LED devices provided by the system. 1.8V/3.3V power domain 3.
LTE-A Module Series EM12-G Hardware Design (AUDIO_3) signal 29 USB3.0-TX- USB3.0_TX- DO USB 3.0 transmit data (-) 30 UIM-RESET USIM1_RESET DO (U)SIM1 card reset 31 USB3.0-TX+ USB3.0_TX+ DO USB 3.0 transmit data (+) 32 UIM-CLK USIM1_CLK DO (U)SIM1 card clock 33 GND GND 1.8V/3.0V power domain 1.8V/3.0V power domain Ground 34 UIM-DATA USIM1_DATA IO (U)SIM1 card data 35 USB3.0-RX- USB3.0_RX- DI USB 3.
LTE-A Module Series EM12-G Hardware Design 51 GND GND 52 CLKREQ# PCIE_CLKREQ_ N IO PCIE clock request. Active low. 53 REFCLKn PCIE_REFCLK- AI PCIE reference clock(-) 54 PEWAKE# PCIE_WAKE_N IO PCIE wake on host. Active low. 55 REFCLKp PCIE_REFCLK+ AI PCIE reference clock(+) 56 N/C I2C_DATA IO I2C serial data. Used for external codec. 57 GND GND 58 N/C I2C_CLK DO I2C serial clock. Used for external codec. 59 ANTCTL0 ANTCTL0* DO Tunable antenna control.
LTE-A Module Series EM12-G Hardware Design 73 74 75 GND GND 3.3V Ground VCC CONFIG_2 PI Vmin=3.135V Vnorm=3.7V Vmax=4.4V Power supply Not connected internally. EM12-G is configured as WWAN-USB 3.0. CONFIG_2 NOTES 1. 2. Keep all NC, reserved and unused pins unconnected. “*” means under development. 3.3. Power Supply The following table shows pin definition of VCC pins and ground pins. Table 5: Definition of VCC and GND Pins Pin No.
LTE-A Module Series EM12-G Hardware Design Figure 3: Power Supply Limits during Radio Transmission To decrease voltage drop, a bypass capacitor of about 220µF with low ESR (ESR=0.7Ω) should be used, and a multi-layer ceramic chip capacitor (MLCC) array should also be reserved due to its ultra-low ESR. It is recommended to use three ceramic capacitors (100nF, 33pF, 10pF) for composing the MLCC array, and place these capacitors close to VCC pins.
LTE-A Module Series EM12-G Hardware Design MIC29302WU U1 VCC LDO_IN 100nF 51K ADJ 470uF 5 TVS GND C2 OUT 4 3 C1 1 R1 D1 EN 2 IN R2 100K 1%R4 470R R3 R5 4.7K MCU_POWER _ON/OFF C3 C4 470uF 100nF C5 C6 33pF 10pF 51K 1% R6 47K Figure 5: Reference Design of Power Supply NOTE In order to avoid damages to the internal flash, please do not switch off the power supply directly when the module is working.
LTE-A Module Series EM12-G Hardware Design 3.4.1.1. Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# It is recommended to use a GPIO from host to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Host Module 3.3V GPIO FULL_CARD_POWER_OFF# GND GND Figure 6: Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# 3.4.1.2. Turn on the Module Automatically If FULL_CARD_POWER_OFF# is pulled up to 3.
LTE-A Module Series EM12-G Hardware Design The turn on scenario is illustrated in the following figure. NOTE VCC RESET# VIH≥1.19V FULL_CARD_POWER_OFF# VIL≤0.2V Module Status ≥12.5s Booting OFF Active Figure 8: Timing of Turning on Module NOTE Please make sure that VCC is stable before pulling down FUL_CARD_POWER_OFF# pin. The time between them is no less than 30ms. 3.4.2. Turn off the Module 3.4.2.1.
LTE-A Module Series EM12-G Hardware Design 3.4.2.2. Turn off the Module via AT Command The module can also be turned off by AT+QPOWD command. For more details about the command, please refer to document [2]. 3.5. Reset the Module The RESET# pin is used to reset the module. The module can be reset by driving RESET# to a low level voltage for 250ms~600ms. Table 7: RESET# Pin Definition Pin Name RESET# Pin No. 67 Description DC Characteristics Reset the module VIHmax=2.1V VIHmin=1.3V VILmax=0.
LTE-A Module Series EM12-G Hardware Design S2 RESET# TVS Close to S2 Figure 11: Reference Circuit of RESET# by Using Button The reset scenario is illustrated in the following figure. VCC ≤600ms ≥250ms RESET# VIH≥1.3V VIL≤0.5V Module Status Running Resetting Restart Figure 12: Timing of Resetting Module NOTE Please ensure that there is no large capacitance on RESET# pin. 3.6. (U)SIM Interfaces The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8V and 3.
LTE-A Module Series EM12-G Hardware Design Table 8: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment USIM1_VDD 36 PO Power supply for (U)SIM1 card Either 1.8V or 3.0V is supported by the module automatically. USIM1_DATA 34 IO Data signal of (U)SIM1 card USIM1_CLK 32 DO Clock signal of (U)SIM1 card USIM1_RESET 30 DO Reset signal of (U)SIM1 card Pulled up internally. When (U)SIM1 card is present, it is at high level.
LTE-A Module Series EM12-G Hardware Design USIM_VDD GND 15K 100nF Module USIM_VDD USIM_RESET USIM_CLK USIM_DET USIM_DATA (U)SIM Card Connector VCC RST CLK CD 22R 22R GND VPP IO SW GND 22R 33pF 33pF 33pF GND GND Figure 13: Reference Circuit of Normally Short-Circuited (U)SIM Card Connector Normally Short-Circuited (U)SIM Card Connector: When the (U)SIM is absent, CD is short-circuited to SW and USIM_DET is at low level.
LTE-A Module Series EM12-G Hardware Design If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM card interface with a 6-pin (U)SIM card connector is illustrated in the following figure.
LTE-A Module Series EM12-G Hardware Design 3.7. USB Interface EM12-G provides one integrated Universal Serial Bus (USB) interface which complies with the USB 3.0/2.0 specifications and supports super speed (5Gbps) on USB 3.0, high speed (480 Mbps) and full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, GNSS NMEA output, software debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB interface.
LTE-A Module Series EM12-G Hardware Design Test Points Minimize these stubs NM_0R R3 NM_0R R4 USB_DM USB_DP USB3.0_RX+ USB3.0_RX- ESD Array R1 0R R2 0R USB_DM USB_DP C3 100nF C4 100nF USB3.0_TX+ USB3.0_TX- USB3.0_TX+ C1 100nF USB3.0_RX+ C2 100nF USB3.0_RX- USB3.0_TX- GND Module GND MCU Figure 16: Reference Circuit of USB 2.0 & 3.0 Interface In order to ensure the integrity of USB 2.0 & 3.
LTE-A Module Series EM12-G Hardware Design NOTE S “*” means under development. 3.8. PCIE Interface Under development 3.9. PCM and I2C Interfaces EM12-G supports audio communication via Pulse Code Modulation (PCM) digital interface and I2C interface.
LTE-A Module Series EM12-G Hardware Design 125us PCM_CLK 1 2 255 256 PCM_SYNC MSB LSB MSB MSB LSB MSB PCM_OUT PCM_IN Figure 17: Primary Mode Timing 125us 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_OUT PCM_IN Figure 18: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 10: Pin Definition of PCM and I2C Interfaces Pin Name Pin No.
LTE-A Module Series EM12-G Hardware Design PCM_SYNC 28 IO PCM data frame synchronization signal 1.8V power domain. 1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open. PCM_CLK 20 IO PCM data bit clock I2C_SCL 58 DO I2C serial clock I2C_SDA 56 IO I2C serial data Used for external codec. Require an external pull-up to 1.8V.
LTE-A Module Series EM12-G Hardware Design Table 11: List of Control and Indicator Signals Pin No. NOTE Pin Name I/O Power Domain Description It is an open collector and active low signal. It is used to indicate the RF status of the module. A signal to wake up the host. It is an open collector and active low signal. 10 WWAN_LED# OD 3.3V 23 WAKE_ON_WAN# OD 1.8V 8 W_DISABLE1# DI 1.8V/3.3V Airplane mode control. Active low. 26 W_DISABLE2#* DI 1.8V/3.3V GNSS enable control. Active low.
LTE-A Module Series EM12-G Hardware Design 3.10.2. WWAN_LED# Signal The WWAN_LED# signal is used to indicate the RF status of the module, and its typical current consumption is up to 40mA. In order to reduce the current consumption of the LED, a resistor must be placed in series with the LED, as illustrated in the figure below. The LED is ON when the WWAN_LED# signal is at a low voltage level.
LTE-A Module Series EM12-G Hardware Design High (external pull-up) 1s Low Wake up the host Figure 21: WAKE_ON_WAN# Behavior VCC from the Host Host Module 10K WAKE_ON_WAN# Figure 22: WAKE_ON_WAN# Signal Reference Circuit Design 3.10.4. DPR Signal EM12-G provides a DPR (Dynamic Power Reduction) signal for body SAR (Specific Absorption Rate) detection.
LTE-A Module Series EM12-G Hardware Design 3.11. Tunable Antenna Control Interface* ANTCTL[0:3] signals are used for tunable antenna control and should be routed to an appropriate antenna control circuitry. More details about the interface will be added in the future version of the document. Table 16: Pin Definition of Tunable Antenna Control Interface* Pin Name Pin No. I/O Description Comment ANTCTL0* 59 DO Tunable antenna control 1.8V power domain ANTCTL1* 61 DO Tunable antenna control 1.
LTE-A Module Series EM12-G Hardware Design Table 18: List of Configuration Pins Config_0 (Pin 21) Config_1 (Pin 69) Config_2 (Pin 75) Config_3 (Pin 1) Module Type and Main Host Interface Port Configuration GND GND NC NC WWAN-USB 3.
LTE-A Module Series EM12-G Hardware Design 4 GNSS Receiver 4.1. General Description EM12-G includes a fully integrated global navigation satellite system solution that supports Gen9C-Lite of Qualcomm (GPS, GLONASS, BeiDou Galileo and QZSS). EM12-G supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EM12-G GNSS engine is switched off. It has to be switched on via AT command.
LTE-A Module Series EM12-G Hardware Design 5 Antenna Interfaces EM12-G provides a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The antenna ports have an impedance of 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces The main/Rx-diversity/GNSS antenna interfaces are shown as below.
LTE-A Module Series EM12-G Hardware Design 5.1.1.
LTE-A Module Series EM12-G Hardware Design LTE B20 832~862 791~821 MHz LTE B21 1447.9~1462.9 1495.9~1510.9 MHz LTE B25 1850~1915 1930~1995 MHz LTE B26 814~849 859~894 MHz LTE B28 703~748 758~803 MHz 717~728 MHz 2350~2360 MHz 1452~1496 MHz / LTE B29 LTE B30 2305~2315 / LTE B32 LTE B38 2570~2620 2570~2620 MHz LTE B39 1880~1920 1880~1920 MHz LTE B40 2300~2400 2300~2400 MHz LTE B41 2496~2690 2496~2690 MHz LTE B66 1710~1780 2110~2200 MHz 5.2.
LTE-A Module Series EM12-G Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 21: Antenna Requirements Type Requirements GNSS 1) Frequency range: 1559MHz ~ 1609MHz Polarization: RHCP or linear VSWR: < 2 (Typ.
LTE-A Module Series EM12-G Hardware Design Figure 24: EM12-G RF Connector Dimensions (Unit: mm) Table 22: Major Specifications of the RF Connector Item Specification Nominal Frequency Range DC to 6GHz Nominal Impedance 50Ω Temperature Rating -40°C to +85°C Voltage Standing Wave Ratio (VSWR) Meet the requirements of: Max 1.3 (DC~3GHz) Max 1.45 (3GHz~6GHz) The receptacle RF connector used in conjunction with EM12-G will accept two types of mating plugs that will meet a maximum height of 1.
LTE-A Module Series EM12-G Hardware Design Figure 25: Specifications of Mating Plugs Using Ø0.81mm Coaxial Cables The following figure illustrates the connection between the receptacle RF connector on EM12-G and the mating plug using a Ø0.81mm coaxial cable. Figure 26: Connection between RF Connector and Mating Plug Using Ø0.81mm Coaxial Cable The following figure illustrates the connection between the receptacle RF connector on EM12-G and the mating plug using a Ø1.13mm coaxial cable.
LTE-A Module Series EM12-G Hardware Design Figure 27: Connection between RF Connector and Mating Plug Using Ø1.
LTE-A Module Series EM12-G Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 23: Absolute Maximum Ratings Parameter Min. Max. Unit VCC -0.3 4.7 V Voltage at Digital Pins -0.3 2.3 V 6.2. Power Supply Requirements The typical input voltage of EM12-G is 3.7V, as specified by PCIe M.2 Electromechanical Spec Rev1.0.
LTE-A Module Series EM12-G Hardware Design 6.3. I/O Requirements Table 25: I/O Requirements Parameter Description Min. Max. Unit VIH Input high voltage 0.7 × VDD18 1) VDD18+0.3 V VIL Input low voltage -0.3 0.3 × VDD18 V VOH Output high voltage VDD18-0.5 VDD18 V VOL Output low voltage 0 0.4 V NOTE 1) V DD18 refers to I/O power domain. 6.4. Operation and Storage Temperatures Table 26: Operation and Storage Temperatures Parameter Min. Typ. Max.
LTE-A Module Series EM12-G Hardware Design 6.5. Current Consumption(TBD) 6.6. RF Output Power The following table shows the RF output power of EM12-G module. Table 27: RF Output Power Frequency Max. Min. WCDMA bands 24dBm+1/-3dB <-50dBm LTE- FDD bands 23dBm±2dB <-40dBm LTE-TDD bands 23dBm±2dB <-40dBm 6.7. RF Receiving Sensitivity The following tables show conducted RF receiving sensitivity of EM12-G module.
LTE-A Module Series EM12-G Hardware Design LTE-FDD B2 (10M) -97.5 -97.0 -99.5dbm -94.3dBm LTE-FDD B3 (10M) -97.0 -96.5 -99.0dbm -93.3dBm LTE-FDD B4 (10M) -97.0 -96.0 -99.0dBm -96.3dBm LTE-FDD B5 (10M) -98.5 -98.5 -100.5dBm -94.3dBm LTE-FDD B7 (10M) -96.5 -96.0 -98.5dBm -94.3dBm LTE-FDD B8 (10M) -98.0 -98.0 -101.5dBm -93.3dBm LTE-FDD B9(10M) -97.5 -97.5 -100.0dBm -95.3dBm LTE-FDD B12 (10M) -98.5 -99.0 -101.5dBm -93.3dBm LTE-FDD B13 (10M) -99.0 -99.0 -101.0dBm -93.
LTE-A Module Series EM12-G Hardware Design LTE-TDD B66 (10M) -97.0 -96.0 -99.0dBm -95.8dBm NOTES 1. 1) SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple (two for EM12-G) antennas at the receiver side, which can improve Rx performance. 2. 2) Per 3GPP specification. 6.8. ESD Characteristics The module is not protected against electrostatic discharge (ESD) in general.
LTE-A Module Series EM12-G Hardware Design Figure 28: Thermal Dissipation Area on Bottom Side of Module (Top View) There are some other measures to enhance heat dissipation performance: Add ground vias as many as possible on PCB. Maximize airflow over/around the module. Place the module away from other heating sources. Module mounting holes must be used to attach (ground) the device to the main PCB ground.
LTE-A Module Series EM12-G Hardware Design 7 Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM12-G module. All dimensions are measured in mm, and the tolerances for dimensions without tolerance values are ±0.05mm. 7.1.
LTE-A Module Series EM12-G Hardware Design 7.2. Standard Dimensions of M.2 PCI Express The following figure shows the standard dimensions of M.2 PCI Express. Please refer to document [4] for detailed A and B. Figure 30: Standard Dimensions of M.2 Type 3042-S3 (Unit: mm) According to M.2 nomenclature, EM12-G is Type 3042-S3-B (30.0mm × 42.0mm, max component height on the top is 1.5mm and single-sided, key ID is B). Figure 31: M.
LTE-A Module Series EM12-G Hardware Design 7.3. Design Effect Drawings of the Module Figure 32: Top View of the Module NOTE These are design effect drawings of EM12-G module. For more accurate pictures, please refer to the module that you get from Quectel. 7.4. M.2 Connector EM12-G adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in the document [4]. 7.5. Barcode Rule The PN (Q1-A2449) printed on the label is fixed for Quectel.
LTE-A Module Series EM12-G Hardware Design four digits indicate the day, month and year when the module is manufactured. For instance, “18FD” means 13th June, 2018. The next two digits indicate serial number of the manufacturing order. The last six digits vary by module which could not be the same in certain time. Meanwhile, the SN and IMEI can be checked by scanning the QR code. 7.6. Packaging EM12-G modules are packaged in trays. The following figure shows the tray size.
LTE-A Module Series EM12-G Hardware Design Figure 34: Tray Packaging Procedure EM12-G_Hardware_Design 60 / 62
LTE-A Module Series EM12-G Hardware Design 8 Appendix References Table 30: Related Documents SN Document Name Remark [1] Quectel_M.2_EVB_User_Guide M.2 EVB User Guide [2] Quectel_EP06&EG06&EM06_AT_Commands_Manual EP06, EG06 and EM06 AT Commands Manual [3] Quectel_EP06&EG06&EM06_GNSS_AT_Commands_ Manual EP06, EG06 and EM06 GNSS AT Commands Manual [4] PCI Express M.
LTE-A Module Series EM12-G Hardware Design HSUPA High Speed Uplink Packet Access kbps Kilo Bits Per Second LED Light Emitting Diode LTE Long Term Evolution Mbps Million Bits Per Second ME Mobile Equipment (Module) MIMO Multiple-Input Multiple-Output MLCC Multiplayer Ceramic Chip Capacitor MMS Multimedia Messaging Service MO Mobile Originated MT Mobile Terminated PDU Protocol Data Unit PPP Point-to-Point Protocol RF Radio Frequency Rx Receive SAR Specific Absorption Rate SMS
