Dell EMC PowerEdge R750 Technical Specifications Regulatory Model: E70S Series Regulatory Type: E70S001 December 2021 Rev.
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Contents Chapter 1: Technical specifications............................................................................................... 4 Chassis dimensions............................................................................................................................................................. 5 Chassis weight.....................................................................................................................................................................
1 Technical specifications The technical and environmental specifications of your system are outlined in this section.
Chassis dimensions Figure 1. Chassis dimensions Table 1. Chassis dimension for the system Drives Xa Xb Y 0/8/12/16/24 drives 482.0 mm (18.97 inches) 434.0 mm (17.0 86.8 mm (3.41 inches) inches) Za Zb Zc 35.84 mm (1.41 inches) with bezel 22.0 mm (0.86 inches) without bezel 700.7 mm (27.58 inches) Ear to rear wall 736.29 mm (28.92 inches) Ear to PSU handle NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside. Chassis weight Table 2.
Table 2. Chassis weight (continued) System configuration Maximum weight (with all drives/SSDs) 16 x 2.5-inch 32.6 kg (71.87 lb) 24 x 2.5-inch 35.2 kg (77.60 lb) Processor specifications Table 3. Dell EMC PowerEdge R750 processor specifications Supported processor Number of processors supported 3 rd Generation Intel Xeon Scalable processors with up to 40 cores two PSU specifications The system supports up to two AC or DC power supply units (PSUs).
Table 4. PSU specifications for the system (continued) Peak power N/A N/A Peak power N/A High line/-72 VDC High line/-72 VDC High line/ 240 VDC Low line/-40 VDC Low line/-40 VDC Current PSU Class Heat dissipat ion (maxim um) 2400 W AC Platinu m 9213 BTU/hr 50/60 Hz 100 240 V 4080 W 2400 W 2400 W 2380 W 1400 W 16 - 13.5 A 2400 W Mixed Mode N/A 9213 BTU/hr N/A 240 V 2380 W 1400 W 1400 W 1785 W 1050 W 11.
Table 5. Cooling fan specifications Fan type Abbreviation Also known as Label color Standard fan STD STD No label HPR Silver HighHPR SLVR performanc e fan (Silver grade) fan Label image NOTE: New cooling fans come with the High-Performance Silver Grade label. While the older cooling fans have the High-Performance label. Figure 2. High performance fan Figure 3.
Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known as Label color Highperformanc e fan (Gold grade) fan HPR GOLD VHPR - Very High Performance Gold Label image NOTE: New cooling fans come with the High-Performance Gold Grade label. While the older cooling fans have the High-Performance label. Figure 4. Very high performance fan Figure 5. High performance (Gold grade) fan NOTE: Mixing of STD, HPR SLVR, or HPR GOLD fan is not supported.
Table 6.
Table 7.
● 0 drive NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.com/support Browse all Products > Data Center Infrastructure > Storage Adapters & Controllers > Dell PowerEdge Express Flash NVMe PCIe SSD > Documentation > Manuals and Documents. Ports and connectors specifications USB ports specifications Table 10. USB specifications Front USB port type Rear No. of ports USB port type Internal (Optional) No.
IDSDM (optional) The Dell EMC PowerEdge R750 system supports Internal Dual SD module (IDSDM). The IDSDM supports two SD cards and is available in the following configurations: Table 12. Supported SD card storage capacity IDSDM card ● 16 GB ● 32 GB ● 64 GB NOTE: One IDSDM card slot is dedicated for redundancy. NOTE: Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.
Table 15. Operational climatic range category A3 Temperature Specifications Allowable continuous operations Temperature ranges for altitudes < 900 m (< 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft) Table 16.
Thermal restriction matrix Table 20. Label reference Label Description STD Standard HPR High performance HSK Heat sink LP Low profile FH Full height DW Double Wide BPS Intel Persistent Memory 200 series (BPS) DPC DIMM per channel Table 21. Processor and heat sink matrix Heat sink Processor TDP 1U STD HSK ≤ 165 W (for non-GPU) T-Type HSK For all TDP with GPU, and 256 GB LRDIMM configurations 2U HPR HSK >165 W (for non-GPU configurations) Table 22.
Table 22. Thermal restriction matrix with ≤64 GB RDIMM (Non-GPU) (continued) Configuratio 8 x 2.5-inch 16 x n NVMe and No 2.5Backplane inch SAS / SAT A Rear storage No Rear Drives 16 x 2.5inch NVMe No No Rear Rear Driv Drives es 24 x 2.5-inch SAS/ SATA 16 x 2.5inch SAS + 8x 2.5inch NVMe 24 x 2.5inch NVMe 12 x 3.5-inch SAS/ SATA No Rear Drive s No Rear Drives No Rear Drives No 2x Rear Rear2 Drives .5inch, no rear fan 2x Rear 2.5inch, no rear fan 4x Rear 2.
Table 23. Thermal restriction matrix with 128 GB LRDIMM (Non-GPU) Configurati on 8 x 2.5-inch NVMe and No Backplane 16 x 2.5inch SAS/ SATA Rear storage No Rear Drives No No No Rear Rear Rear Drives Drives Driv es CPU TDP/ cTDP 16 x 24 x 2.5-inch SAS/ 2.5SATA inch NVMe 2x Rear 2.5inch, no rear fan 4x Rear 2.5inch with fan 16 x 2.5inch SAS + 8x 2.5inch NVMe 24 x 2.4inch NVMe 12 x 3.5-inch SAS/ SATA No Rear Drives No Rear Drive No 2x Rear Rear2 Drives .
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact. Table 24. Thermal restriction matrix with 256 GB LRDIMM (Non-GPU) Configurati on 8 x 2.5-inch NVMe and No Backplane 16 x 2.5inch SAS/ SATA 16 x 24 x 2.5-inch SAS/ 2.5SATA inch NVMe 16 x 2.5inch SAS + 8x 2.5inch NVMe 24 x 2.5inch NVMe 12 x 3.
NOTE: For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations. NOTE: For CPU TDP >165 W and riser configuration 1, 2, 3, or 4 supports maximum of four PCIe cards in Riser 1 or 2. This restriction is applicable for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA and 16 x 2.5-inch NVMe system configurations. NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact. Table 25.
Table 25. Thermal restriction matrix with BPS + ≤128 GB DIMM (Non-GPU) (continued) Configuratio 8 x 2.5-inch n NVMe and No Backplane 16 x 2.5inch SAS/ SATA Rear storage No No No Rear Rear Rear Drives Drives Drive s No Rear Drives 16 x 24 x 2.5-inch SAS/ 2.5SATA inch NVMe 2x Rear 2.5inch, no rear fan 4x Rear 2.5inch with fan 16 x 2.5inch SAS + 8x 2.5inch NVMe 24 x 2.5inch NVMe 12 x 3.5-inch SAS/ SATA No Rear Drives No Rear Drives No 2x Rear Rear Drives 2.
Table 26. Thermal restriction matrix with BPS + 256 GB LRDIMM(Non-GPU) (continued) Configurati on 8 x 2.5-inch NVMe and No Backplane 16 x 2.5inch SAS/ SATA 16 x 24 x 2.5-inch SAS/ 2.5SATA inch NVMe Rear storage No Rear Drives No No No Rear Rear Rear Drives Drives Drive s 2x Rear 2.5inch, no rear fan 4x Rear 2.5inch with fan 16 x 2.5inch SAS + 8x 2.5inch NVMe 24 x 2.5inch NVMe 12 x 3.5-inch SAS/ SATA No Rear Drives No Rear Drives No 2x Rear Rear Drives 2.
Table 27. Thermal restriction with ≤128 GB DIMM (GPU) (continued) GPU (Ambient temperature) Configurat ion (Front storage) Fan type CPU TDP/ cTDP A100 (80G) A100 A40 (max 2) A30 A10 M10 (max 2) T4 (max 6) 16 x 2.5inch SAS + 8 x 2.5inch NVMe HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C 24 x 2.5inch NVMe HPR GOLD fan 270 W 30°C 35°C 30°C 30°C 35°C 35°C 30°C NOTE: GPU cards are not supported in 12 x 3.5-inch drive and rear drive configuration systems.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact. Other restrictions for air cooling configurations ● ● ● ● ● ● Kioxia CM6/CD6 NVMeSSD are not supported on rear drive module. Samsung 1733v2/1735v2 NVMeSSD are not supported on 12 x 3.5-inch rear drive module. ICX XCC Platinum 8368Q 270W-38C CPU in air cooling system is not supported. 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable.
Table 29. Thermal restriction matrix for liquid cooling systems (continued) Configuration 8 x 2.516 x 2.5inch inch SAS/ NVMe and SATA No Backplane 16 x 2.524 x 2.516 x 2.5-inch + 24 x 2.5inch NVMe inch SAS/ 8 x 2.5-inch inch NVMe SATA NVMe 12 x 3.
Table 30. Restrictions with shroud, heat sink, and riser cage (continued) PCIe card type Form factor Fan Processor heat sink Shroud Riser cage long Non-GPU FL short long HL 1U-STD or 2U-HPR STD shroud short Thermal air restrictions ASHRAE A3 environment for air cooling configuration ● ● ● ● ● ● ● ● ● ● ● Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced. PCIe SSD is not supported. BPS, 128 GB or greater capacity DIMMs are not supported.
ASHRAE A4 environment for liquid cooling configuration ● ● ● ● ● ● ● ● ● Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced. PCIe SSD is not supported. BPS, 128 GB or greater capacity DIMMs are not supported. GPU and FPGA are not supported. Front storage is not supported in 12x3.5-inch SAS configuration. Rear drives are not supported. BOSS 1.5 is not supported. OCP 3.0 card is supported with 85°C active optic cable and cards tier ≤4.
