Product Data Sheet / Brochure

Thermal restriction matrix
Table 20. Label reference
Label Description
STD Standard
HPR High performance
HSK Heat sink
LP Low profile
FH Full height
DW Double Wide
BPS Intel Persistent Memory 200 series (BPS)
DPC DIMM per channel
Table 21. Processor and heat sink matrix
Heat sink Processor TDP
1U STD HSK ≤ 165 W (for non-GPU)
T-Type HSK For all TDP with GPU, and 256 GB LRDIMM configurations
2U HPR HSK >165 W (for non-GPU configurations)
Table 22. Thermal restriction matrix with ≤64 GB RDIMM (Non-GPU)
Configuratio
n
8 x 2.5-inch
NVMe and No
Backplane
16 x
2.5-
inch
SAS
/
SAT
A
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear
storage
No Rear
Drives
No
Rear
Driv
es
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear2
.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
CPU
TDP/
cTDP
105
W
STD fan HPR SLVR fan STD fan
HPR
GOLD
fan
HPR SLVR fan
HPR
SLVR
fan
35°C
120
W
35°C
125
W
35°C
135
W
35°C
140
W
35°C
150
W
35°C
165
W
35°C
Technical specifications 15