Product Data Sheet / Brochure

NOTE: For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch
configurations.
NOTE: For CPU TDP >165 W and riser configuration 1, 2, 3, or 4 supports maximum of four PCIe cards in Riser 1 or 2. This
restriction is applicable for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA and 16 x 2.5-inch NVMe system configurations.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without
thermal impact.
Table 25. Thermal restriction matrix with BPS + ≤128 GB DIMM (Non-GPU)
Configuratio
n
8 x 2.5-inch
NVMe and
No
Backplane
16 x
2.5-
inch
SAS/
SATA
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear
storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
CPU
TDP/
cTDP
105
W
HPR GOLD fan Not supported
35°C
120
W
35°C
125
W
35°C
135
W
35°C
140
W
35°C
150
W
35°C
165
W
35°C
185
W
30°C
195
W
35°C
205
W
35°C
225
W
35°C
230
W
35°C
235
W
35°C
240
W
35°C
250
W
35°C
Technical specifications 19