Product Data Sheet / Brochure
Table Of Contents
- Dell EMC PowerEdge R750 Technical Specifications
- Contents
- Technical specifications
- Chassis dimensions
- Chassis weight
- Processor specifications
- PSU specifications
- Supported operating systems
- Cooling fan specifications
- System battery specifications
- Expansion card riser specifications
- Memory specifications
- Storage controller specifications
- Drive specifications
- Ports and connectors specifications
- Video specifications
- Environmental specifications
ASHRAE A4 environment for liquid cooling configuration
● Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
● PCIe SSD is not supported.
● BPS, 128 GB or greater capacity DIMMs are not supported.
● GPU and FPGA are not supported.
● Front storage is not supported in 12x3.5-inch SAS configuration.
● Rear drives are not supported.
● BOSS 1.5 is not supported.
● OCP 3.0 card is supported with 85°C active optic cable and cards tier ≤4.
● Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous
contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of
the customer.
Table 31. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE: The ISO Class 8 condition applies to data center
environments only. This air filtration requirement does not apply
to IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.
Table 32. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.
26 Technical specifications