User Manual
Table Of Contents
- Dell EMC PowerEdge T40 Installation and Service Manual
- Contents
- About this document
- PowerEdge T40 system overview
- Initial system setup and configuration
- Pre-operating system management applications
- Installing and removing system components
- Safety instructions
- Before working inside your system
- After working inside your system
- Recommended tools
- System cover
- Front bezel
- Hard drives
- PSU assembly
- Power supply unit
- Expansion cards
- Memory module
- System battery
- Optical drive
- Speaker
- System fan
- Intrusion switch
- Processor and heatsink
- System board
- Control panel
- Power button module
- Jumpers and connectors
- Technical specifications
- Chassis dimensions
- System weight
- Processor specifications
- Supported operating systems
- PSU specifications
- System fan specifications
- System battery specifications
- Expansion card specifications
- Memory specifications
- Storage controller specifications
- Drive specifications
- Ports and connectors specifications
- Video specifications
- Environmental specifications
- System diagnostics and indicator codes
- Getting help
- Documentation resources
Table 35. Maximum altitude specifications (continued)
Maximum altitude Specifications
Storage 12,000 m (39,370 ft)
Table 36. Operating temperature derating specifications
Operating temperature derating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft), above 900
m (2,953 ft).
Thermal restriction matrix
Table 37. Thermal restrictions matrix
Ambient 25°C 30°C 35°C
Processor No restriction No restriction No restriction
DIMM No restriction No restriction No restriction
Drive
Limited to entry drives with power less than 6.8W
Or
No restriction to 1 / 2 TB 7200 rpm and 4 TB 5400 rpm
NOTE: The PowerEdge T40 does not support enterprise-class drives.
Card
Limited to Tier 2 PCIe cards
Or
PCIe cards do not require system level cooling assistance up to a local ambient temperature of
55°C
Particulate and gaseous contamination specifications
Table 38. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper
confidence limit.
NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 39. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
86 Technical specifications