Reference Guide

System Building Blocks
7 Dell EMC Ready Solutions for HPC Digital Manufacturing with AMD EPYC™ Processors—ANSYS®
Performance
Table 1 Recommended Configurations for the Compute Building Block
Platforms
Dell EMC PowerEdge R6525
Dell EMC PowerEdge C6525
Processor
Options
Dual AMD EPYC 7402 (24 cores per socket)
Dual AMD EPYC 7452 (32 cores per socket)
Dual AMD EPYC 7502 (32 cores per socket)
Dual AMD EPYC 7552 (48 cores per socket)
Dual AMD EPYC 7702 (64 cores per socket)
Memory
Options
256 GB (16 x 16GB 3200 MTps DIMMs)
512 GB (16 x 32GB 3200 MTps DIMMs)
Local Storage
1 x 480GB Mixed Use SATA SSD
iDRAC
iDRAC9 Enterprise (R6525)
iDRAC9 Express (C6525)
Power Supplies
2 x 800W PSU (R6525)
2 x 2400W PSU (C6525)
Networking
Mellanox® ConnectX®-6 InfiniBand™ adapter
2.3 Basic Building Blocks
Basic Building Block (BBB) servers are selected by customers to create simple but powerful HPC systems.
These servers are appropriate for smaller HPC systems where reducing the management complexity of the
HPC system is important. The BBB is based on the dual socket Dell EMC PowerEdge R6525 server.
The recommended configuration for BBB servers is:
• Dell EMC PowerEdge R6525 server
• Dual AMD EPYC 7502 32-Core processors
• 256 GB of RAM (16 x 16GB 3200 MTps DIMMS)
• PERC H745 RAID controller
• 2 x 240GB Read-Intensive SATA SSD RAID 1 (OS)
• 4 x 480GB Mixed Use SATA SSD RAID 0 (scratch)
• Dell EMC iDRAC9 Enterprise
• 2 x 800W Power Supplies
• Mellanox ConnectX-6 InfiniBand Adapter (optional)
• Mellanox ConnectX-5 25 GbE Adapter (optional)
The R6525 platform is used to provide configuration flexibility and good compute power per server. Each
server can contain up to two AMD EPYC processors. The AMD EPYC 7502 processor is a 32-core CPU with
a base frequency of 2.5 GHz and a max boost frequency of 3.35 GHz. As configured, a BBB contains 64
cores, a natural number for many CAE simulations. A memory configuration of 16 x 16GB DIMMs is used to
provide balanced performance and capacity. While 256GB is typically sufficient for most CAE workloads,
customers expecting to handle larger production jobs should consider increasing the memory capacity to
512GB. Various CAE applications, such as implicit FEA, often have large file system I/O requirements and
four mixed use SATA SSD’s in RAID 0 are used to provide fast local I/O.