Owners Manual
Table Of Contents
- PowerVault NX3340 Network Attached Storage System Installation and Service Manual
- Contents
- NX3340 system product overview
- Technical specifications
- Initial system setup and configuration
- Pre-operating system management applications
- Options to manage the pre-operating system applications
- System Setup
- Viewing System Setup
- System Setup details
- System BIOS
- Viewing System BIOS
- System BIOS Settings details
- System Information
- Viewing System Information
- System Information details
- Memory Settings
- Viewing Memory Settings
- Memory Settings details
- Processor Settings
- Viewing Processor Settings
- Processor Settings details
- SATA Settings
- Viewing SATA Settings
- SATA Settings details
- Boot Settings
- Viewing Boot Settings
- Boot Settings details
- Choosing system boot mode
- Changing boot order
- Integrated Devices
- Viewing Integrated Devices
- Integrated Devices details
- Serial Communication
- Viewing Serial Communication
- Serial Communication details
- System Profile Settings
- Viewing System Profile Settings
- System Profile Settings details
- System Security
- Viewing System Security
- System Security Settings details
- Creating a system and setup password
- Using your system password to secure your system
- Deleting or changing system and setup password
- Operating with setup password enabled
- Miscellaneous Settings
- Viewing Miscellaneous Settings
- Miscellaneous Settings details
- iDRAC Settings utility
- Device Settings
- Dell Lifecycle Controller
- Boot Manager
- PXE boot
- Diagnostics and indicators
- Jumpers and connectors
- Installing and removing system components
- Safety instructions
- Before working inside your system
- After working inside your system
- Recommended tools
- Front bezel
- System cover
- Backplane cover
- Inside the system
- Air shroud
- Cooling fans
- System memory
- Processors and heat sinks
- Expansion cards and expansion card risers
- Network daughter card
- Integrated storage controller card
- Hard drives
- Drive backplane
- System battery
- USB module
- Optional internal USB memory key
- Optical drive—optional
- Power supply units
- System board
- Trusted Platform Module
- Control panel
- Getting help
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD
panel and in the System Event Log.
Expanded operating temperature restrictions
● Do not perform a cold startup below 5°C.
● The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
● 150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not supported.
● Redundant power supply unit is required.
●
Non-Dell EMC qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
● PCIe SSD is not supported.
● Tape backup unit is not supported.
Particulate and gaseous contamination specifications
This section defines the limitations that help avoid any equipment damage or failure from particulate and gaseous contamination.
If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you
may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper
confidence limit.
NOTE: The ISO Class 8 condition applies to data center environments only. This air
filtration requirement does not apply to IT equipment designed to be used outside a
data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent point less than 60%
relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 4. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Technical specifications 19