Service Manual

Table 78. Particulate contamination specifications
Particulate contamination Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.
NOTE: Air filtering can also be accomplished by filtering
room air with MERV8 filter per ANSI/ASHARE Standard
127.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles.
Corrosive dust ● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 79. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 80. Thermal restriction matrix for processor and fans
Configuration 8 x 2.5-inch
Processor TDP Processor cTDP Max
120 W 150 W STD fan
STD heat sink
155 W 180 W STD fan
STD heat sink
180 W 200 W STD fan
HPR heat sink
Technical specifications 137