Service Manual

Table 80. Thermal restriction matrix for processor and fans (continued)
Configuration 8 x 2.5-inch
Processor TDP Processor cTDP Max
200 W 200 W STD fan
HPR heat sink
225 W 240 W HPR fan
HPR heat sink
280 W 280 W HPR fan
HPR HSK with DIMM Blank
NOTE: To ensure proper cooling in the system with 280 W processor, memory module blank should be installed in the
memory sockets that are not populated.
NOTE: For 280 W processor, maximum supported ambient temperature is 30°C.
Table 81. Thermal restriction matrix for T4 GPGPU
Riser configurations Configuration type and ambient temperature support
8 x 2.5-inch drives
2 LP
Ambient = 30°C
Slot 2 HPR fan
Slot 3 HPR fan
Table 82. Label reference
Label Description
STD Standard
HPR High performance
HSK Heat sink
LP Low profile
Thermal restriction for ASHRAE A3/Fresh air environment
NOTE: XC Core XC6515 does not support.
● Processor TDP equal or greater than 180 W are not supported.
● 128 GB or greater capacity LRDIMMs are not supported.
● Redundant power supply configuration is required, but PSU failure is not supported
● Non-Dell qualified peripheral cards greater than 25 W are not supported.
● GPU card is not supported.
● PCIe SSD is not supported.
Other thermal restrictions
1. SolarFlare, Mellanox CX4/CX5/CX6, P4800 AIC can only support up to 35°C ambient.
2. HPR fan is required with 128 GB LRDIMM.
3. T4 GPGPU is not supported with 128 GB LRDIMM.
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Technical specifications