Owners Manual

● 150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not supported.
● Redundant power supply unit is required.
● Non-Dell EMC qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
● PCIe SSD is not supported.
● Mid hard drive tray is not supported.
● Rear storage devices or drives are not supported.
● GPU is not supported.
● Tape backup unit is not supported.
Thermal restrictions
Following table lists the configuration required for efficient cooling.
Table 30. Thermal restrictions configuration
Configuration Number
of
processo
rs
Heatsink Processor/DIMM
blank
DIMM
blanks
Type of air
shroud
Fan
XC740xd Series 1 One 1U standard heat sink
for CPU ≤ 125 W
Required Not
required
Standard Four standard
fans and one
blank to cover
two fan slots
One 2U standard heat sink
for CPU > 125 W
XC740xd Series 2 Two 1U standard heat sink
for CPU ≤ 125 W
Not required Not
required
Standard Six standard
fans
Two 2U standard heat
sink for CPU > 125 W
XC740xd Series
with mid bay
1 One 1U high performance
heat sink
Required Required Not required Six high
performance
fans
XC740xd Series
with mid bay
2 Two 1U high performance
heat sink
Not required Required Not required Six high
performance
fans
XC740xd
Serieswith GPU
2 Two 1U high performance
heat sink
Not required Not
required
GPU air shroud Six high
performance
fans
Ambient temperature limitations
The following table lists configurations that require ambient temperature less than 35°C.
NOTE:
The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which
may impact system performance.
Table 31. Configuration based ambient temperature restrictions
System Backplane CPU Thermal
Design Power
(TDP)
CPU heat sink Fan type GPU Ambient
restriction
XC740xd
Series
24 x 2.5 inch
SATA/NVMe with
adapter HBA330
150 W/8 core,
165 W/12 core,
200 W, 205 W
1U high
performance
High
performance
fan
≥1 double-
width/single-
width
30°C
Technical specifications 27