Technical Guide
Table Of Contents
- Dell EMC PowerEdge R350 Technical Guide
- Contents
- System overview
- System features and generational comparison
- Chassis views and features
- Processor
- Memory subsystem
- Storage
- Networking
- Expansion cards and expansion card risers
- Power, thermal, and acoustics
- Rack, rails, and cable management
- Supported operating systems
- Dell EMC OpenManage systems management
- Dell Technologies Services
- Dell EMC ProDeploy Enterprise Suite
- Dell EMC Data Migration Service
- Dell EMC ProSupport Enterprise Suite
- Dell EMC ProSupport Plus for Enterprise
- Dell EMC ProSupport for Enterprise
- Dell EMC ProSupport One for Data Center
- ProSupport for HPC
- Support Technologies
- Services for Data Security
- Dell Technologies Education Services
- Dell Technologies Consulting Services
- Dell EMC Managed Services
- Appendix A. Additional specifications
- Appendix B. Standards compliance
- Appendix C Additional resources
System overview
The Dell EMC™ PowerEdge™ R350 is Dell's latest 1-socket, 1U rack server that is designed to run complex workloads using
highly scalable memory, and network options. The system features the one Intel
®
Xeon Scalable Processor up to 4 DIMMs, PCI
Express
®
(PCIe) 4.0 enabled expansion cards.
Key capabilities:
● One Intel Xeon E-2300 series processors
● Four DDR4 DIMM slots
● Two redundant AC power supply units
● Up to 8 x 2.5-inch or 8 x 3.5 SAS/SATA drives
● Internal boot: IDSDM
● iDRAC9 with lifecycle controller, express, enterprise, datacenter, and OME advanced features
● Front access hot plug BOSS 2.0 (2 x M.2)
● Network 2 x 1 GbE LOM
● RAID: PERC 10.5 & 11 SW and HW RAID, and Internal PERC
● PCIe Gen 4 support (3 PCIe slots)
○ 1x8 Gen4 (x16 connector) low profile, half length
○ 1x8 Gen4 (x8 connector) low profile, half length
○ 1x8 Gen4 (x8 connector) for dedicated PERC only
Topics:
• Key workloads
• New technologies
Key workloads
PowerEdge R350 is versatile enough to address many customer segments and workloads affordably, that includes:
● SMB and ROBO: Data consolidation, file/print services, mail/messaging services, other collaboration and productivity
applications, point of sale and web serving.
New technologies
Table 1. New technologies
Technology Detailed Description
3rd Generation Intel
®
Xeon E-2300 series processors
● Core count: Up to 8 cores per processor
Memory
● 4 DDR4 DIMM slot, supports UDIMM 128 GB max, speeds
up to 3200 MT/s
● Supports registered ECC DDR4 DIMMs only
Flex IO
● Broadcom 5720 Dual port GbE x2
● USB 3.0 x1, USB 2.0 x2 and VGA port
● Serial port
CPLD Lattice LCMXO3LF-4300C
PCIe 3 x PCIe Gen4 slots
Chipset (CHPST) Intel C256 series chipset
1
6 System overview