Technical Specifications
Table Of Contents
- Dell EMC PowerEdge T350 Technical Specifications
- Contents
- Technical specifications
- Chassis dimensions
- System weight
- Processor specifications
- PSU specifications
- Cooling fan specifications
- Supported operating systems
- System battery specifications
- Expansion card riser specifications
- Memory specifications
- Storage controller specifications
- Drive specifications
- Ports and connectors specifications
- Video specifications
- Environmental specifications
Table 19. Particulate contamination specifications (continued)
Particulate contamination Specifications
NOTE: This condition applies to data center and non-data
center environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 20. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal air restrictions
● Two PSUs are required in redundant mode, however PSU failure is not supported.
● Non Dell qualified peripheral cards or peripheral cards greater than 25 W are not supported.
● GPU is not supported.
● The operating temperature is for a maximum altitude of 950 m for fresh air cooling.
● Because of single fan in the system, cooling redundancy is not supported.
NOTE: DIMM blank is not required.
Technical specifications 11