Dell® Latitude® XPi CD SERVICE MANUAL ®
Information in this manual is subject to change without notice. 1994–1996 Dell Computer Corporation. All rights reserved. Reproduction in any manner whatsoever without the written permission of Dell Computer Corporation is strictly forbidden.
Contents Chapter 1 System Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Physical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Indicator Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 Power/Suspend Indicator . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 3 Beep Codes and Error Messages . . . . . . . . . . . . . . . . . . 3-1 POST Beep Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 System Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Running the Dell Diagnostics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 Chapter 4 Removing and Replacing Parts . . . . . . . . . . . . . . . . . . . 4-1 Recommended Tools . . . .
I/O-Panel Dust Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-42 Advanced Port Replicator Connector Dust Cover . . . . . . . . . . . . . . . . . 4-43 Audio Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-44 Appendix A Factory Repair Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1 Recommended Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Index Figures Figure 1-1. Figure 1-2. Figure 1-3. Figure 4-1. Figure 4-2. Figure 4-3. Figure 4-4. Figure 4-5. Figure 4-6. Figure 4-7. Figure 4-8. Figure 4-9. Figure 4-10. Figure 4-11. Figure 4-12. Figure 4-13. Figure 4-14. Figure 4-15. Figure 4-16. Figure 4-17. Figure 4-18. Figure 4-19. Figure 4-20. Figure 4-21. Figure 4-22. Figure 4-23. Figure 4-24. Figure 4-25. Figure 4-26. Figure 4-27. Figure 4-28. Figure 4-29. Figure 4-30. Figure 4-31. Figure 4-32. viii Front View of the Notebook Computer. . . . . . .
Figure A-1. Figure A-2. Figure A-3. Figure A-4. Figure A-5. Figure A-6. Figure A-7. Figure A-8. Figure A-9. Figure A-10. Figure A-11. Exploded View—Display Assembly . . . . . . . . . . . . . . . . . . .A-12 Exploded View—Palmrest Assembly . . . . . . . . . . . . . . . . . .A-13 Exploded View—Bottom Case Assembly . . . . . . . . . . . . . . .A-14 Display-Assembly EMI Shield Removal. . . . . . . . . . . . . . . .A-17 System Board Assembly in the Bottom Case Assembly . . . .
Read This First A prerequisite for using this manual to service Dell portable computers is a basic knowledge of IBM®-compatible PCs and prior training in IBMcompatible PC troubleshooting techniques. In addition to information provided in this manual, Dell provides the Reference and Troubleshooting Guide for troubleshooting procedures and instructions on using the Dell diagnostics to test portable computers, and the online System User’s Guide for information about system setup and operations.
Chapter 1 System Overview The Dell ® Latitude® XPi CD is a lightweight, expandable portable computer that use the Intel® Pentium® microprocessor. This chapter provides an overview of the features and technical specifications of this computer. System Features In addition to the standard features found in a Dell portable computer, the Dell Latitude XPi CD models include the following new features: • • • • 64-bit-wide data bus. 60-MHz local bus and a 30-MHz PCI bus.
Physical Description display assembly display assembly latch LCD panel keyboard indicator panel trackball assembly microphone tilt-support foot (2) main battery assembly infrared port speaker bottom case assembly diskette drive CD-ROM drive Figure 1-1.
indicator panel hard-disk drive security cable slot I/O panel audio jacks (3) speaker infrared port PC Card slot Advanced Port Replicator connector power switch tilt-support foot DC power input connector Figure 1-2.
The portable computer has nine indicators: six on the display assembly’s indicator panel and three on the keyboard assembly. Each of the six indicators on the display assembly has an identical pair of LEDs: one is visible on the indicator panel when the display is open, and the other is visible through an aperture on the outside of the display assembly when the display is fully closed. The subsections that follow describe the functions of the indicators.
Keyboard Indicators The keyboard controls the operation of the numeric lock (Num Lock) indicator, the capitals lock (Caps Lock) indicator, and the Scroll Lock indicator, all of which are visible through apertures at the top of the keyboard. These indicators are associated with the key, the key, and the key; when lit, the LEDs indicate the active state of these keys. Controlling Computer Power The power button does not directly control power to the computer.
• If the computer is in suspend mode (the power/suspend indicator flashes every 8 seconds), if the display is closed, and if no external monitor is attached, sliding the power button has no effect on the power state. The computer remains in suspend mode. • If the computer is in suspend-to-disk mode, sliding the power button causes the computer to initiate the resume-from-disk operation. Interrupt Assignments Table 1-1.
Technical Specifications Table 1-2. Technical Specifications Microprocessor Microprocessor type . . . . . . . . . . . Intel Pentium microprocessor Microprocessor speed . . . . . . . . . . 150 MHz Bus architecture . . . . . . . . . . . . . . PCI Internal cache memory . . . . . . . . . 16 KB External cache memory. . . . . . . . . 256 KB pipelined-burst SRAM Math coprocessor . . . . . . . . . . . . . internal to the microprocessor Chip Set and Bus System chip set . . . . . . . . . . . . . . .
Table 1-2. Technical Specifications (Continued) Memory (Continued) Memory module type and capacities . . . . . . . . . . . . . . . . . . . 8- and 16-MB fast-page mode Standard RAM . . . . . . . . . . . . . . . 16 MB (EDO) on system board Maximum RAM . . . . . . . . . . . . . . 48 MB Memory access time: tRAC . . . . . . . . . . . . . . . . . . . 70 ns tCAC . . . . . . . . . . . . . . . . . . . 20 ns BIOS address . . . . . . . . . . . . . . . . F000:0000 Connectors Serial (DTE) . . . . . . . . .
Table 1-2. Technical Specifications (Continued) Audio (Continued) Interfaces: Internal . . . . . . . . . . . . . . . . . . ISA bus External . . . . . . . . . . . . . . . . . . stereo line-in minijack microphone-in minijack headphones/speakers-out minijack Speakers . . . . . . . . . . . . . . . . . . . . four 8-ohm speakers Internal speaker amplifier . . . . . . . 1 W into 8 ohms stereo Headphones amplifier . . . . . . . . . . 150 mW into 32 ohms stereo Controls. . . . . . . . . . . . . . . . . .
Table 1-2. Technical Specifications (Continued) Keyboard Number of keys . . . . . . . . . . . . . . 85 (U.S., Canada, Korea, Thailand, and locations that use traditional Chinese); 86 (Europe); 87 (Japan) Key travel . . . . . . . . . . . . . . . . . . . 3.0 ± 0.5 mm (0.12 ± 0.02 inch) Key spacing . . . . . . . . . . . . . . . . . 18.25 mm (0.72 inch) Layout. . . . . . . . . . . . . . . . . . . . . . QWERTY, AZERTY, Kanji Battery Type . . . . . . . . . . . . . . . . . . . . . . .
Table 1-2. Technical Specifications (Continued) Battery (Continued) NiCad reserve battery: Voltage . . . . . . . . . . . . . . . . . . Operating time (approximate) . . . . . . . . . . . . . 7.2 V 2 minutes (if computer is in battery swap mode); 40 days (if power is turned off) AC Adapter Input voltage . . . . . . . . . . . . . . . . . 90 to 135 VAC and 164 to 264 VAC Input current (maximum) . . . . . . . 1.2 A and 0.6 A Input frequency . . . . . . . . . . . . . . . 47 to 63 Hz Output current . . .
Table 1-2. Technical Specifications (Continued) CD-ROM Drive3 (Continued) Access time: Random . . . . . . . . . . . . . . . . . 250 m/sec Full-stroke . . . . . . . . . . . . . . . 550 m/sec Memory buffer . . . . . . . . . . . . . . . 128 KB Physical (Computer) Height . . . . . . . . . . . . . . . . . . . . . . 63.0 mm (2.48 inches) Width . . . . . . . . . . . . . . . . . . . . . . 280.9 mm (11.06 inches) Depth . . . . . . . . . . . . . . . . . . . . . . 233.5 mm (9.
Table 1-2. Technical Specifications (Continued) Environmental (Continued) Maximum shock:4 Operating . . . . . . . . . . . . . . . . 152.4 cm/sec (60 inches/sec) (less than or equal to a pulse width of 2 ms) Storage . . . . . . . . . . . . . . . . . . 203.2 cm/sec (80 inches/sec) (less than or equal to a pulse width of 2 ms) Altitude (maximum): 4 Operating . . . . . . . . . . . . . . . . 3048 m (10,000 ft) Storage . . . . . . . . . . . . . . . . . .
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Chapter 2 Initial Procedures T his chapter describes initial procedures that can help you diagnose a computer problem. These procedures can often reveal the source of a problem or indicate the correct starting point for troubleshooting the computer. Dell recommends that you perform these procedures in the order they are presented in this manual. Initial User Contact When you first contact a user who has a computer problem, ask the user to describe the problem and the conditions under which it occurs.
components, as instructed in the following procedures, see Chapter 4, “Removing and Replacing Parts.” CAUTION: Before you proceed with the visual inspection, ensure that the user has saved all open files and exited all open application programs if possible. To perform a visual inspection, follow these steps: 1. Turn off any attached peripherals. 2. Determine the present power state of the computer.
5. If the computer is operating from battery power, remove the main battery assembly, verify that it is free of any obvious physical damage, and then reinsert the battery assembly into its compartment. 6. Turn off the computer. Remove the hard-disk drive, verify that it is free of any obvious physical damage, and then reinsert the drive into its compartment. 7.
15. Turn on any attached peripherals and then the computer. Does the problem reoccur? Yes. Proceed to the next procedure, “Observing the Boot Routine.” No. No further steps are necessary. Observing the Boot Routine After you perform a visual inspection as described in the previous section, boot the computer from a diagnostics diskette and, while the boot routine is running, observe the computer for any indications of problems.
5. Observe the display for the Diagnostics Menu. Does the Diagnostics Menu display? Yes. See “Running the Dell Diagnostics” in Chapter 3. No. Proceed to step 6. 6. Insert another copy of the diagnostics diskette into the diskette drive, and reboot the computer. Does the Diagnostics Menu display? Yes. See “Running the Dell Diagnostics” in Chapter 3. No. Proceed to the next section, “Eliminating Resource Conflicts.
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Chapter 3 Beep Codes and Error Messages T his chapter describes beep codes and system error messages that can occur during computer start-up or, in the case of some failures, during normal computer operation. The tables in this chapter list faults that can cause a beep code or system error message to occur and the probable causes of the fault in each case.
Table 3-1.
Table 3-1.
Table 3-2. System Error Messages (Continued) Message Definition Probable Causes Decreasing available memory Informational message indicating memory is failing (usually preceded by memory error message). One or more DIMMs faulty or improperly seated. Disk C: failed initialization Hard-disk drive failed to initialize. Hard-disk drive data in System Setup does not match installed hard-disk drive, or hard-disk drive faulty. System files missing or corrupted.
Table 3-2. System Error Messages (Continued) Message Definition Probable Causes Extended memory Amount of memory size has changed recorded in NVRAM not matching memory installed in computer. One or more memory module(s) faulty or improperly seated. Computer cannot enable protective mode. One or more memory module(s) faulty or improperly seated. Gate A20 failure System board faulty. General failure Message indicates system failure. Operating system unable to carry out the command.
Table 3-2. System Error Messages (Continued) Message Definition Probable Causes Keyboard stuck key failure Keyboard key(s) jammed. For external keyboard or keypad, cable or connector loose or keyboard faulty. For built-in keyboard, keyboard faulty. For either keyboard, key may have been pressed while computer was booting. 3-6 Memory address line failure at address, read value expecting value Memory control logic not operating properly. Installed memory module faulty or improperly seated.
Table 3-2. System Error Messages (Continued) Message Definition Probable Causes Memory data line failure at address, read value expecting value Memory not operating properly. Installed memory module faulty or improperly seated. No boot device available Computer not recognizing diskette drive or hard-disk drive from which it is trying to boot. No boot device available. No boot sector on hard-disk drive No boot sector on harddisk drive. Operating system boot files missing or corrupted.
Table 3-2. System Error Messages (Continued) Message Definition Probable Causes Seek error MS-DOS unable to find specific track on diskette or hard-disk drive. Defective diskette or hard-disk drive. Shutdown failure Microprocessor unable to reset. System board faulty. Time-of-day System clock stopped. clock lost power Reserve battery lost its charge. Time-of-day clock stopped Time-of-day not set—please run the System Setup program. Time or date stored in RTC does not match system clock.
• Serial Ports — Tests the serial communication port • Parallel Ports — Tests the parallel communication port • SCSI Devices — Tests the SCSI controller in the Advanced Port Replicator • Network Interface — Tests the network controller in the Advanced Port Replicator • Serial Infrared — Tests the IrDA communications port • Audio — Tests the built-in sound subsystem CAUTION: To prevent possible damage to the original diagnostics diskette, always use a backup copy of the diagnostics diskette when servicing
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Chapter 4 Removing and Replacing Parts T his chapter provides instructions for removing and replacing fieldreplaceable components, assemblies, and subassemblies. For removal and replacement procedures for factory-replaceable parts, see Appendix A, “Factory Repair Parts.” Unless otherwise noted, each procedure in this chapter assumes the following: • The computer and any attached peripherals are turned off, and the peripherals are disconnected from the I/O panel on the back of the computer.
Recommended Tools Most of the procedures in this guide require the use of one or more of the following tools: • • • • • • • • Small flat-blade screwdriver Jeweler’s screwdriver set Number 1 magnetized Phillips-head screwdriver Number 2 magnetized Phillips-head screwdriver Chip-removal tool Wrist grounding strap Small plastic scribe Nut drivers Precautionary Measures WARNING: FOR YOUR PERSONAL SAFETY AND PROTECTION OF THE EQUIPMENT, PERFORM THE FOLLOWING STEPS IN THE SEQUENCE LISTED.
battery battery door Figure 4-2. Main Battery Assembly Removal Part or Assembly Name Order Name Main battery assembly CUS,BTRY,SAR,36WHR,LXP 4. To avoid possible damage to the computer from ESD, ground yourself by attaching a wrist grounding strap to yourself and an unpainted metal surface on the I/O panel. If a wrist grounding strap is not available, you can discharge static electricity from your body by periodically touching the unpainted metal surface of the I/O panel.
Screw Identification and Tightening A6 (35 mm) (screw A6 is 35 mm) 35 mm match length here Figure 4-3. Screw Identification CAUTION: It is essential that the correct length screw be used when reinstalling a screw. Otherwise, hardware damage could result. Make sure that the screw is properly aligned with its corresponding hole, and avoid overtightening. The removal procedure illustrations provide the correct screw length in parentheses next to the screw’s label.
ZIF Connectors movable part of connector; do not remove Figure 4-4. Disconnecting an Interface Cable Some of the computer’s interface connectors are zero insertion force (ZIF) connectors. These connectors are not removable, but they must be released to disconnect a cable from them. CAUTION: The ZIF connectors are fragile. To avoid damage, do not apply too much pressure to the movable part of the connector. To disconnect an interface cable from a ZIF connector, follow these steps: 1.
Field-Replaceable Parts and Assemblies display assembly trackball assembly palmrest assembly CD-ROM EMI clip keyboard keyboard EMI clip left tilt-support foot PC Card dust cover for the Advanced Port Replicator connector superpart assembly I/O panel dust cover right tilt-support foot hard-disk drive assembly main battery bottom case assembly memory compartment cover CD-ROM/diskette drive assembly Figure 4-5.
The following subsections provide instructions for removing and replacing these parts and assemblies. Some of the instructions are preceded by a table listing the Dell order name for the part or assembly being replaced. A more detailed breakdown of parts and assemblies can be found in Appendix A, “Factory Repair Parts.” Hard-Disk Drive Assembly front of computer hard-disk drive drive latch drive door PC Card slot Figure 4-6.
Memory Compartment Cover memory compartment cover Figure 4-7. Memory Compartment Cover Removal Part or Assembly Name Order Name Memory compartment cover CVR,MEM,LXPiCD To remove the memory compartment cover, follow these steps: CAUTION: Make sure the work surface is clean to prevent scratching the computer cover. 1. Turn the computer upside down on the work surface. 2.
Memory Modules memory module sockets Figure 4-8. Memory Module Removal Part or Assembly Name Order Name Memory module, 4-MB CUS,MEM,4M,LXP4D/T,LXPi Memory module, 8-MB CUS,MEM,8M,LXP4D/T,LXPi Memory module, 16-MB CUS,MEM,16M,LXP4D/T,LXPi To remove a memory module, follow these steps: 1. Remove the memory compartment cover. 2. To release a memory module from its socket, gently push outward on each of the memory module’s two metal retaining clips.
Palmrest Assembly The palmrest assembly consists of the trackball and the keyboard. display assembly keyboard palmrest assembly trackball assembly CD-ROM EMI clip trackball cable connector JTB connector JKB1 connector JKB2 bottom case assembly Figure 4-9. Palmrest Assembly Removal Part or Assembly Name Order Name Palmrest assembly with sound SVC,ASSY,PLMRST,LXPiCD To remove the palmrest assembly, follow these steps: 1. Remove any installed PC Card(s). 2.
4. Close the display assembly, and turn the computer upside down on a flat work surface. 5. Remove the three palmrest-assembly retaining screws A1, A2, and A3 (see Figure 4-10). A2 (35 mm) A3 (35 mm) A1 (35 mm) 35 mm Figure 4-10. Palmrest-Assembly Retaining Screws 6. Turn the computer right-side up on the work surface, and open the display assembly. NOTE: Remember to support the display assembly with a book or similar object so that the display assembly does not open beyond 180 degrees. 7.
To reseat the palmrest assembly on the bottom case assembly, set the palmrest assembly down, slightly forward of its original position, on top of the bottom case assembly. Then push down on all sides of the palmrest assembly while sliding the assembly toward the back of the computer. Ensure that the palmrest assembly is properly aligned and fully seated on the bottom case assembly and that all of the mounting tabs are fully engaged.
Trackball Assembly A5 (6 mm) trackball assembly A4 (6 mm) trackball cable palmrest assembly 6 mm Figure 4-11. Trackball Assembly Removal Part or Assembly Name Order Name Optical trackball assembly SVC,ASSY,TBALL/SWT,LXPi+ To remove the trackball assembly, follow these steps: 1. Remove the palmrest assembly. 2. Turn the palmrest assembly upside down on a flat work surface. 3. Remove screws A4 and A5. 4. Lift the trackball assembly out of the palmrest assembly.
Keyboard Assembly press palmrest assembly press keyboard trackball assembly Figure 4-12.
Part or Assembly Name Order Name Keyboard assembly, Swiss KYBD,86,SWI,ALPS,LXPi+ Keyboard assembly, Thailand KYBD,85,THAI,ALPS,LXPi+ Keyboard assembly, United Kingdom KYBD,84,UK,LXPi+ To remove the keyboard assembly, follow these steps: 1. Remove the palmrest assembly. 2. Press along the sides of the keyboard to release the keyboard from the palmrest assembly.
Display Assembly For removal procedures, the display assembly consists of the following: • • • • • • • • Tilt-support foot Display assembly bezel Display assembly latch and latch spring LCD panel LCD inverter board Hinge covers Display-assembly interface cable Microphone/switch assembly Tilt-Support Foot right tilt-support foot tab finger-access recess 10 mm cover foot retaining screw (10 mm) notch Figure 4-13.
To remove a tilt-support foot, follow these steps: 1. Close the display assembly. 2. With the foot set to its fully retracted position, insert a small device (such as a scribe) into the bottom notch on the foot-retaining screw cover and gently lift out the cover partway. Lift on the sides of the cover, working around to the top, and then lift out the cover. 3. Remove the foot retaining screw.
Display Assembly display assembly C1 (6 mm) C2 (6 mm) detent post left tilt-support foot connector JLCD connector JMIC right tilt-support foot 6 mm Figure 4-14. Display Assembly Removal Part or Assembly Name Order Name Display assembly ASSY,LCD,TFT,SVGA,12.1”, LXPiCD To remove the display assembly, follow these steps: 1. Remove the palmrest assembly. 2. Remove the computer’s tilt-support feet. 3. Remove interface-cable grounding screws C1 and C2 from the display assembly.
4. Disconnect the display-assembly interface cable from connector JLCD on the system board. To disconnect the cable, grasp the pull tab and pull it straight up from the system board. 5. Disconnect the microphone cable from ZIF connector JMIC. 6. Lift the display assembly from the bottom case assembly. A plastic detent post located approximately at the center of the display assembly may hang on the bottom case assembly.
Display Assembly Bezel l display assembly bezel screw covers (4) H2 (10 mm) H1 (10 mm) display assembly base H3 (10 mm) hinge H4 (10 mm) 10 mm Figure 4-15. Display Assembly Bezel Removal Part or Assembly Name Order Name Bezel service kit, 12.1-inch SVC,BZL,LCD,TFT,LXPiCD Display case service kit, 12.1-inch SVC,CVR,BK,TFT,LXPi+ To remove the display assembly bezel, follow these steps: 1. Use a scribe to pry the retaining screw covers out of the screw holes in the bezel. 2.
Display Assembly Latch and Latch Spring latch spring latch display assembly bezel Figure 4-16. Display Assembly Latch and Latch Spring Removal Part or Assembly Name Order Name Display assembly latch LTCH,LXPiCD Display assembly latch spring SPR,LTCH,LXPiCD To remove the display assembly latch and latch spring, follow these steps: 1. Remove the display assembly bezel. 2. Turn the display assembly bezel upside down on the work surface. 3.
LCD Panel LCD panel interface cable LCD power cable interface connector LCD inverter board connector CN2 display assembly case Figure 4-17. LCD Panel Removal Part or Assembly Name Order Name LCD panel LCD,TFT,SVGA,12.
To remove the LCD panel, follow these steps: 1. Remove the display assembly bezel. 2. Lift the lower edge of the LCD panel about 1 inch. 3. Disconnect the LCD-assembly power cable from connector CN2 on the LCD inverter board. 4. Lift the lower edge of the LCD panel approximately 3 inches. 5. Disconnect the display-assembly interface cable from the LCD interface connector on the underside of the LCD panel. 6. Lift the LCD panel out of the display assembly case.
LCD Inverter Board I1 (5 mm) connector CN1 I2 (5 mm) 5 mm inverter board connector CN2 retaining bracket LED board display assembly case Figure 4-18. LCD Inverter Board Removal Part or Assembly Name Order Name LCD inverter board ASSY,BD,INVRTR,TFT,SVGA12.1” To remove the LCD inverter board, follow these steps: 1. Remove the display assembly bezel. 2. Remove screws I1 and I2 securing the display-interface cable retaining bracket, and then remove the bracket. 3.
Hinge Covers display assembly base hinge cover hinge Figure 4-19. Hinge Covers Removal Each of the hinge covers is held in place by three tabs that fit into slots on the display assembly base. The microphone is inside the right hinge cover. To remove the hinge covers, follow these steps: 1. Remove the display assembly from the computer. 2. Place the display assembly faceup on the work surface. 3.
Display-Assembly Interface Cable I1 (5 mm) I2 (5 mm) display-assembly interface cable retaining bracket connector CN1 bobbin 5 mm LED board alignment marks on cable alignment notch in shoulder Figure 4-20.
7. Lift the display-assembly interface cable and bobbin out of the display assembly. NOTE: Some computers have a display-assembly interface cable that detaches from the bobbin. If you have a cable with a permanently attached bobbin, stop here; otherwise, proceed to Step 8. 8. Look at the alignment marks on the display-assembly interface cable, and note the alignment of the cable to the bobbin. Then carefully detach the cable from the bobbin.
Microphone/Switch Assembly right hinge cover microphone cover microphone/switch assembly magnet switch microphone/switch cable Figure 4-21. Microphone/Switch Assembly Removal Part or Assembly Name Order Name Microphone service kit SVC,MIPHN/SWT,LXPiCD The microphone/switch assembly is inside the right hinge cover. There is a microphone and a magnetic reed switch on the microphone/switch assembly. To remove the microphone/switch assembly, follow these steps: 1. Remove the display assembly. 2.
Bottom Case Assembly The bottom case assembly consists of the following: • • • • • • • • Diskette/CD-ROM assembly Deck-buoy Superpart assembly System board 3.
superpart docking EMI clip I/O bracket clip superpart serial EMI clip superpart assembly 3.1-V power supply audio board I/O bracket clip system board assembly spreader plate dust cover for the Advanced Port Replicator keel plate I/O panel dust cover bottom case assembly memory compartment cover diskette/CD-ROM assembly Figure 4-22.
Diskette/CD-ROM Drive Assembly D1 (4 mm) CD-ROM flex cable D4 (2 mm) D3 (2 mm) D2 (4 mm) D9 (2 mm) 4 mm bracket 2 mm plastic flip lock CD-ROM drive D5 (2 mm) diskette drive D8 (2 mm) D6 (2 mm) D7 (2 mm) connector JCDROM connector JFLOP bottom case assembly tab Figure 4-23.
4. Lift the drive assembly straight up about 1 inch. The front edge of the drive assembly engages tabs on the bottom case assembly. Make sure the diskette drive assembly is clear of the tab before attempting to lift it out of the bottom case assembly. CAUTION: Before removing the diskette drive and CD-ROM drive interface cables from connectors JFLOP and JCDROM, release each connector’s plastic flip lock (see Figure 4-23).
Deck Buoy B2 (10 mm) 10 mm B3 (10 mm) B1 (10 mm) deck buoy bottom case assembly Figure 4-24. Deck Buoy Removal Part or Assembly Name Order Name Deck buoy ASSY,CLMP,THRM,LXPiCD To remove the deck buoy, follow these steps: 1. Remove the palmrest assembly. 2. Remove the display assembly. 3. Remove the diskette/CD-ROM assembly. 4. Remove screws B1, B2, and B3. Lift the deck buoy out of the bottom case assembly.
Superpart Assembly B4 (25 mm) 25 mm thermal tape superpart assembly bottom case assembly Figure 4-25. Superpart Assembly Removal Part or Assembly Name Order Name Superpart assembly SVC,ASSY,FAN/SPKR, BRKT,LXPiCD The superpart assembly includes two speakers, two fans, the reserve battery, a printed circuit board for those parts, and an infrared printed circuit board. To remove the superpart assembly, follow these steps: 1. Remove the palmrest assembly. 2. Remove the display assembly. 3.
5. Remove screw B4. Lift the superpart assembly out of the bottom case assembly. CAUTION: To prevent tearing the thermal tape, slowly pull the superpart assembly away from the system board.
Reserve Battery superpart docking EMI clip connector JRBAT superpart serial EMI clip reserve battery superpart speaker (2) speaker/ fan bracket speaker (2) middle tab F1 (3 mm) F2 (3 mm) F3 (3 mm) F4 (3 mm) 3 mm Figure 4-26. Reserve Battery Removal Part or Assembly Name Order Name Reserve battery SVC,BTRY,RSRV,LXP CAUTION: The reserve battery provides power to the computer’s RTC and NVRAM when the computer is turned off.
To remove the reserve battery, follow these steps: 1. Remove the palmrest assembly. 2. Remove the superpart assembly. 3. Remove the superpart docking EMI clip and the superpart serial EMI clip. 4. Unplug the battery from connector JRBAT. 5. Place the superpart assembly upside down on a flat work surface. 6. Remove screws F1 through F4. Remove the speaker/fan bracket protecting the speakers and fan. CAUTION: When replacing the speaker/fan bracket, be sure to reinstall the middle tab correctly. 7.
System Board Assembly SB1 (5 mm) I/O docking EMI clip PC Card ejectors system board assembly SB2 (5 mm) I/O serial EMI clip main battery connector battery compartment 5 mm molded tabs (3) bottom case assembly Figure 4-27. System Board Assembly Removal Part or Assembly Name Order Name System board assembly SVC,SYS,PLN,LXPiCD-150ST, WB,0M CAUTION: Dell uses the system’s service tag number to maintain a history of the computer and its maintenance services.
Removing the System Board Assembly To remove the system board assembly, follow these steps: 1. Remove the palmrest assembly. 2. Remove the display assembly. 3. Remove the diskette/CD-ROM assembly. 4. Verify that the PC Card ejectors are fully depressed. 5. Remove the deck buoy plate. (Reinstall this part on the new system board.) CAUTION: To ensure maximum cooling for the microprocessor, do not touch the heat transfer area on the system board above the microprocessor or on the deck buoy plate.
Replacing the System Board Assembly Observe the following precautions when you reinstall a system board: 1. Before reinstalling the system board assembly, make sure the upper I/O bracket clip and the side I/O bracket clip are in place. If the side I/O bracket clip has been dislodged, reinstall it as shown in Figure 4-27. CAUTION: To avoid possible damage to the computer, make sure the system board assembly is inserted under the three molded tabs at the front of the bottom case assembly.
3.1-V Power Supply Board connector JPS1 power supply board with insulator connector JPS2 system board bottom case assembly Figure 4-29. 3.1-V Power Supply Board Removal Part or Assembly Name Order Name 3.1-V power supply board CRD,PWR SPLY,LXPiCD,V3.1,NBK To remove the 3.1-V power supply board, follow these steps: 1. Remove the palmrest assembly 2. Remove the superpart assembly. 3. Remove the 3.1-V power supply board from the system board.
I/O-Panel Dust Cover pivot pin (2) I/O-panel dust cover pivot hole (2) Figure 4-30. I/O-Panel Dust Cover Removal Part or Assembly Name Order Name I/O-panel dust cover DOOR,PLSTC,I/O,LXP/NBK To remove the I/O-panel dust cover, follow these steps: 1. Remove the palmrest assembly. 2. Remove the display assembly. 3. Remove the superpart assembly. 4. Remove the system board. 5. Remove the I/O-panel dust cover.
Advanced Port Replicator Connector Dust Cover Advanced Port Replicator connector dust cover Figure 4-31. Advanced Port Replicator Connector Dust Cover Part or Assembly Name Order Name Advanced Port Replicator connector dust cover CVR,DOOR,DOCKING,LXP To remove the dust cover for the Advanced Port Replicator connector, follow these steps: 1. Remove the palmrest assembly. 2. Remove the display assembly. 3. Remove the dust cover.
Audio Board hard-disk drive bracket audio board system board connector board audio connectors connector JAUDIO connector JTB 6 mm HD1 (6 mm) Figure 4-32. Audio Board Removal Part or Assembly Name Order Name Audio board PWA,AUDIO,LXPiCD,NBK To remove the audio board, follow these steps: 1. Remove the palmrest assembly. 2. Remove the display assembly. 3. Remove the superpart assembly. 4. Remove the system board. 5. Remove the hard-disk drive bracket.
Appendix A Factory Repair Parts T his appendix provides procedures for removing and replacing factory components and subassemblies at a service facility. (Dell does not recommend removal and replacement of factory components and subassemblies in the field. For removal and replacement procedures for field-replaceable parts, see Chapter 4, “Removing and Replacing Parts.
Table A-1. Factory Repair Parts and Assemblies Part or Assembly Name Order Name Figure AC Adapter and Power Cords AC adapter ADPT,AC,EXT,18V,65W,LXP Power cable, U.S. CORD,PWR,110V,6F,AC ADPT,US Power cable, Europe CORD,PWR,220V,6F,AC ADPT,EUR Power cable, Australia CORD,PWR,220V,6F,AC ADPT,AUS Power cable, U.K.
Table A-1.
Table A-1.
Table A-1.
Table A-1. Factory Repair Parts and Assemblies (Continued) Part or Assembly Name Order Name Figure LCD Assemblies (Continued) LCD/LED/inverter board cable, service kit, activematrix color, TFT SVGA display Display-assembly interface cable CBL,FPC,LED/INVRTR,TFT, 12.1” 4-20 Display-assembly interface cable bobbin, 12.1-inch BBN,LCD,TFT,12.1” 4-20 Technical booklet DOC,SERV,GDE,XPi Bezel service kit, 12.1-inch SVC,BZL,LCD,TFT,LXPiCD 4-15 Display assembly bezel 12.1-inch ASSY,LCD,BZL,12.
Table A-1. Factory Repair Parts and Assemblies (Continued) Part or Assembly Name Order Name Figure LCD Parts Hinge cover, right CVR,HNG,RT,MIPHN,LXPi+ 4-21 Hinge cover, left CVR,HNG,LXP Display assembly base ASSY,CVR,BTM,DIS,LXPiCD 4-19 Left hinge HNG,LCD,LFT,TFT,12.1" 4-15 Right hinge HNG,LCD,RT,TFT,12.
Table A-1.
Table A-1.
Table A-1. Factory Repair Parts and Assemblies (Continued) Part or Assembly Name Order Name Figure Screws (Continued) 6 mm, black SCR,2mmX6mm,PHH,MS, BLO,LXP B6 8 mm, gold SCR,2.6mmX8mm,PHH,MS, ZPS 10 mm, gold SCR,2.5mmX10mm,PHH,MS, NON,LXP5 10 mm, black SCR,2mmX10mm,PHH,MS, BLO,LXP B9 10 mm, black SCR,M2X.4x10mm,PHH, MS,BLO 25 mm, black SCR,2.
Table A-1.
Exploded Views of Components and Assemblies display assembly bezel latch LCD panel interface cable LCD power cable EMI shield hinge covers (2) display assembly case LCD inverter board display assembly hinges (2) Figure A-1.
. palmrest palmrest brace CD-ROM EMI clip A6 (4 mm) trackball button board A9 (4 mm) A7 (4 mm) A8 (4 mm) trackball ring trackball plastic housing trackball board connector J1 trackball interface cable keyboard cables (2) keyboard 4 mm Figure A-2.
. superpart docking EMI clip I/O bracket clip superpart serial EMI clip superpart assembly 3.1-V power supply audio board system board assembly spreader plate dust cover for the Advanced Port Replicator key buoy plate I/O panel dust cover bottom case assembly memory compartment cover diskette/CD-ROM assembly Figure A-3.
Hard-Disk Drive The hard-disk drive resides in a carrier that mounts inside the computer’s hard-disk drive bay. Four screws secure the drive inside the carrier. A mylar insulator provides electrical insulation between the hard-disk drive and the bottom of its carrier. To remove the hard-disk drive and hard-disk drive insulator, follow these steps: 1. Remove the hard-disk drive assembly. See “Hard-Disk Drive Assembly” in Chapter 4. 2.
CD-ROM Drive The CD-ROM drive is attached to the CD-ROM/diskette drive bracket. See “Diskette/CD-ROM Drive Assembly” in Chapter 4 for instructions about removing the diskette/CD-ROM assembly from the bottom case assembly. The CD-ROM flex cable is threaded through a slot in the drive bracket. Remove the four screws that hold the CD-ROM to the drive bracket. Slide the CD-ROM flex cable out of the slot in the bracket holding the CD-ROM. The CD-ROM is replaced as a unit and is not disassembled.
Display Assembly Components The display assembly consists of the LCD assembly and its related components. It also contains the LED board, which provides visual indications of many of the computer’s basic functions. The microphone assembly is mounted inside the right hinge cover of the display. Some parts of the display assembly can be removed and replaced without removing the assembly from the computer. Others require that the display assembly be removed.
5. Remove the LCD-inverter-board. See “LCD-Inverter-Board Interface Cable” in Chapter 4. 6. Remove the display assembly base. See “Display Assembly Base” later in this chapter. 7. Remove the display-assembly EMI shield. The EMI shield is held in place by tabs along the upper and lower edges. Pulling the center of the shield slightly away from the display assembly will release the tabs. To replace an EMI shield, carefully orient the replacement EMI shield in the same position as the original shield.
Display Assembly Hinges To remove a hinge (see Figure 4-14), follow these steps: 1. Remove the display assembly from the computer. See “Display Assembly” in Chapter 4. 2. Remove the display assembly bezel. See “Display Assembly Bezel” in Chapter 4. 3. Remove the LCD assembly. See “LCD Panel” in Chapter 4. 4. Remove the display-assembly interface cable. See “Display-Assembly Interface Cable” in Chapter 4. 5. Remove the hinge covers. See “Hinge Covers” in Chapter 4. 6. Remove the display assembly base.
System-Board Assembly Components system board assembly I/O docking EMI clip I/O serial EMI clip I/O interface cable bottom case assembly Figure A-5. System Board Assembly in the Bottom Case Assembly To remove a part of the system board assembly, Dell recommends that you first remove the assembly as described in “System Board Assembly” in Chapter 4. Then follow the instructions described in the following subsections to remove parts of the system board assembly.
Keyboard/Keypad/Mouse Connector Shield connector shield keyboard/keypad/ mouse connector 3 mm D4 (3 mm) Figure A-6. Keyboard/Keypad/Mouse Connector Shield Removal Two tabs on the keyboard/keypad/mouse connector shield engage two associated slots on the I/O panel near the keyboard/keypad/mouse connector. Retaining screw D4 attaches the bottom of the shield to the bottom of the I/O panel.
I/O Interface Cable system board connector JFLEX I/O board I/O interface cable connector JSTDIO Figure A-7. I/O Interface Cable Removal To remove the cable, follow these steps: 1. Disconnect one end of the I/O interface cable from connector JSTDIO on the system board. Connector JSTDIO is located on the underside of the system board. 2. Disconnect the other end of the I/O interface cable from connector JFLEX on the I/O board.
I/O Board I/O board I/O bracket clip ST4 (8 mm) ST3 (8 mm) ST2 (8 mm) I/O bracket ST1 (8 mm) 8 mm Figure A-8. I/O Board Removal To remove and replace the I/O board, follow these steps: 1. Remove the I/O interface cable from connector JSTDIO. See the previous subsection in this appendix. 2. Remove the keyboard/keypad/mouse connector shield. See “Keyboard/Keypad/Mouse Connector Shield” found earlier in this appendix. 3.
I/O Panel I/O bracket ST8 (4 mm) system board ST7 (4 mm) ST6 ST5 ST4 ST3 ST2 ST1 NOTE: ST1–ST8 are 8-mm standoff nuts D5 (3 mm) 3 mm 4 mm 8 mm Figure A-9. I/O Panel Removal To remove and replace the I/O panel, follow these steps: 1. Remove the I/O board. See the previous subsection in this appendix. 2. Remove the standoff nuts ST1 through ST8 Use a 3/16 nut driver to remove standoff nuts ST1 through ST6 and a 7/32 nut driver for ST7 and ST8. 3. Remove screw D5. 4.
Bottom-Case Assembly Components power button main battery insulator spreader plate bottom case assembly Figure A-10. Bottom-Case Assembly Components To remove parts of the bottom case assembly, you must first remove the system board assembly as described in “System Board Assembly” in Chapter 4. The subsections that follow describe the removal and replacement of bottom-case assembly components. Main Battery Insulator The main battery insulator insulates the main battery from the system board assembly.
Power Button and Power-Button Mounting Bracket power button power button mounting bracket Figure A-11. Power Button and Power-Button Mounting Bracket Removal Two tabs attach the power button to the power-button mounting bracket. To remove the power button and its mounting bracket, slide the power button as far as it will go toward the back of the bottom case assembly. Use a small flat-blade screwdriver or similar device to press the two tabs out of the mounting bracket.
Spreader and Keel Plates spreader plate keel plate bottom case assembly Figure A-12. Spreader and Keel Plate Removal Remove the spreader plate by lifting it from the bottom case assembly. The spreader plate fits easily over plastic projections and screw holes. The keel plate is in the center of the bottom case, below the spreader plate. The keel plate fits over a small peg and a semicircular plastic projection. Remove the keel plate by lifting it out of the bottom case assembly.
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Appendix B System Setup Options Y ou may want to customize the configuration of your computer. This appendix describes how to change the system setup options stored in NVRAM on the system board. You can access these options in two ways: • Using the Dell Control Center • Using the MS-DOS–based version of the system setup options, called the System Setup program Accessing the Dell Control Center Figure B-1.
Accessing the System Setup Program NOTE: If the System Setup program is running when the computer enters suspend mode, the computer exits the System Setup program and then activates suspend mode. To enter the System Setup program, hold down the and keys and press the key, or press the and keys.
System Setup Screens Page 1 of 2 Time: Dell Computer Corporation Dell Latitude XPi CD System Setup 13:17:02Date: Internal Hard Drive: Diskette Drive A: Boot Speed: Boot Sequence: Speaker Volume: Keyboard Click: Serial Port: Infrared Data Port: Parallel Mode: Integrated Trackball: Upper PC Card Socket: Lower PC Card Socket: Monitor Toggle: Replicator SCSI: Replicator Network: Ring Speed: Mon Feb 12, 1997 1216 MB 3.5 inch, 1.
Table B-1. System Setup Program Categories B-4 Category Function BIOS VERSION Displays the version number and release date of the BIOS in the computer. TIME Resets time on computer’s internal clock. DATE Resets date on computer’s internal calendar. INTERNAL HARD DRIVE Displays capacity of computer’s hard-disk drive. DISKETTE DRIVE A Identifies type of diskette drive installed.
Table B-1. System Setup Program Categories (Continued) Category Function REPLICATOR SCSI Configures computer for use with Advanced Port Replicator. SCSI drivers will load automatically if a SCSI device is connected. REPLICATOR NETWORK Enabling this category and installing is_net.exe utility allow user to configure network drivers for use with Advanced Port Replicator. RING SPEED Configures the ring speed for the Advanced Port Replicator. MICROPROCESSOR Displays type of microprocessor installed.
Table B-1. System Setup Program Categories (Continued) B-6 Category Function DISPLAY TIME-OUT Determines how long computer operates without detecting I/O activity before display is switched off to conserve battery power. This option should be disabled if software compatibility problems occur. DISK TIME-OUT Determines how long hard-disk drive is idle before drive motor turns off to conserve battery power. SUSPEND TIME-OUT Determines how long computer is idle before suspend mode is activated.
Table B-1. System Setup Program Categories (Continued) Category Function INTELLISPIN Compensates for unbalanced CDs that cause the computer to vibrate when the CD-ROM drive is in use. Allows use of discs that might otherwise be unreadable. Available for CD-ROM drives with speeds of 6X or higher. HIGH PERFORMANCE (the default), lets the CD-ROM drive run at the highest speed. VARIABLE automatically lowers the CD-ROM’s speed to reduce or stop the vibration.
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Index Numerics 3.
E IrDA communications port location, 1-2 error messages, system, 3-3 IRQ line assignments list of, 1-6 ESD, 4-2 exploded view bottom assembly , A-14 LCD assembly, A-12 top assembly, A-13 external visual inspection, 2-1 K keel plate, A-27 key combinations to enter System Setup program, B-2 G keyboard assembly removal, 4-14 grounding strap, 4-3 keyboard/keypad/mouse connector shield removal, A-21 H hard-disk drive, A-15 hard-disk drive assembly removal, 4-7 hinge covers removal, 4-25 L LCD inverter
P palmrest assembly components, A-16 removal, 4-10 palmrest brace, A-16 system configuring, B-4 features, 1-1 locations, 1-2 system board assembly removal, 4-34, 4-38 PC Card types supported, 1-1 system board components, A-20 POST beep codes about, 3-1 list of, 3-1 system error messages about, 3-3 list of, 3-3 power button removal, A-26 system setup options, B-1 power-button mounting bracket, A-26 precautions, 4-2 R reserve battery removal, 4-36 system configuration information, B-3 System Setup
4 V Z visual inspection external, 2-1 ZIF connectors, 4-5 Dell Latitude XPi CD Service Manual
