Service Manual

CAUTION: The microprocessor and heat-sink assembly can get extremely hot during
system operation. Be sure the assembly has had sufficient time to cool before you touch
it.
CAUTION: When handling the microprocessor and heat-sink assembly, take care to avoid
sharp edges on the heat-sink.
NOTICE: See "Protecting Against
Electrostatic Discharge."
1. Turn off the system, including any attached peripherals, and disconnect the AC power cable from
its power source.
2. Remove the front bezel
.
3. Remove the cover.
4. Disconnect the AC power cable and all peripheral cables from the back panel of the system.
5. Release the clip securing the heat sink to the microprocessor socket by first inserting a small flat-
tip screwdriver into the upper slot at the front of the socket to release the clamp, and then
releasing the clip from the opposite side of the socket.
6. Grasp the end of the ZIF socket arm and bend it out slightly until it disengages from the socket
tab.
7. Swing the ZIF arm up to the upright position.
The microprocessor and heat-sink assembly are now unlocked from the ZIF socket.
NOTICE: The microprocessor may adhere to the heat-sink assembly because of a layer of
thermal grease applied to the top of the microprocessor. When lifting the heat sink away, use
care to prevent the microprocessor from separating from the heat sink and falling on system
board components.
8. Lift the microprocessor and heat-sink assembly away from the ZIF socket (see Figure 19).
Figure 19. Microprocessor and Heat Sink Removal
1 Heat-sink clip
2 Microprocessor and heat-sink assembly
3 Tab on ZIF socket (2)
4 ZIF socket release lever
5 ZIF socket