Owners Manual

Table 19. Thermal restrictions matrix for single processor (continued)
Maximum continuous operating inlet temperature (°C)
100W 4214R CPU1:|
CPU2:
CPU1:8
|
CPU2:
8
35 35 35 35 35 35 35 35 35 35
4210R CPU1:|
CPU2:
CPU1:8
|
CPU2:
8
35 35 35 35 35 35 35 35 35 35
95W 4210T CPU1:|
CPU2:
CPU1:8
|
CPU2:
8
35 35 35 35 35 35 35 35 35 35
85W 3206R CPU1:|
CPU2:
CPU1:8
|
CPU2:
8
35 35 35 35 35 35 35 35 35 35
Particulate and gaseous contamination specifications
Table 20. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by
ISO Class 8 per ISO 14644-1 with a 95%
upper confidence limit.
NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc
whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 21. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver coupon corrosion rate <200 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Technical specifications 19