Owners Manual

Table 19. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration- Air cooled
Processors TDP (W) Cores 6 x drives/
sled
4 x drives/sled 2 x drives/sled 1 x drive/sled No BP
8380 270 40 Not supported Not supported Not supported Not supported Not
supported
8368 270 38 Not supported Not supported Not supported Not supported Not
supported
8368Q 270 38 Not supported Not supported Not supported Not supported Not
supported
8360Y 250 36 Not supported Not supported Not supported Not supported Not
supported
8358 250 32 Not supported Not supported Not supported Not supported Not
supported
8358P 240 32 Not supported Not supported Not supported Not supported 20
6348 235 28 Not supported Not supported Not supported Not supported 20
8352Y 205 32 20 20 25 25 25
8352S 205 32 20 20 25 25 25
6338 205 32 20 20 25 25 25
6330 205 28 20 20 25 25 25
6354 205 18 Not supported 20 20 20 25
6346 205 16 Not supported 20 20 20 25
8352V 195 36 20 20 25 25 25
6338N 185 32 20* 20* 25 25 25
6330N 165 28 25 25* 25* 25* 25*
NOTE:
Data with * mark means it can have a temperature offset by +5°C, if using extended processor 1 with HSK on this
configuration.
H745 is not supported with processor TDP > 185 W.
Additional thermal restrictions are required for PCIE > 25 Watts, 128GB LRDIMM and GPU configuration.
Table 20. Maximum continuous operating temperature for single processor with 2.5-inch direct drive
configuration for processor 1 - Air cooled
Processors TDP (W) Cores 6 x drives/
sled
4 x drives/
sled
2 x drives/ sled 1 x drive/ sled No BP
8380 270 40 20 20 20 20 25
8368 270 38 20 20 25 25 25
8368Q 270 38 Not
supported
Not supported Not supported Not supported Not
supported
8360Y 250 36 20 20 25 25 25
8358 250 32 20 20 25 25 25
8358P 240 32 20 20 25 25 25
6348 235 28 25 25 25 25 30
8351N 225 36 20 20 25 25 25
Technical specifications 11