Owners Manual

Table 19. Particulate contamination specifications (continued)
Particulate contamination Specifications
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 20. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 21. Label reference
Label Description
STD Standard
HSK Heat sink
LP Low profile
FH Full height
Table 22. Thermal restriction matrix
Configuration
8 x 2.5-inch
SAS/ SATA
16 x 2.5-inch
SAS/ SATA
8 x 3.5-inch SAS/
SATA
Ambient
temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives
CPU TDP/cTDP
105 W
2U STD HSK with STD fan
35°C
120 W 35°C
135 W 35°C
150 W 35°C
165 W
2U HPR HSK with STD fan
35°C
185 W 35°C
NOTE: Fan blank is required for five standard fan configurations.
NOTE: GPU is not supported in any of the configurations.
NOTE: OCP shroud is required if riser module is not installed.
NOTE: Processor blank is required for one processor configuration.
Technical specifications 11