Dell EMC PowerEdge R650 Technical Specifications Regulatory Model: E69S Series Regulatory Type: E69S001 May 2021 Rev.
Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2021 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Contents Chapter 1: Technical specifications............................................................................................... 4 Chassis dimensions............................................................................................................................................................. 5 Chassis weight.....................................................................................................................................................................
1 Technical specifications The technical and environmental specifications of your system are outlined in this section.
Chassis dimensions Figure 1. Chassis dimensions Table 1. Chassis dimension for the system Drives Xa Xb Y Za Zb Zc 4 drives, 10 drives 482 mm (18.97 inches) 434 mm (17.08 42.8 mm (1.68 35.84 mm (1.4 inches) inches) inches)With bezel 22 mm (0.86 inches)Without bezel 751.48 mm (29.58 inches)Ear to rear wall 787.05 mm (31 inches)Ear to PSU handle 8 drives 482 mm (18.97 inches) 434 mm (17.08 42.8 mm (1.68 35.84 mm (1.4 700.7 mm (27.
Chassis weight Table 2. Dell EMC PowerEdge R650 chassis weight System configuration Maximum weight (with all drives/SSDs) 4 x 3.5-inch 21.2 kg (46.7 lbs) 8 x 2.5-inch 19.2 kg (42.3 lb) 10 x 2.5-inch 21.0 kg (46.2 lb) 0 17.2 kg (37.9 lb) Processor specifications Table 3.
Table 4. PSU specifications for the PowerEdge R650 (continued) PSU Class AC Heat dissipat ion (maxim um) BTU/hr Freque ncy Hz High line Voltage Peak power -72 VDC Low line – -72 VDC 240 VDC Peak power – -40 VDC 40 VDC Current 1100 W Mixed Mode HVDC (for China only) N/A 4299 N/A 240 V 5.2 A 1400 W AC Platinum 5459 50/60 100 240 V 12 – 8 A 1400 W Mixed Mode HVDC (for China only) N/A 5459 N/A 240 V 2380 W 1400 W 1400 W 1785 W 1050 W 6.
Cooling fan specifications The R650 is adapting to dual fans module form factor. One set of fan module includes two fan body with one fan connector. Table 5. Cooling fan specifications Fan type Abbreviation Also known as Label color Standard fan STD STD No label Label image Figure 2. Standard fan High performan HPR (SLVR) ce (Silver grade) fan 8 HPR Technical specifications Silver NOTE: New cooling fans comes with the High Performance Silver Grade label.
Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known as Label color Label image Figure 3.
Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known as Label color Label image Figure 4. High performance (Silver grade) fan High performan HPR (Gold) ce (Gold grade) fan 10 VHP - Very High Performance Technical specifications Gold NOTE: New cooling fans comes with the High Performance Gold Grade label. While the older cooling fans has the High Performance label.
Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known as Label color Label image Figure 5.
Table 5. Cooling fan specifications (continued) Fan type Abbreviation Also known as Label color Label image Figure 6. High performance (Gold grade) fan NOTE: The STD and HPR fans installation depends on the system configuration. For more information about the fan support configuration or matrix, see Thermal restriction matrix. System battery specifications The system supports CR 2032 3.0-V lithium coin cell system battery.
Table 6. Expansion card slots supported on the system board (continued) PCIe slot With Regular shroud R1a R2a R2b R3a R4c+R4d Slot 2 Low profileHalf length NA x16 x8 NA x16 (FH-3/4L) Slot 3 Low profileHalf length NA NA NA x16 NA Memory specifications The system supports the following memory specifications for optimized operation. Table 7.
Drives The PowerEdgeR650 system supports: ● 4 x 3.5-inch hot-swappable SAS, SATA drives. ● 8 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives. ● 10 x 2.5-inch hot-swappable SAS, SATA , or NVMe drives. ● 2 x 2.5-inch rear SAS, SATA , or NVMe drives. ● 0 drive. NOTE: For more information about how to hot swap NVMe PCIe SSD U.2 device, see the Dell Express Flash NVMe PCIe SSD User's Guide at https://www.dell.
IDSDM The PowerEdgeR650 system supports Internal Dual SD module (IDSDM). The IDSDM supports two SD cards and is available in the following configurations: Table 12. Supported SD card storage capacity IDSDM card ● 16 GB ● 32 GB ● 64 GB NOTE: One IDSDM card slot is dedicated for redundancy. NOTE: Use Dell EMC branded SD cards that are associated with the IDSDM configured systems.
Table 15. Operational climatic range category A3 Temperature Specifications Allowable continuous operations Temperature ranges for altitudes <= 900 m (<= 2953 ft) 5–40°C (41–104°F) with no direct sunlight on the equipment Humidity percent ranges (non-condensing at all times) 8% RH with -12°C minimum dew point to 85% RH with 24°C (75.2°F) maximum dew point Operational altitude de-rating Maximum temperature is reduced by 1°C/175 m (33.8°F/574 Ft) above 900 m (2953 Ft) Table 16.
Thermal restriction for liquid cooling Table 20. Label references Label references STD Standard HPR High Performance HSK Heat sink LP Low Profile (Riser) FH Full Height (Riser) DW Double Wide (Xilinx FPGA accelerator) Table 21. Cooling fan matrix for liquid cooling Configuration Rear storage CPU TDP 4 x 3.5-inch 3 LP/ 2 FH Rear 2 x 2.5–inch 8 x 2.5-inch Rear 2 x 2.5– inch NVMe 3 LP/ 2 FH 10 x 2.5-inch SAS 3 LP/ 2 FH Rear 2 x 2.5–inch SAS 10 x 2.5-inch NVMe 3 LP/ 2 FH Rear 2 x 2.
ASHRAE A3 environment for liquid cooling ● ● ● ● ● ● ● ● ● ● Two PSUs are required in redundant mode, however PSU failure is not supported. 128 GB or greater capacity DIMMs are not supported. Intel Persistent Memory 200 series (BPS) and NVDIMM are not supported. NVMe drives are not supported. GPU and FPGA are not supported. Rear drives are not supported. BOSS 1.5 is not supported. Support OCP cooling tier ≤ 5 and ≥ 25 Gb OCP cards require 85°C active optic cable.
Table 23. Cooling fan matrix for air cooling (continued) Configura tion 4 x 3.5-inch Rear storage 3 LP/ 2 FH CPU TDP Rear 2 x 2.5–inch 8 x 2.5-inch Rear 2 x 2.5–inch NVMe 10 x 2.5-inch SAS 3 LP/ 2 FH 3 LP/ 2 FH 10 x 2.5-inch NVMe Rear 2 x 2.5–inch SAS Rear 2 x 2.5–inch NVMe 3 LP/ 2 FH 165 W 185 W HPR SLVR fan 205 W HPR SLVR fan 220 W 250 W Not supported 270 W HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan Not supported NOTE: No support for CPU > 220 W in 3.
○ HPR SLVR fan is required. ○ BPS is not supported when: ￭ CPU TDP > 165 W. ￭ GPU is installed. ￭ Rear drive is present. ● For 2.5–inch configuration: ○ HPR GOLD fan is required. ○ All NVMe 10 x 2.5–inch configuration is not supported if CPU TDP > 250 W. ○ 10 x 2.5–inch SAS/SATA with rear drive configuration is not supported if CPU TDP > 220 W. ○ No support for LRDIMM ≥ 128 GB along with BPS if CPU > 165 W 30°C configuration support for 2.
● ● ● ● ● ● ● ● ● ● PCIe SSD is not supported. NVMe drives are not supported. 128 GB or greater capacity DIMMs are not supported. GPU and FPGA are not supported. CPU TDP > 105 W are not supported. Rear drives are not supported. BOSS 1.5 is not supported. Supports OCP, cooling tier ≤ 4 and 85°C active optic cable is required. Non Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported. Intel Persistent Memory 200 series (BPS) and NVDIMM are not supported.
