Owners Manual

Table 18. Particulate contamination specifications (continued)
Particulate contamination Specifications
NOTE: This condition applies to data center and non-data
center environments.
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 19. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 20. Thermal restriction matrix for processor and fans
Configuration 4 x 3.5-inch 8 x 2.5-inch 10 x 2.5-inch drives
(NVMe)
Processor TDP Processor cTDP Max
120 W 150 W STD fan
STD heat sink
STD fan
STD heat sink
HPR fan
STD heat sink
155 W 180 W STD fan
STD heat sink
STD fan
STD heat sink
HPR fan
STD heat sink
180 W 200 W STD fan
HPR heat sink
STD fan
HPR heat sink
HPR fan
HPR heat sink
200 W 200 W STD fan
HPR heat sink
STD fan
HPR heat sink
HPR fan
HPR heat sink
225 W 240 W HPR fan
HPR heat sink
HPR fan
HPR heat sink
HPR fan
HPR heat sink
280 W 280 W HPR fan
HPR HSK with DIMM
Blank
HPR fan
HPR HSK with DIMM
Blank
Not supported
NOTE: To ensure proper cooling in the system with 280 W processor, memory module blank should be installed in the
memory sockets that are not populated.
NOTE: For 280 W processor, maximum supported ambient temperature is 35°C.
12 Technical specifications