Dell EMC PowerEdge R6515 Technical Specifications Regulatory Model: E45S Regulatory Type: E45S003 Dec 2020 Rev.
Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2019- 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Contents Chapter 1: Technical specifications............................................................................................... 4 Chassis dimensions..............................................................................................................................................................5 System weight......................................................................................................................................................................
1 Technical specifications The technical and environmental specifications of your system are outlined in this section.
Chassis dimensions Figure 1. Chassis dimensions Table 1. PowerEdge R6515 chassis dimensions Zb * System configurations Xa Xb Y Za 4 x 3.5-inches or 10 x 2.5inches 482.0 mm 434.0 mm 42.8 mm 657.25 mm With bezel: 35.84 mm (1.4 (25.87 inches) inches) Without bezel: 22.0 mm (0.87 inches) 692.62 mm 8 x 2.5-inches 482.0 mm 606.47 mm With bezel: 35.84 mm (1.4 (23.87 inches) inches) Without bezel: 22.0 mm (0.87 inches) 641.85 mm (18.97 inches) (17.08 inches) (1.68 inches) 434.0 mm 42.8 mm (18.
System weight Table 2. PowerEdge R6515 system weight System configuration Maximum weight (with all drives) 4 x 3.5-inch configuration 16.75 kg (36.92 lb) 8 x 2.5-inch configuration 15.6 kg (34.39 lb) 10 x 2.5-inch configuration 15.8 kg (34.83 lb) Processor specifications Table 3. PowerEdge R6515 processor specifications Supported processor Number of processors supported AMD EYPC 7002 series processor One PSU specifications Table 4.
NOTE: The STD and HPR fans installation depends on the system configuration. For more information about the fan support configuration or matrix, see Thermal restriction matrix. System battery specifications The PowerEdge R6515 system supports CR 2032 3.0-V lithium coin cell system battery. Expansion card riser specifications The PowerEdge R6515 system supports up to two PCI express (PCIe) expansion cards: Table 5.
Drive specifications Drives The PowerEdge R6515 system supports ● ● ● ● Up Up Up Up to to to to 4 x 3.5-inch (SAS, SATA or SSD) front accessible drives in slot 0 to 3 8 x 2.5-inch (SAS, SATA or SSD) front accessible drives in slot 0 to 7 10 x 2.5-inch drives front accessible drives (with 8 SAS/SATA drives in slot 0 to 7 + 2 NVMe drives in slot 8 to 9) 10 x 2.5-inch front accessible NVMe drives in slot 0 to 9 NOTE: The front accessible NVMe drives currently utilize PCIe Gen3.
● 2 x 25Gb SFP+ NOTE: ● You can install up to two PCIe add-on NIC cards. ● For information about Linux network performance settings, see the Linux Network Tuning Guide for AMD EPYC Processor Based Servers white paper at AMD.com Serial connector specifications The PowerEdge R6515 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal Equipment (DTE), 16550-compliant.
Table 12. Supported rear video resolution options (continued) Resolution Refresh rate (Hz) Color depth (bits) 1600 x 1200 60 8, 16, 32 1680 x 1050 60 8, 16, 32 1920 x 1080 60 8, 16, 32 1920 x 1200 60 8, 16, 32 Environmental specifications NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located with the Manuals & Documents on https://www.dell.com/support. Operational climatic range category A2 Table 13.
Table 15. Shared requirements across all categories (continued) Allowable operations Maximum operational altitude 3,048 meters (10,000 feet) *: Per ASHRAE thermal guidelines, these are not instantaneous rates of temperature change. Table 16. Maximum vibration specifications Maximum vibration Specifications Operating 0.26 G rms at 5 Hz to 350 Hz (all operation orientations) Storage 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested) Table 17.
Table 18. Particulate contamination specifications (continued) Particulate contamination Specifications NOTE: This condition applies to data center and non-data center environments. Table 19. Gaseous contamination specifications Gaseous contamination Specifications Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ ISA71.04-2013 Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.
Table 21. Thermal restriction matrix for T4 GPGPU (continued) Riser configurations Configuration type and ambient temperature support Slot 2 HPR fan HPR fan NA Slot 3 HPR fan HPR fan HPR fan + NVMe drives from slot 6-9 + SAS or SATA drives from slot 0-5 Table 22. Label reference Label Description STD Standard HPR High performance HSK Heat sink LP Low profile Thermal restriction for ASHRAE A3/Fresh air environment ● ● ● ● ● ● Processor TDP equal or greater than 180 W are not supported.
