Dell EMC PowerEdge R7515 Technical Specifications Regulatory Model: E46S Series Regulatory Type: E46S003 Dec 2020 Rev.
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Contents Chapter 1: Technical specifications............................................................................................... 4 System dimensions..............................................................................................................................................................5 Chassis weight.....................................................................................................................................................................
1 Technical specifications The technical and environmental specifications of your system are outlined in this section.
System dimensions Figure 1. Dimensions of the PowerEdge R7515 system Table 1. PowerEdge R7515 system dimensions Xa Xb Y Za (with bezel) Za (without bezel) Zb* Zc 482 mm (18.97 inches) 434 mm (17.08 inches) 86.8 mm (3.41 inches) 35.84 mm (1.41 inches) 22 mm (0.87 inches) 647.07 mm (25.47 inches) 681.755 mm (26.84 inches) Chassis weight Table 2. Chassis weight System Maximum weight (with all drives) 8 x 3.5-inch 23.78 kg (52.42 lb) 12 x 3.5-inch 25.68 kg (56.61 lb) 12 x 3.5-inch + 2 x 3.
Processor specifications Table 3. PowerEdge R7515 processor specifications Supported processor Number of processors supported AMD EPYC 7002 series processor One PSU specifications The PowerEdge R7515 system supports the following AC or DC power supply units (PSU): Table 4.
Cooling fans specifications The PowerEdge R7515 system supports both the Standard fan (STD fan) and High Performance fan (HPR fan) and requires all six fans to be installed. NOTE: Mixing of STD and HPR fans is not supported. NOTE: The STD and HPR fans installation depends on the system configuration. For more information about the fan support configuration or matrix, see Thermal restriction matrix. System battery specifications The PowerEdge R7515 system supports CR 2032 3.
Table 7. Memory module sockets Memory module sockets Speed Sixteen 288-pin 3200 MT/s, 2933 MT/s, 2666 MT/s Storage controller specifications The PowerEdge R7515 system supports the following controller cards: Table 8. PowerEdge R7515 system controller cards Internal controllers External controllers ● ● ● ● ● ● ● 12 Gbps SAS Ext. HBA ● H840 PERC H740P PERC H730P PERC H330 HBA330 S150 Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.
Table 9. Supported optical drive type Supported drive type Supported number of drives Dedicated SATA DVD-ROM drive or DVD +/-RW drive One Ports and connectors specifications USB ports specifications Table 10. PowerEdge R7515 system USB specifications Front USB port type USB 2.0compliant port Rear No. of ports Two USB port type USB 3.0compliant ports Internal No. of ports Two USB port type Internal USB 3.0compliant port No. of ports One Micro USB 2.
● 16 GB ● 32 GB ● 64 GB NOTE: There are two dip switches on the IDSDM for write-protection. NOTE: One IDSDM card slot is dedicated for redundancy. NOTE: Use Dell EMC branded microSD cards that are associated with the IDSDM configured systems. Video specifications The PowerEdge R7515 system system supports Matrox G200eR2 graphics card with 16 MB capacity. NOTE: 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode. Table 11.
Operational climatic range category A2 Table 13. Operational climatic range category A2 Allowable continuous operations Temperature ranges for altitude <900 meters (<2,953 feet) 10 to 35°C (50 to 95°F) with no direct sunlight on the platform Humidity percent ranges (Non-condensing at all times) 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F) maximum dew point Operational altitude de-rating Maximum temperature is reduced by 1°C/300 meters (1.
Shared requirements across all categories Table 15. Shared requirements across all categories Allowable operations Maximum temperature gradient (applies to both operation and 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes non-operation) (9°F in 15 minutes), 5°C in an hour* (9°F in an hour) for tape hardware Non-operational temperature limits -40 to 65°C (-40 to 149°F) Non-operational humidity limits 5% to 95% RH with 27°C (80.
Table 19. Thermal restriction matrix (continued) Drive type Configuration 8 x 3.5- 12 x 3.5- 12 x 3.5- 24 x inch inch inch drives drives drives drives Ambient temperature 2.5-inch 12 x 2.5-inch 24 x 2.5-inch drives SAS + 12 x drives NVMe 2.
Table 20. Thermal restriction matrix for T4 GPU Card (continued) Drive Configuration type 8 x 3.5-inch drives 12 x 3.5-inch 12 x 3.5-inch 24 x 2.5drives drives inch drives 12 x 2.5-inch 24 x 2.5-inch drives SAS + drives NVMe 12 x 2.
Table 22. Processor support matrix TDP (W) Fan type Fan type (8 x 3.5inch/24 x 2.5-inch) HSK Type(8 x 3.5-inch/24 x 2.5/12x2.5inchSAS+ 12 x 2.5inchNVMe/ 24x2.5inchNVMe) HSK Type(12 x 3.5-inch) HSK Type(12 ASHRAE A3 x 3.5-inch support +Rear 2 x 3.
Table 23. Particulate contamination specifications (continued) Particulate contamination Specifications equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. NOTE: Air filtering can also be accomplished by filtering room air with MERV8 filter per ANSI/ASHRAE Standard 127 Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
