Dell EMC PowerStore Hardware Information Guide 1.x August 2020 Rev.
Notes, cautions, and warnings NOTE: A NOTE indicates important information that helps you make better use of your product. CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death. © 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Contents Additional Resources.....................................................................................................................4 Chapter 1: Platform overview........................................................................................................ 5 Description............................................................................................................................................................................
Preface As part of an improvement effort, revisions of the software and hardware are periodically released. Some functions that are described in this document are not supported by all versions of the software or hardware currently in use. The product release notes provide the most up-to-date information about product features. Contact your technical support professional if a product does not function properly or does not function as described in this document.
1 Platform overview Topics: • Description Description The PowerStore platform has a flexible design capable of meeting the requirements of multiple different storage applications with support for high availability. The design includes two major configurations: ● PowerStore T model appliances ● PowerStore X model appliances PowerStore T model appliances serve Block and File services, and the software stack is deployed directly on the system.
2 Base enclosure component descriptions Topics: • • • • Base enclosure component overview Base enclosure front view Base enclosure rear view Node internal components Base enclosure component overview The 2U, 25-drive base enclosure consists of the following components: ● ● ● ● ● Slots for 25 2.5-inch drives Midplane Node Power supply module EMI shielding Drives Each drive resides in a drive carrier.
Node Each base enclosure contains two nodes. The node is the intelligent component providing the compute capability of the base enclosure. Node power supply module Each node contains a power supply module that connects the system to an exterior power source. If one power supply fails, redundant power supplies can keep the entire base enclosure running. The power supplies include LEDs to indicate component status. A latch on the module locks it into place to ensure proper connection.
Figure 2. Base enclosure and drive LEDs Table 2. Base enclosure and drive LEDs LED Location Drive fault Drive activity Base enclosure power and fault State Description Amber Fault has occurred. Off No fault has occurred. Blue Drive activity. Off Drive is powered off. Blue Power is on. No fault has occurred. Amber Power is on. Fault has occurred within the enclosure. Blue and amber alternating System not initialized. Off Power is off.
Figure 4. WWN Seed Tag location Base enclosure rear view The rear of the base enclosure contains two nodes: node A and node B. Each node contains the following hardware components: ● One embedded module ● Two optional I/O modules ● One power supply module Figure 5. Base enclosure rear view with hardware component locations Table 3.
The first two ports of the 4-port card on the embedded module connect to a 10GbE/25GbE Ethernet switch. NOTE: Both nodes must have the same type of embedded modules in the same slots.
NOTE: 25GbE SFPs only support 25GbE speeds. The 4-port 10GBaseT embedded module serves Ethernet traffic and iSCSI block protocol. Speeds of 1GbE and 10 GbE are supported. Embedded module and 4-port card LED status Figure 7. Embedded module LEDs Table 5. Embedded module LEDs LED Embedded module power Ethernet port link Ethernet port activity SAS port/activity Link Port link Node fault Node power Location State Description Amber Embedded module has faulted.
Table 5. Embedded module LEDs (continued) LED Location Unsafe to remove State Description White Do not remove the node. Improper removal could cause data loss. Off Safe to remove the embedded module when the embedded module has been properly prepared. Base enclosure I/O module types 4-port 25GbE SFP based I/O module The 4-port 25GbE SFP based I/O module is an Ethernet I/O module that is used to serve Ethernet network traffic and iSCSI block protocol to hosts for the platform.
Port labels in PowerStore Manager In PowerStore Manager, on the Hardware > Rear View tab for an appliance, the following port abbreviations are used: ● FEPort - Physical Frontend Port ● hFEPort - Hypervisor Frontend Port ● vFEPort - Virtual Frontend Port Base enclosure power supply Figure 9. Base enclosure power supply LEDs Table 7. Base enclosure power supply LEDs LED Location State Description Solid amber Power supply or backup fault. Check cable connection. Off No fault.
Fan module Seven redundant fan modules connect to the motherboard within the node. These fans provide continuous airflow through the front drives and through the rear of the node to keep the components at optimal operating temperatures. NOTE: If two cooling modules fault within the same node, the node performs a protective thermal shutdown.
3 Expansion enclosure component descriptions Topics: • 2U, 25-drive expansion enclosure 2U, 25-drive expansion enclosure The 2U, 25-drive expansion enclosure includes slots for 25 2.5-inch drives. It uses a 12-Gb/s SAS interface for communication between the nodes and the expansion enclosure. 2U, 25-drive expansion enclosure front view The front of the 2U, 25-drive expansion enclosure includes the following components: ● Drives in 2.5-inch carriers (hot-swappable) ● Status LEDs Figure 10.
Table 9.
2 1 8 x4 # x4 7 6 5 4 3 Figure 12. 2U, 25-drive expansion enclosure LCC ports, LEDs, and connectors Table 10. 2U, 25 (2.5-inch) expansion enclosure LCC component locations Location Description 1 Ejector latch handles 2 LCC fault LED 3 LCC management port (RJ-12) (not used) 4 Back-end bus ID display (always displays 01) 5 LCC power LED 6 Enclosure ID display 7 12-Gb/s SAS ports 8 SAS port status LED Table 11.
LCCs have individual soft-start switches that protect the drives and LCCs when they are installed while the expansion enclosure is powered on. The enclosure cooling system includes two dual-blower modules. Power supply and cooling module connectors and LEDs The following figure shows an example of a 2U, 25-drive expansion enclosure AC power supply and cooling module with a recessed power in plug and status LEDs. 1 2 3 4 6 5 Figure 13.
4 Technical specifications Topics: • • • • • Physical specifications Dimensions and weight Power requirements Operating limits Shipping and storage requirements Physical specifications Table 14. Physical specifications Per Appliance 1000 3000 5000 7000 9000 CPU 4 x Intel CPUs, 32 cores, 1.8 GHz 4 x Intel CPUs, 48 cores, 2.1 GHz 4 x Intel CPUs, 64 cores, 2.1 GHz 4 x Intel CPUs, 80 cores, 2.4 GHz 4 x Intel CPUs, 112 cores, 2.
Table 16. 2U, 25-drive expansion enclosure dimensions and weight (continued) Dimension Value Width 44.45 cm (17.5 in) Depth 34.29 cm (13.5 in) NOTE: The weight does not include mounting rails. Allow 3.6 kg (8 lbs) for a rail set. Power requirements Power requirements will vary depending on system configuration, loading, and environmental conditions. The table below provides worst case data. To estimate power consumption values for your specific environment, go to https:// powercalculator.emc.com/.
Table 18. High ambient temperature shutdown (continued) Ambient temperature Hardware fault Consequence to less than 45° C (113° F) , the system powers on.. Any Three hottest drives have average temperature of 50° C (122° F) System shuts down after five minute timer expires. Any Two fans fault System shuts down after five minute timer expires. Operating limits Table 19.
Table 21. Base enclosure airflow Max Airflow CFM Min Airflow CFM Max Power Usage (Watts) 165 CFM 50 CFM 850 W Environmental recovery If the system exceeds the maximum ambient temperature by approximately 10°C (18°F), the nodes in the system begin an orderly shutdown that saves cached data, and then shut themselves down. Link control cards (LCCs) in each expansion enclosure in the system power down drives but remain powered on.
Shock and vibration Products have been tested to withstand the shock and random vibration levels. The levels apply to all three axes and should be measured with an accelerometer on the equipment enclosures within the cabinet and shall not exceed: Platform condition Response measurement level Non operational shock 10 G’s, 7 ms duration Operational shock 3 G’s, 11 ms duration Non operational random vibration 0.40 Grms, 5–500 Hz, 30 minutes Operational random vibration 0.
