Dell EMC PowerStore Hardware Information Guide for PowerStore 500T Model Version 2.x June 2021 Rev.
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Contents Additional Resources.....................................................................................................................4 Chapter 1: Platform overview........................................................................................................ 5 Description............................................................................................................................................................................
Preface As part of an improvement effort, revisions of the software and hardware are periodically released. Some functions that are described in this document are not supported by all versions of the software or hardware currently in use. The product release notes provide the most up-to-date information about product features. Contact your service provider if a product does not function properly or does not function as described in this document.
1 Platform overview Topics: • Description Description PowerStore 500T appliances serve Block and File services, and the software stack is deployed directly on the system. The PowerStore 500T hardware consists of a 2U, two node storage solution. The enclosure as a whole is called a base enclosure. Between the front and rear of the enclosure, a mid-plane distributes power and signals to all the enclosure components. On the front of the base enclosure, drives connect to the mid-plane.
2 Base enclosure component descriptions Topics: • • • • Base enclosure component overview Base enclosure front view Base enclosure rear view Node internal components Base enclosure component overview The 2U, 25-drive base enclosure consists of the following components: ● ● ● ● ● Slots for 25 2.5-inch NMVe drives Midplane Two nodes Power supply module EMI shielding Drives Each drive resides in a drive carrier.
EMI shielding EMI compliance requires a properly installed electromagnetic interference (EMI) shield in front of the base enclosure drives. When installed in cabinets that include a front door, the base enclosure includes a simple EMI shield. Other installations require a front bezel that has a locking latch and integrated EMI shield. Remove the bezel or shield to remove and install the drives. Base enclosure front view The front of the base enclosure contains the following elements: Figure 1.
Table 2. Base enclosure and drive LEDs (continued) LED Location Base enclosure power and fault State Description Blue Power is on. No fault has occurred. Amber Power is on. Fault has occurred within the enclosure. Blue and amber alternating System not initialized. Off Power is off. System identification tags The Service Tag and World Wide Name Seed are serialized labels for tracking hardware components.
● One embedded module ● Two optional I/O modules ● One power supply module Figure 5. Base enclosure rear view with hardware component locations Table 3.
● One non-maskable interrupt (NMI) button ● One mini-serial port (unused) ● One DB9 serial port (service) NOTE: The following figure shows the location of these components on the embedded module in node A. The locations of the components in node B are mirrored. Figure 6. Embedded module rear view with component locations Table 4.
Embedded module and 4-port card LED status Figure 7. Embedded module LEDs Table 5. Embedded module LEDs LED Unsafe to remove Node power Node fault 4-port card port link Ethernet port activity Ethernet port link SAS port/activity link 2-port card port link Location State Description White Do not remove the node. Improper removal could cause data loss. Off Safe to remove the embedded module when the embedded module has been properly prepared. Green Node is on (main power).
Table 5. Embedded module LEDs (continued) LED Location Embedded module power State Description Amber Embedded module has faulted. Off No fault has occurred, normal operation. Base enclosure I/O module types 4-port 25GbE SFP based I/O module The 4-port 25GbE SFP based I/O module is an Ethernet I/O module that is used to serve Ethernet network traffic and iSCSI block protocol to hosts for the platform.
Base enclosure power supply Figure 9. Base enclosure power supply LEDs Table 7. Base enclosure power supply LEDs LED Location State Description Solid amber Power supply or backup fault. Check cable connection. Off No fault. DC power (output) - Not currently supported Green N/A Off N/A AC power (input) Green AC power is on. Off AC power is off. Verify source power.
3 Technical specifications Topics: • • • • • Physical specifications for PowerStore 500T Dimensions and weight for PowerStore 500T Power requirements for PowerStore 500T Operating limits Shipping and storage requirements Physical specifications for PowerStore 500T ● CPU: 2 x Intel CPUs, 24 cores, 2.2 GHz (One CPU in each node) ● Memory: 192 GB Dimensions and weight for PowerStore 500T Base enclosure Table 8. 2U, 25-drive base enclosure dimensions and weight Dimension Value Weight (fully populated) 37.
Power requirements for PowerStore 500T Power requirements will vary depending on system configuration, loading, and environmental conditions. The table below provides worst case data. To estimate power consumption values for your specific environment, go to https:// powercalculator.emc.com/. Table 9. Power requirements Requirement PowerStore 500T Maximum input power 100 to 240 VAC ± 10%, single phase AC line current (operating maximum) 10.6 A max at 100 VAC 5.
Table 11. Operating limits (continued) Description Limit Improbable: Lower temp 1°C per 175 M above 950 M Shipping and storage requirements CAUTION: Systems and components must not experience changes in temperature and humidity that are likely to cause condensation to form on or in that system or component. Do not exceed the shipping and storage temperature gradient of 45°F/hr (25°C/hr). Table 12.
The data center should maintain a cleanliness level as identified in ISO 14664-1, class 8 for particulate dust and pollution control. The air entering the data center should be filtered with a MERV 11 filter or better. The air within the data center should be continuously filtered with a MERV 8 or better filtration system. In addition, efforts should be maintained to prevent conductive particles, such as zinc whiskers, from entering the facility.
