Specifications

ManualsBrandsDell ManualsServerR210 II

PowerEdge R210 II

Technical Guide

The PowerEdge

R210 II offers

performance, energy

efficiency and ease

of management for

businesses of all

sizes.

Summary of content (67 pages)

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PowerEdge R210 II Technical Guide The PowerEdge R210 II offers performance, energy efficiency and ease of management for businesses of all sizes.
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This document is for informational purposes only. Dell reserves the right to make changes without further notice to any products herein. The content provided is as is and without express or implied warranties of any kind. Dell, the DELL logo, PowerEdge, OpenManage, and ReadyRails are trademarks of Dell, Inc. Intel, Xeon, Celeron, and Pentium are registered trademarks and Core is a trademark of Intel Corporation in the U.S. and other countries.
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Table of Contents 1 2 3 4 5 6 7 Product Comparison ........................................................................................... 7 1.1 Overview .................................................................................................. 7 1.2 Key Benefits .............................................................................................. 7 1.3 Flexible, Secure Technology............................................................................ 7 1.4 Easy to Manage .....
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7.1 Overview ................................................................................................ 7.2 DIMMs Supported ....................................................................................... 7.3 DIMM Slots ............................................................................................... 7.4 Speed .................................................................................................... 7.5 Sparing ............................................................
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14.2 Rails ...................................................................................................... 14.3 Cable Management Arm (CMA) ....................................................................... 14.4 Rack View ............................................................................................... 15 Operating Systems ........................................................................................... 16 Systems Management ................................................
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Figures Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure Figure 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. Chassis Dimensions .................................................................................. Front View (With Bezel) ............................................................................ Front View (Without Bezel) ........................................................................ Back View ............................................
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1 Product Comparison 1.1 Overview The PowerEdge R210 II is an entry-level, yet enterprise ready, ultra-dense 1-socket 1U rack server that is well suited for a broad range of workloads, from small businesses applications to high-density, scale-out compute farms. It offers the performance and features to run your business applications that facilitate data coordination and sharing, data protection, management, and scalability to support business growth.
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functionality as well as offering email, remote access, and collaboration to help take your business to the next level. The R210 II also includes lower wattage power supplies and features a built-in user interface for ease of deployment. With the PowerEdge R210 II you can:  Protect data with hardware- and software-enabled encryption.  Secure business information with a RAID configuration to make copies of data automatically.
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Feature R210 R210 II R310 DIMMs 4 DDR3 1066/1333MT/s 4 DDR3 up to 1600MT/s 6 DDR3 1066/1333MT/s Min/Max RAM 1GB/32GB 1GB/32GB 1GB/32GB Hard Drive Bays 2 x 3.5” or 2 x 2.5” 2 x 3.5” or 4 x 2.5” 4 x 3.5” or 4 x 2.
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Feature R210 R210 II R310 USB 2 front, 2 back, 2 internal 2 front, 2 back, 2 internal 2 front, 2 back, 2 internal Power Supplies Non-redundant, 250W (80+ Bronze) autoranging (100V~240V) Non-redundant, 250W (80+ Bronze) auto-ranging (100V~240V) Non-redundant, 350W (80+ Bronze) Optional redundant, 400W (80+ Silver) auto-ranging (100V~240V) Fans Non-redundant, non-hotpluggable Non-redundant, non-hotpluggable Non-redundant, non-hotpluggable Form Factor 1U Rack 1U Rack 1U Rack Dell PowerEdge
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2 Key Technologies Key technologies on the Dell PowerEdge™ R210 II include the following:  New processors, including the Intel® Xeon® processor E3-1200 product family, Intel Xeon processor E3-1200 V2 product family, Intel Pentium G600 and G800 series, and Intel Celeron G400 and G500 series  Improved acoustics in small offices or branch offices over the predecessor system (PowerEdge R210)  Shorter rack rail kits  Front ear rack mounting option  Up to 1600MT/s 2 GB-based memory  8 GB UDIMMs
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3 System Overview Table 2.
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Feature Technical Specification Communications Broadcom® NetXtreme® 5709 Dual Port Gigabit Ethernet NIC, Copper, with TOE PCIe x4 Broadcom NetXtreme 5709 Dual Port Gigabit Ethernet NIC, Copper, TOE/iSCSI PCIe x4 Broadcom NetXtreme II 5709 Quad Port Gigabit Ethernet NIC, Copper, with TOE/iSCSI PCIe x4 Intel Gigabit ET Dual Port Adapter, Gigabit Ethernet NIC, PCIe x4 Intel Gigabit ET Quad Port Adapter, Gigabit Ethernet NIC, PCIe x4 Power Supply Single cabled power supply (250W) Availability Quad-pack L
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Feature Technical Specification configurations. If not configured according to the product documentation, the software will generate warnings to correct the configuration. After a certain amount of time, the software will only run for one hour at a time until the configuration is corrected. For more information about these features review the product documentation located at go.microsoft.
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4 Mechanical 4.1 Chassis Description The PowerEdge R210 II is a 1U rack-mount design that supports the following features:          Two cabled 3.5” drive bays for SATA or SAS hard drives or four 2.
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4.3 Front Panel View and Features Figure 2 and Figure 3 show the front views of the PowerEdge R210 II. Figure 2. Figure 3. Front View (With Bezel) Front View (Without Bezel) See the Front-Panel Features and Indicators section in the About Your System chapter of the PowerEdge R210 II Owner’s Manual on Dell.com/Support/Manuals for more information. 4.4 Back Panel View and Features Figure 4 shows the back view of the PowerEdge R210 II. Figure 4.
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4.5 Power Button LED All Dell PowerEdge servers have a green LED integrated in the power button which indicates the system’s power state. Figure 5. Power Button See the About Your System chapter of the PowerEdge R210 II Owner’s Manual on Dell.com/Support/Manuals for more information. 4.6 System Status ID The System Status ID indicators are two LEDs—one on the front panel of the system and one on the back panel. These LEDs indicates the system state.
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Figure 6. Internal Chassis View 4.9 Rails 4.9.1 ReadyRails Static Rails ReadyRailsTM Static Rails for 4-post and 2-post racks support the following:  Tool-less installation in 19” EIA-310-E compliant square or unthreaded round hole 4-post racks including all generations of Dell racks  Tooled installation in 19” EIA-310-E compliant threaded hole 4-post and 2-post racks See section 14 for more details.
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4.10 Fans There are three system fans located in the R210 II system. For information on removing and installing the system fans, see the Installing System Components chapter of the PowerEdge R210 II Owner’s Manual on Dell.com/Support/Manuals for more information. 4.11 LED Control Panel Figure 7 and Figure 8 show the LED control panel. Figure 7. Front Panel View with LED Control Panel Figure 8.
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4.12.3 Hard Drive Cabled hard drives are only accessible by opening the top cover, thus locking the top cover secures the hard drives. For information about installing or removing the hard drives, see the Hard Drives section in the Installing System Components chapter in the PowerEdge R210 II Owner’s Manual on Dell.com/Support/Manuals. 4.12.
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4.14 Battery A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the Real-Time Clock and CMOS RAM on the Intel® SP5100 chip. 4.14.1 Field Replaceable Units (FRU) The planar contains a serial EEPROM to store Field Replaceable Unit (FRU) information including Dell part numbers, part revision levels, and serial numbers. This information is used by the SEL (system event log) and the BMC (baseboard management controller). 4.
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5 Power, Thermal, Acoustic 5.1 Power Supplies The base system includes a single 250W power supply. This unit provides power to the planar, the internal hard drive bays, and one slim optical disk drive bay. Power is soft-switched, allowing power cycling using a switch on the front of the system enclosure or through software control (server management functions). The power system is compatible with industry standards, such as ACPI and Server 2000.
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5.4 Environmental Specifications The airborne contaminant level is class G2 or lower as defined by ISA-S71.04-1985. Table 4 lists the environmental specifications for the R210 II. Table 4. Environmental Specifications Specification Operating Requirements Temperature Ranges (for altitude ≤ 900m or 2952.75ft) 10°C to 35°C (50°F to 95°F) 1 Non-Operating Requirements -40°C to 65°C (-40°F to 149°F) Temperature Ranges (for altitude > 900m or 2952.
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Table 5 shows the shock and vibration specifications for the R210 II. Table 5. Shock and Vibration Specifications Maximum Vibration Operating 0.26Grms at 5–350Hz for 15 minutes Storage 1.88Grms at 10–500Hz for 15 minutes Maximum Shock Operating One shock pulse in the positive z axis (one pulse on each side of the system) of 31G for 2.
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in sound, like whistles and hums. One of the sound quality metrics in the Dell specification is the prominence ratio of a tone, which is listed in Table 6.  Office environment acoustics: Compare the values for LpA in Table 6 and note that they are lower than ambient measurements of typical office environments.  Hardware configurations affect system noise levels: Dell’s thermal control provides for cooling flexible to varying hardware configurations.
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Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity. Active Hard Drives: An operating mode per ISO7779 (1999) definition 3.1.6; Section C.9 of ECMA-74 9th ed. (2005) is followed in exercising the hard disk drives. Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6; SPECPower set to 50% loading is used. LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.
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6 Processors 6.1 Overview The processors for the R210 II are based on the latest two- and four-core offerings from the Intel® Xeon® processor E3-1200 product family, Intel Xeon processor E3-1200 V2 product family, Intel Pentium® G600 and G800 series, and Intel Celeron® G400 and G500 series. 6.2 Features Key features of the R210 II processors include:  New microarchitecture on 32nm process delivers higher performance and lower power.
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Model Speed (GHz) Power (Watts) Cores L3 Cache (MB) Threads Turbo Memory (MT/s) Process Intel Xeon E3-1270 3.40 80 4 8 8 Yes 1333 32nm Intel Xeon E3-1240V2 3.40 69 4 8 8 Yes 1600 22nm Intel Xeon E3-1240 3.30 80 4 8 8 Yes 1333 32nm Intel Xeon E3-1230V2 3.30 69 4 8 8 Yes 1600 22nm Intel Xeon E3-1230 3.20 80 4 8 8 Yes 1333 32nm Intel Xeon E3-1220V2 3.10 69 4 8 4 Yes 1600 22nm Intel Xeon E3-1220 3.
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7 Memory 7.1 Overview The R210 II supports DDR3 memory, providing a high performance, high speed memory interface capable of low latency response and high throughput. For the Intel processor-based R210 II, up to 4 total DIMMs are supported.
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 Speed of the DIMMs  Speed supported by the processor  Configuration of the DIMMs The memory speed of each channel depends on the memory configuration:   For single-rank memory modules o One memory module per channel supports up to 1600 MT/s o Two memory modules per channel support up to 1600 MT/s For dual-rank memory modules o One memory module per channel supports up to 1600MT/s o Two memory modules per channel support up to 1600MT/s If memory modules with different speeds are install
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System Capacity (GB) DIMM Quantity DIMM Type DIMM Speed (MT/s) Memory Channel Number of Ranks Memory Data Width 4 2 UDIMM 1333 2 1 x8 4 4 UDIMM 1333 2 1 x8 4 1 UDIMM 1333 1 2 X8 8 4 UDIMM 1333 2 1 x8 8 2 UDIMM 1333 2 2 x8 16 4 UDIMM 1333 2 2 x8 16 2 UDIMM 1333 2 2 X8 32 4 UDIMM 1333 2 2 X8 2 1 UDIMM 1600 1 1 x8 2 2 UDIMM 1600 2 1 x8 4 1 UDIMM 1600 2 2 x8 4 2 UDIMM 1600 2 1 x8 8 1 UDIMM 1600 1 2 X8 8 4 UDIMM
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8 Chipset 8.1 Overview The PowerEdge R210 II planar incorporates the Intel C200 Series PCH chipset. The features listed below are part of the chipset. 8.2 Direct Media Interface Direct Media Interface (DMI) is the chip-to-chip connection between the processor and C200 series chipset. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities.
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8.7 Low-Pin Count (LPC) Interface The LPC bridge function of the PCH resides in PCI Device 31: Function 0. In addition to the LPC bridge function, D31:F0 contains other functional units including DMA, Interrupt controllers, Timers, Power Management, System Management, GPIO, and RTC. 8.8 Serial Peripheral Interface (SPI) The chipset implements an SPI Interface as an alternative interface for the BIOS flash device.
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8.11 USB Interface The C200 Series chipset contains up to two Enhanced Host Controller Interface (EHCI) host controllers that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to 480 Mb/s which is 40 times faster than full-speed USB. The chipset also contains up to seven Universal Host Controller Interface (UHCI) controllers that support USB full-speed and low-speed signaling. The chipset supports up to fourteen USB 2.0 ports.
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functions are designed to report errors, diagnose the system, and recover from system lockups without the aid of an external microcontroller. 8.15.1 TCO Timer The chipset’s integrated programmable TCO timer is used to detect system locks. The first expiration of the timer generates an SMI# that the system can use to recover from a software lock. The second expiration of the timer causes a system reset to recover from a hardware lock. 8.15.
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The chipset’s SMBus also implements hardware-based Packet Error Checking for data robustness and the Address Resolution Protocol (ARP) to dynamically provide address to all SMBus devices. 8.17 Intel Virtualization Technology for Directed I/O The chipset provides hardware support for implementation of Intel Virtualization Technology with Directed I/O (Intel VT-d). Intel VT-d Technology consists of technology components that support the virtualization of platforms based on Intel Architecture Processors.
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9 BIOS 9.1 Overview The R210 II BIOS is based on the Insyde® BIOS core which supports the following features:  Simultaneous Multi-Threading (SMT) support  PCI 2.3 compliant  Plug and Play 1.0a compliant  MP (Multiprocessor) 1.4 compliant  Ability to boot from hard drive, optical drive, iSCSI drive, USB key, and SD card  ACPI 2.0 support (S0, OS-S4, S5 States)  PXE and WOL support for on-board NICs  SETUP access through key at end of POST  USB 2.0 (USB boot code is 1.
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 Memory remapping support  DDR3 UDIMM memory support  UEFI shell Support  AC recovery staggering Power-Up  DIMM mismatch checking  VT-d The PowerEdge R210 II BIOS does not support the following:  BIOS language localization  BIOS recovery after bad flash  RIB Support 9.2 Supported ACPI States ● ACPI compliance: S0, S4, S5 supported ● No S1, S2, S3 (STR) support ● S4 supported by OS only Table 10.
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9.2.1.2 Maximum Performance The Maximum Performance Mode disables power management. In this mode, the processor frequency is statically set to the highest supported frequency. The power management features are implemented through two categories: fixed or generic. Fixed features use bits defined in the ACPI specification for specific capabilities. The fixed feature bits give the OS complete control over the power management of a device since the location of the bits is given to the OS in the FACP table.
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Table 12 shows the power profile options for the R210 II. Table 12.
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10 Embedded NICs/LAN on Motherboard (LOM) 10.1 Overview The PowerEdge R210 II includes a Broadcom® 5716C chip embedded on the motherboard. The 5716 chip is connected to the IOH via a PCI Express x4 gen2 link. The 5716 chip provides two 1x Gigabit Ethernet ports with two RJ-45 connectors on the rear of the system. Other details include:  The firmware for the LOM chip resides in a flash part  The R210 II supports Wake-On-LAN (WOL) from either port 10.
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 IPv4 and IPv6 large send offload  Jumbo MTU  LSO and jumbo frames  WOL capabilities  Virtualization functionality  Use of multiple queues Dell PowerEdge R210 II Technical Guide 42
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11 PCI Slots 11.
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12 Storage 12.1 Overview The PowerEdge R210 II supports the following hard drive configurations:  2 x 3.5” cabled SATA drives using the motherboard SATA connector  2 x 3.5” cabled SAS, nearline SAS, or SATA drives using an add-on storage controller  4 x 2.5” SSD or SAS drives using an add-on storage controller The hard-drive configuration must be selected at point of purchase and is not an upgrade option. 12.2 Hard Drives Table 13 lists the supported hard drives for the PowerEdge R210 II.
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Non-Mixed Drives, all SATA, all SSD, or all SAS Config Type SAS/SATA RAID SAS/SSD RAID Configurations # Name Description Min HDD Max HDD 3 MSTR1CBL Embedded SATA SW RAID (PERC S100)—RAID 1 2 2 4 ASSR0CBL Add-in SAS/SATA RAID card, RAID 0 (PERC S300) with 2 hard drives 2 2 5 ASSR0CBL Add-in SAS/SATA RAID card, RAID 0 (PERC S300) 3 4 6 ASSR1CBL Add-in SAS/SATA RAID 1 (PERC S300) 2 2 7 ASSR5CBL Add-in SAS/SATA RAID card, RAID 5 (PERC S300) 3 4 8 ASSR10CBL Add-in SAS/SATA RAID
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The PERC S300 does not support Linux® operating systems or VMware® virtualization software. 12.4 Optical Drives The R210 II supports one SATA interface DVD-ROM or DVD+/-RW. 12.5 Tape Drives External tape drives and tape libraries are supported. No internal tape drive support is available. For more information on supported tape drives and tape libraries, see Dell.com/Storage.
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13 Video The PowerEdge R210 II includes a Matrox® G200eW with 8 MB memory integrated in Winbond® WPCM450 (BMC controller). The resolutions supported are listed in Table 15. Table 15.
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14 Rack Information 14.1 Overview The ReadyRails™ static rail systems for the R210 II provide tool-less support for racks with square or unthreaded round mounting holes including all generations of Dell racks. The rail systems also offer tooled mounting support for 4-post threaded and 2-post (Telco) racks for added versatility. See Table 16 for the list of supported rails and racks. 14.2 Rails Two different static rail systems are available for the R210 II: the A4 rail system and the A6 rail system.
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Table 17.
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Figure 12. A6 Static Rail System Figure 13 shows a view of the R210 II mounted in the A4 A6 rail systems in the 2-post center-mount configuration. The rear brackets on the A6 rail system can be removed and discarded, providing a much smaller mounting footprint than the A4 rail system. Figure 13.
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Figure 14 shows the R210 II mounted in the A4 and A6 rail systems in the 2-post flush-mount configuration. The rear brackets on both the A4 and the A6 rail systems can be removed and discarded in this configuration, but the A4 rail system still provides the smaller mounting footprint. Figure 14.
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15 Operating Systems For detailed information, see the following:   Operating System Support Matrix for Dell PowerEdge Systems on Dell.com Dell PowerEdge R210 II Getting Started Guide on Dell.
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16 Systems Management 16.1 Overview Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell developed systems management solutions gives you choice and flexibility, so you can simplify and save in IT environments of any size.
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16.3 Embedded Server Management The PowerEdge R210 II implements circuitry for the next generation of Embedded Server Management. It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The optional iDRAC (Integrated Dell Remote Access Controller) is responsible for acting as an interface between the host system and its management software and the periphery devices.
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Feature Description Simplified Hardware Configuration Detects RAID controller and allows user to configure virtual disk and choose virtual disk as boot device, eliminating the need to launch a separate utility. Also provides configuration for iDRAC, BIOS, and NIC/LOM. 16.
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Key features for the iDRAC6 Enterprise include: • • • • Scripting capability with Dell’s Racadm command-line Remote video, keyboard, and mouse control with Virtual Console Remote media access with Virtual Media Dedicated network interface 16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media The iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is an 8 GB Dellbranded SD card that enables a persistent 256 MB virtual flash partition.
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Feature Base Management Functionality iDRAC6 Express Dedicated NIC iDRAC6 Enterprise vFlash Media   Security and Authentication Role-based Authority     Local Users     Active Directory    SSL Encryption    Remote Management and Remediation Remote Firmware Update     Server power control     Serial-over-LAN (with proxy)     Serial-over-LAN (no proxy)    Power capping    Last crash screen capture    Boot capture  
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Feature Base Management Functionality Trace Log Dell PowerEdge R210 II Technical Guide iDRAC6 Express iDRAC6 Enterprise  vFlash Media  58
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17 Peripherals The PowerEdge R210 II supports the following USB devices:     DVD (bootable; requires two USB ports) USB key (bootable) Keyboard (only one USB keyboard is supported) Mouse (only one USB mouse is supported) Dell PowerEdge R210 II Technical Guide 59
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Appendix A. Statement of Volatility The Dell PowerEdge R210 II contains both volatile and non-volatile (NV) components. Volatile components lose their data immediately upon removal of power from the component. Non-volatile components continue to retain their data even after the power has been removed from the component. Components chosen as user-definable configuration options (those not soldered to the motherboard) are not included in the Statement of Volatility.
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LOM (LAN [Network Interface] on Motherboard) Memory Details: Size: 4Mb (512KB) Type [e.g. Flash PROM, EEPROM]: Flash Can user programs or operating system write data to it during normal operation? Yes, under software control. Purpose? [e.g. boot code] Contains LOM boot code and configuration data How is data input to this memory? Requires vendor provided firmware file and loader program used during factory assembly or possible field update.
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TPM (Trusted Platform Module; For boards shipped outside of China; Boards sold to destinations in China do not have TPM at this time) Details Size: Unspecified size of user ROM, RAM, EEPROM; 128 bytes of OTP memory included Type [e.g. Flash PROM, EEPROM]: ROM, RAM, EEPROM Can user programs or operating system write data to it during normal operation? Yes, OS and applications that conform to the TCG standard can write data to the TPM during normal operation.
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Appendix B. Certifications B 1. Regulatory Certifications Regulatory compliance certificates can be located at the following site:  http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance /dec_conform?c=us&l=en&s=corp B 2. Product Safety Certifications The product has been certified and bears the Mark, as applicable, of the Product Safety authorities as indicated in Table 21. Table 21.
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B 3. Country/Region Authority or Mark United States NRTL Uzbekistan STZ Electromagnetic Compatibility The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated in Table 22. Table 22.
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Table 23.
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Appendix C. Industry Standards The PowerEdge R210 II system conforms to the industry standards detailed in Table 24. Table 24. Industry Standards Standard URL for Information and Specifications ACPI Advance Configuration and Power Interface Specification, v2.0c http://www.acpi.info/ Energy Star EPA Version 1.0 of the Computer Server specification http://www.energystar.gov/index.cfm?c=archives.enterprise _servers Ethernet IEEE 802.3-2005 http://standards.ieee.org/getieee802/802.3.
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Standard URL for Information and Specifications UEFI Unified Extensible Firmware Interface Specification, v2.1 http://www.uefi.org/specs/ USB Universal Serial Bus Specification, Rev. 2.0 http://www.usb.org/developers/docs/ Windows Logo Windows Logo Program System and Device Requirements, v3.10 http://www.microsoft.com/whdc/winlogo/hwrequirements.