Product Data Sheet / Brochure
Table Of Contents
- Dell EMC PowerEdge R250 Technical Specifications
- Contents
- Technical specifications
- Chassis dimensions
- System weight
- Processor specifications
- PSU specifications
- Supported operating systems
- Cooling fans specifications
- System battery specifications
- Expansion card riser specifications
- Memory specifications
- Storage controller specifications
- Drives
- Ports and connectors specifications
- Environmental specifications
Table 17. Particulate contamination specifications (continued)
Particulate contamination Specifications
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 18. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restrictions
● Four fans population is required.
● Non Dell qualified peripheral cards or peripheral cards greater than 25 W are not supported.
NOTE: DIMM blank is not required.
10 Technical specifications