User Manual
Table Of Contents
- Latitude 5490 Owner’s Manual
- Contents
- Working on your computer
- Removing and installing components
- Recommended tools
- Screw size list
- Subscriber Identity Module(SIM) board
- Base cover
- Battery
- Solid State Drive — optional
- Hard drive
- Coin-cell battery
- WLAN card
- WWAN card – optional
- Memory modules
- Keyboard lattice and Keyboard
- Heat sink
- System fan
- Power connector port
- Chassis frame
- SmartCard module
- Speaker
- System board
- Display hinge cover
- Display assembly
- Display bezel
- Display panel
- Display (eDP) cable
- Camera
- Display hinges
- Display back cover assembly
- Palm rest
- Technical specifications
- Technology and components
- System setup options
- BIOS overview
- Entering BIOS setup program
- Navigation keys
- One time boot menu
- Boot Sequence
- System Setup overview
- Accessing System Setup
- General screen options
- System Configuration screen options
- Video screen options
- Security screen options
- Secure Boot screen options
- Intel Software Guard Extensions
- Performance screen options
- Power Management screen options
- POST Behavior screen options
- Manageability
- Virtualization support screen options
- Wireless screen options
- Maintenance screen options
- Updating the BIOS
- System and setup password
- Clearing CMOS settings
- Clearing BIOS (System Setup) and System passwords
- Software
- Troubleshooting
- Contacting Dell
Table 13. Kaby Lake Refresh specifications (continued)
Intel Core i7-8550U 4.0 GHz 8 MB 4/8 15 W DDR4-2400 or
LPDDR3-2133
Intel UHD
graphics 620
Intel Core i5-8350U 3.6 GHz 6 MB 4/8 15 W DDR4-2400 or
LPDDR3-2133
Intel UHD
graphics 620
Intel Core i5-8250U 3.4 GHz 6 MB 4/8 15 W DDR4-2400 or
LPDDR3-2133
Intel UHD
graphics 620
DDR4
DDR4 (double data rate fourth generation) memory is a higher-speed successor to the DDR2 and DDR3 technologies and allows
up to 512 GB in capacity, compared to the DDR3's maximum of 128 GB per DIMM. DDR4 synchronous dynamic random-access
memory is keyed differently from both SDRAM and DDR to prevent the user from installing the wrong type of memory into the
system.
DDR4 needs 20 percent less or just 1.2 volts, compared to DDR3 which requires 1.5 volts of electrical power to operate. DDR4
also supports a new, deep power-down mode that allows the host device to go into standby without needing to refresh its
memory. Deep power-down mode is expected to reduce standby power consumption by 40 to 50 percent.
DDR4 Details
There are subtle differences between DDR3 and DDR4 memory modules, as listed below.
Key notch difference
The key notch on a DDR4 module is in a different location from the key notch on a DDR3 module. Both notches are on the
insertion edge but the notch location on the DDR4 is slightly different, to prevent the module from being installed into an
incompatible board or platform.
Figure 1. Notch difference
Increased thickness
DDR4 modules are slightly thicker than DDR3, to accommodate more signal layers.
Figure 2. Thickness difference
Curved edge
DDR4 modules feature a curved edge to help with insertion and alleviate stress on the PCB during memory installation.
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Technology and components