Technical Guide

Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from
particulate and gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and
results in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions
is the responsibility of the customer.
Table 49. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE: This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Table 50. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal air restrictions
Thermal air restrictions for different configurations
Table 51. 8 x 3.5-inch drive configuration
Standard Operating Support
(ASHRAE A2 compliant)
NOTE: All options supported unless
otherwise noted.
Extended ambient 40° C Operating
Support (ASHRAE A3 compliant)
Extended ambient 45° C Operating
Support (ASHRAE A4 compliant)
● 3x or 4x STD fans support only
processor with TDP<=185W
● With STD fans, the following OCP
3.0 and NIC support only optic cable
with thermal spec 85C and power
<=1.2 W
● 3x or 4x STD fans configurations not
supported.
● 6x or 8x STD fans configurations
with processor TDP > 120 W is not
supported.
● TBU not supported.
● STD fans configurations are not
supported.
● 3x or 4x HPR fans configurations
with CPU TDP > 165 W are not
supported.
● TBU not supported.
60 Appendix A. Additional specifications