Service Manual

36: VR 방열판 분리.................................................................................................................... 60
필수 구성 요소....................................................................................................................................................................60
절차.......................................................................................................................................................................................60
37: VR 방열판 장착..................................................................................................................... 61
절차........................................................................................................................................................................................61
작업후 필수 조건.................................................................................................................................................................61
38: 프로세서 방열판 조립품 분리.......................................................................................... 62
필수 구성 요소....................................................................................................................................................................62
절차.......................................................................................................................................................................................62
39: 프로세서 방열판 조립품 장착.......................................................................................... 64
절차.......................................................................................................................................................................................64
작업후 필수 조건................................................................................................................................................................64
40: 섀시 분리.........................................................................................................................65
필수 구성 요소....................................................................................................................................................................65
절차.......................................................................................................................................................................................65
41: 섀시 장착......................................................................................................................... 67
절차.......................................................................................................................................................................................67
작업후 필수 조건................................................................................................................................................................67
42: 프로세서 제거...................................................................................................................... 68
필수 구성 요소....................................................................................................................................................................68
절차.......................................................................................................................................................................................68
43: 프로세서 장착.......................................................................................................................70
절차.......................................................................................................................................................................................70
작업후 필수 조건.................................................................................................................................................................71
44: 무선 카드 분리......................................................................................................................72
필수 구성 요소.................................................................................................................................................................... 72
절차....................................................................................................................................................................................... 72
45: 무선 카드 장착......................................................................................................................73
절차....................................................................................................................................................................................... 73
작업후 필수 조건................................................................................................................................................................ 74
46: 안테나 분리..........................................................................................................................75
필수 구성 요소.................................................................................................................................................................... 75
절차.......................................................................................................................................................................................75
47: 안테나 장착.......................................................................................................................... 77
절차....................................................................................................................................................................................... 77
작업후 필수 조건................................................................................................................................................................ 77
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