User's Manual

DFZM-E82xx
Data Sheet Sheet 34 of 41 Dec 31, 2013
Proprietary Information and Specifications are Subject to Change
60-180 sec
Room temp.
50 sec max
150
200
245
217
(°C )
60-150 sec
Time
Peak temp
250°c max 10 sec max
245°c±5°c for
10 ~30 sec
Figure 6-6: Reflow temperature profile
Note:
1. Perform adequate test in advance as the reflow temperature profile will vary accordingly to the
conditions of the parts and boards, and the specifications of the reflow furnace.
2. Be careful about rapid temperature rise in preheat zone as it may cause excessive slumping of the
solder paste.
3. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed
excessively, fine balls and large balls will generate in clusters at a time.
4. If the temperature is too low, non-melting tends to be caused in the area with large heat capacity after
reflow.
5. Be careful about sudden rise in temperature as it may worsen the slump of solder paste.
6. Be careful about slow cooling as it may cause the positional shift of parts and decline in joining
strength at times.