DFZM-TT2xx Data sheet DFZM-TT2xx An IEEE 802.15.4 System–On-Chip ZigBee module Data Sheet Sheet 1 of 39 Feb.
DFZM-TT2xx Contents 1. Features ............................................................................................................................................... 4 2. Zigbee Model No. Definition.............................................................................................................. 6 3. Architecture......................................................................................................................................... 7 3-1.Block Diagram..............
DFZM-TT2xx 9. Federal Communications Commission (FCC) Statement................................................................. 38 Data Sheet Sheet 3 of 39 Feb.
DFZM-TT2xx DFZM-TT2xx IEEE802.15.4 System-On-Chip ZigBee Module T HIS DOCUMENT describes the DFZM-TT2xx Zigbee module hardware specification. The CC2538 based modules provide cost effective, low power, and flexible platform to add ZigBee connectivity for embedded devices for a variety of applications, such as wireless sensors and energy monitoring.
DFZM-TT2xx • Hardware debug support. ► Interfaces: • On board antenna or external antenna options. • µDMA. • 4 × General-Purpose Timers (Each 32-Bit or 2 × 16-Bit). • USB 2.0 Full-Speed Device (12 Mbps). • 2 × SPI. • Two universal asynchronous receiver/transmitters (UARTs) with IrDA, 9-bit (one UART with modem flow control). • I2C. • Four 32-bit timers (up to eight 16-bit) with pulse width modulation (PWM) capability and synchronization. • Up to 28 configurable general purpose I/Os.
DFZM-TT2xx 2. Zigbee Model No. Definition D F Z M - T T 2 2 0 Data Sheet - DT 0 R Sheet 6 of 39 Free-lead E=Pb free R=RoHS N=NG L=Process with Lead Serial no. 0~9 then A~Z Customer code DT= Delta Define Antenna Version 0= External Antenna 1= Onboard Antenna Power Version 1= High Power 2= Low Power Frequency 2= 2.4GHz Chip Type T=CC2538 Chip Vendor T=TI Product-type M= Module Property Z= Zigbee Substrate F= FR4 Company D= DELTA Feb.
DFZM-TT2xx 3. Architecture 3-1.Block Diagram ANT Balun Digital I/O VCC 32K X’tal 32M X’tal Figure 3-1: DFZM-TT22x Block Diagram ANT CC2591 Digital I/O VCC 32K X’tal 32M X’tal Figure 3-2: DFZM-TT21x Block Diagram Data Sheet Sheet 7 of 39 Feb.
DFZM-TT2xx 3-2.Block Diagram Description 3-2-1.Overview DFZM-TT2xx module is a highly integrated ZigBee system-on-chip (SOC) that contains the following: • The module includes TI CC2538 SoC, which contains CPU- and memory-related, peripherals-related, clocks and power management-related in a single package. • The module features an IEEE802.15.4-compliant radio transceiver with onboard 32 KHz & 32 MHz crystal circuitries, RF, and certified on board antenna or external antenna options.
DFZM-TT2xx • Harvard architecture characterized by separate buses for instruction and data. • Efficient processor core, system and memories. • Hardware division and fast multiplier. • Deterministic, high-performance interrupt handling for time-critical applications. • Memory protection unit (MPU) provides a privileged mode for protected operating system functionality. • Enhanced system debug with extensive breakpoint capabilities and debugging through power modes.
DFZM-TT2xx • Secure key storage memory. • High throughput, low latency. • Public key accelerator. • Elliptic Curve Cryptography (ECC) and RSA-2048. • Support for RSA-2048 makes it ideal for ESIs. • Keeps the key exchange algorithms out of the CPU cycle budget and reduces energy consumption. 3-2-4.Peripherals The CC2538 device supports both asynchronous and synchronous serial communications with: • USB 2.0 FS device. • Two UARTs with 9-bit. • I2C module. • Two SSI.
DFZM-TT2xx The two UARTs have the following features: • Programmable baud-rate generator allowing speeds up to 2 Mbps for regular speed (divide by 16) and 4 Mbps for high speed (divide by 8). • Separate 16x8 TX and RX FIFOs to reduce CPU interrupt service loading. • Programmable FIFO length, including 1-byte deep operation providing conventional double-buffered interface. • FIFO trigger levels of 1/8, 1/4, 1/2, 3/4, and 7/8. • Standard asynchronous communication bits for start, stop, and parity.
DFZM-TT2xx – Supports both transmitting and receiving data as either a master or a slave. – Supports simultaneous master and slave operation. • Four I2C modes: – Master transmit. – Master receive. – Slave transmit. – Slave receive. • Two transmission speeds: Standard (100 Kbps) and fast (400 Kbps). • Clock low time-out interrupt. • Dual slave address capability. • Master and slave interrupt generation: – Master generates interrupts when a TX or RX operation completes (or aborts due to an error).
DFZM-TT2xx • Efficient transfers using the µDMA controller: – Separate channels for TX and RX. – Receive single request asserted when data is in the FIFO; burst request asserted when FIFO contains four entries. – Transmit single request asserted when there is space in the FIFO; burst request asserted when FIFO contains four entries. GPIO pins offer flexibility for a variety of connections. The CC2538 GPIO module is comprised of four GPIO blocks, each corresponding to an individual GPIO port.
DFZM-TT2xx • Converter uses an internal regulated reference, AVDD or an external reference. • Efficient transfers using the µDMA controller. – Dedicated channel for each sample sequencer. An analog comparator is a peripheral that compares two analog voltages, two external pin inputs, and provides a logical output that signals the comparison result. The CC2538 microcontroller provides an independent integrated and low-power analog comparator that can be active in all power modes.
DFZM-TT2xx The six various operating modes (power modes) are called active mode, Sleep mode, PM0, PM1, PM2, and PM3. Active mode is the normal operating mode, whereas PM3 has the lowest power consumption. The impact of the different power modes on system operation is shown in Table 3-1, together with voltage regulator and oscillator options.
DFZM-TT2xx Figure 3-3: DFZM-TT2xx Simple Flow Diagram for Power Management Data Sheet Sheet 16 of 39 Feb.
DFZM-TT2xx 4. Pin-out and Signal Description 4-1.Device Pin-out Diagram (Module top view) Figure 4-1: DFZM-TT2xx Device Pin-out Diagram (Module top view) Data Sheet Sheet 17 of 39 Feb.
DFZM-TT2xx 4-2.
DFZM-TT2xx pull-down 25 GND Ground Ground 26 PA0 Digital I/O GPIO port A pin 0. ROM bootloader UART RXD 27 PA1 Digital I/O GPIO port A pin 1. ROM bootloader UART TXD 28 PA2 Digital I/O GPIO port A pin 2. ROM bootloader SSI CLK 29 GND Ground Ground 30 PA3 Digital I/O GPIO port A pin 3. ROM bootloader SSI SEL 31 PA4 Digital I/O GPIO port A pin 4. ROM bootloader SSI RXD 32 PA5 Digital I/O GPIO port A pin 5.
DFZM-TT2xx 5. Electrical Characteristics 5-1.Absolute Maximum Rating Conditions beyond those cited in Table 5-1 may cause permanent damage to the DFZM-TT2xx, and must be avoided. Parameter Minimum Maximum Unit Supply voltage(VCC) -0.3 3.9 V Storage temperature range -40 125 ºC Voltage on any digitai I/O -0.3 VCC+0.3, ≤3.9 V Table 5-1: Absolute Maximum Ratings 5-2.
DFZM-TT2xx running at 32-MHz with flash access,.
DFZM-TT2xx USB 48-MHz clock running, USB enabled 3.8 mA ADC When converting 1.2 mA Erase 12 mA Burst write peak current 8 mA Flash Table 5-3: Poewr Consumption 5-4.DC Characteristics Test Conditions: TA=25 ºC, VCC=3.0V Parameter Test conditions Min Typ Max Unit 0.5 V Logic-0 input voltage Logic-1 input voltage 2.
DFZM-TT2xx Parameter Test conditions Min Typ Max Unit oscillator off. Start-up of regulator and 16-MHz RCOSC Initially running on 16-MHz RCOSC, with 32-MHz XOSC OFF Active 0.5 ms TX or RX With 32-MHz XOSC initially on RX/TX and TX/RX turnaround USB PLL start-up time With 32-MHz XOSC initially on 192 us 192 us 32 Table 5-5: Wake-up and Timing 5-6.Radio Parameters Test Conditions: TA=25 ºC, VCC=3.
DFZM-TT2xx Parameter Min Saturation(Maximum input level) Typ Max 10 Unit Notes dBm PER = 1%, Table 5-6: Radio Parameters 5-7.ADC Parameters Test Conditions: TA=25 ºC, VCC=3.0V Parameter Test Condiction Min Typ Max Unit Input voltage 0 VCC V External reference voltage 0 VCC V External reference voltage differential 0 VCC V Input resistance, signal Using 4-MHz clock speed 197 kΩ Full-scale signal(1) Peak-to-peak, defines 0 dBFS 2.97 V Single-ended input, 7-bit setting 5.
DFZM-TT2xx CMRR Differential input, 12-bit setting, 1-kHz sine Common-mode rejection ratio (0 dBFS), limited by ADC resolution Differential input, 12-bit setting, 1-kHz sine Crosstalk (0 dBFS), limited by ADC resolution Offset Midscale Gain error 84 dB 84 dB -3 mV 0.68 % DNL(1) 12-bit setting, mean 0.05 Differential nonlinearity 12-bit setting, maximum 0.9 INL(1) 12-bit setting, mean 4.6 Integral nonlinearity 12-bit setting, maximum 13.3 Single-ended input, 7-bit setting 35.
DFZM-TT2xx 5-8.Control Input AC Characteristics Test Conditions: TA= -40~110 ºC, VCC= 2.0~3.6V Parameter Test conditions System clock, fSYSCLK TSYSCLK = 1/fSYSCLK Mim Typ Max Unit 32 MHz The undivided system clock is 32 MHz when crystal oscillator is 16 used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. See item 1, Figure 5-1. This is the shortest pulse that is RESET_N low duration recognized as a complete reset pin request.
DFZM-TT2xx 6. Package and Layout Guidelines 6-1.Recommended PCB Footprint and Dimensions Figure 6-1: DFZM-TT2xx Module Recommended PCB Footprint (in mm) Data Sheet Sheet 27 of 39 Feb.
DFZM-TT2xx Figure 6-2: DFZM-TT2xx Module Dimensions (in mm) Data Sheet Sheet 28 of 39 Feb.
DFZM-TT2xx 6-2.Layout Guidelines Keep out area for onboard antenna. All layers on the PCB must be clear. (i.e. No GND, Power trace/plane, traces.) Note: If guidelines are not followed, DFZM-TT2xx range with onboard chip antenna will be compromised. Figure 6-3: DFZM-TT2xx module onboard antenna keep-out layout guidelines (in mm) Notes: 1. All Dimensions are in mm. Tolerances shall be ±0.10 mm. 2. Absolutely no metal trace or ground layer underneath this area. 3.
DFZM-TT2xx • Do not use a metallic or metalized plastic for the end product enclosure. • Recommendation is to keep plastic enclosure clearance of 1cm from top and bottom of the DFZM-TT2xx onboard antenna keep-out area, if possible. 5-mm (0.2 in) clearance shall be the minimum as shown in Figure 6-4. Figure 6-4 Recommended clearance above and below the PCB trace antenna 6-2-1.Surface Mount Assembly The reflow profile is shown in Figure 6-8.
DFZM-TT2xx Note: 1. Perform adequate test in advance as the reflow temperature profile will vary accordingly to the conditions of the parts and boards, and the specifications of the reflow furnace. 2. Be careful about rapid temperature rise in preheat zone as it may cause excessive slumping of the solder paste. 3. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed excessively, fine balls and large balls will generate in clusters at a time. 4.
DFZM-TT2xx 6-3.Recommended Stencil Aperture Note: The thickness of the stencil should be 0.15mm over this area. Figure 6-9: DFZM-TT2xx recommended stencil aperture Data Sheet Sheet 32 of 39 Feb.
DFZM-TT2xx 7. Reference Design Schematic 8. DUT Setup DUT 接線請參考下圖 DUT 與系統板用排 PIN 對接 外接電源 3V3，電流量 500mA Data Sheet Sheet 33 of 39 Feb.
DFZM-TT2xx 系統板接線如下圖: 開啟 RF Studio 7 如下圖所示: Data Sheet Sheet 34 of 39 Feb.
DFZM-TT2xx 系統板及 DUT 上電後按下右下角 FIND DEVICE 會出現如下圖裝置在 LIST 中 double click list 中的裝置 double click list 中的裝置後出現下圖選 CC2538 按下 OK 進入 control panel Data Sheet Sheet 35 of 39 Feb.
DFZM-TT2xx Ranger extender 選 CC2591 Frequency selection on left-top, TX power choose 19.5 dBm Data Sheet Sheet 36 of 39 Feb.
DFZM-TT2xx Data Sheet Sheet 37 of 39 Feb.
DFZM-TT2xx 9. Federal Communications Commission (FCC) Statement 15.21 You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. 15.105(b) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
DFZM-TT2xx undesired operation of the device. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
