FEATURES Delphi Series E36SC120, Eighth Brick 108W DC/DC Power Modules: 18V~75Vin, 12V, 9Aout The Delphi Series E36SC120, Eighth Brick, 18V~75Vin input, single output, isolated DC/DC converters, are the latest offering from a world leader in power systems technology and manufacturing ― Delta High efficiency: 92% @ 12V/9A Size: 58.4x22.8x11.0mm (2.30”x0.90”x0.43”) w/o heat-spreader 58.4x22.8x12.7mm (2.30”x0.90”x0.
TECHNICAL SPECIFICATIONS (TA=25°C, airflow rate=300 LFM, Vin=48Vdc, nominal Vout unless otherwise noted.) PARAMETER NOTES and CONDITIONS E36SC12009(Standard) Min.
ELECTRICAL CHARACTERISTICS CURVES 11 93 10 90 84 36Vin 81 78 POWER DISSIPATION(W) EFFICIENCY(%) 87 60Vin 48Vin 24Vin 75 18Vin 72 69 66 9 8 7 6 60Vin 5 4 63 3 60 2 18Vin 48Vin 0.9 1.8 2.7 3.6 4.5 5.4 6.3 7.2 8.1 9 OUTPUT CURRENT(A) Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage at 25°C 0.9 1.8 2.7 3.6 4.5 24Vin 36Vin 5.4 6.3 7.2 8.1 9 OUTPUT CURRENT(A) Figure 2: Power dissipation vs.
ELECTRICAL CHARACTERISTICS CURVES For Negative Remote On/Off Logic 0 0 0 0 Figure 4: Turn-on transient at full rated load current (resistive load) (10 ms/div). Vin=48V. Top Trace: Vout, 3.0V/div; Bottom Trace: ON/OFF input, 5V/div Figure 5: Turn-on transient at zero load current (10 ms/div). Vin=48V. Top Trace: Vout: 3.0V/div, Bottom Trace: ON/OFF input, 5V/div 0 0 0 0 Figure 6: Output voltage response to step-change in load current (50%-75%-50% of Io, max; di/dt = 0.1A/µs; Vin is 24V).
ELECTRICAL CHARACTERISTICS CURVES 0 Figure 8: Test set-up diagram showing measurement points for Input Terminal Ripple Current and Input Reflected Ripple Current. Note: Measured input reflected-ripple current with a simulated source Inductance (LTEST) of 12 μH. Capacitor Cs offset possible battery impedance.
DESIGN CONSIDERATIONS Safety Considerations Input Source Impedance The power module must be installed in compliance with the spacing and separation requirements of the end-user’s safety agency standard, i.e., UL60950-1, CSA C22.2 NO. 60950-1 2nd and IEC 60950-1 2nd : 2005 and EN 60950-1 2nd: 2006+A11+A1: 2010, if the system in which the power module is to be used must meet safety agency requirements.
FEATURES DESCRIPTIONS Over-Current Protection The module include an internal output over-current protection circuit, which will endure current limiting for an unlimited duration during output overload. If the output current exceeds the OCP set point, the module will automatically shut down, and enter hiccup mode. For hiccup mode, the module will try to restart after shutdown. If the over current condition still exists, the module will shut down again.
FEATURES DESCRIPTIONS (CON.) If the remote sense feature is not used to regulate the output at the point of load, please connect SENSE(+) to Vo(+) and SENSE(–) to Vo(–) at the module. The output voltage can be increased by both the remote sense and the trim; however, the maximum increase is the larger of either the remote sense or the trim, not the sum of both.
THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel.
THERMAL CURVES (WITHOUT HEAT SPREADER) NTC RESISTOR THERMAL CURVES (WITH HEAT SPREADER) AIRFLOW AIRFLOW HOT SPOT 2 HOT SPOT 1 Figure 19: * Hot spot 1& NTC resistor temperature measured points. The allowed maximum hot spot 1 temperature is defined at 115℃ Figure 22: * Hot spot 2 temperature measured point. The allowed maximum hot spot 2 temperature is defined at 105℃ Output Current (A) E36SC12009(Standard) Output Current vs.
PICK AND PLACE LOCATION RECOMMENDED PAD LAYOUT (SMD) SURFACE-MOUNT TAPE & REEL E36SC12009_05152014 11
LEADED (SN/PB) PROCESS RECOMMEND TEMP. PROFILE(FOR SMD MODELS) Note: The temperature refers to the pin of E36SC, measured on the +Vout pin joint. LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE(FOR SMD MODELS) Temp. Peak Temp. 240 ~ 245 ℃ 217℃ Ramp down max. 4℃/sec. 200℃ Preheat time 100~140 sec. 150℃ Time Limited 90 sec. above 217℃ Ramp up max. 3℃/sec. 25℃ Time Note: The temperature refers to the pin of E36SC12009, measured on the +Vout pin joint.
MECHANICAL DRAWING (WITH HEAT-SPREADER) * For modules with through-hole pins and the optional heatspreader, they are intended for wave soldering assembly onto system boards; please do not subject such modules through reflow temperature profile.
MECHANICAL DRAWING (WITHOUT HEAT-SPREADER) SURFACE-MOUNT MODULE Pin No. 1 2 3 4 5 6 7 8 Name +Vin ON/OFF -Vin -Vout -SENSE TRIM +SENSE +Vout THROUGH-HOLE MODULE Function Positive input voltage Remote ON/OFF Negative input voltage Negative output voltage Negative remote sense Output voltage trim Positive remote sense Positive output voltage Note：All pins are copper alloy with matte tin(Pb free) plated over Ni under-plating.
RECOMMENDED PAD LAYOUT (THROUGH-HOLE MODULE) E36SC12009_05152014 15
PART NUMBERING SYSTEM E Type of Product E - 1/8 Brick 36 S Input Number of Voltage Outputs 36 18V~75V S - Single C 120 09 N R F Product Series Output Voltage Output Current ON/OFF Logic Pin Length/Type C-Serial number 120 – 12V 09 - 9A N- Negative P- Positive R - 0.170” N - 0.146” K - 0.
