FEATURES High efficiency: 89% @ 5V/ 15A Size: 58.4mm x 22.8mm x 9.2mm (2.30”x0.90”x0.36”) ( W/O heat-spreader ) 58.4mm x 22.8mm x 12.7mm (2.30”x0.90”x0.
TECHNICAL SPECIFICATIONS (TA=25°C, airflow rate=300 LFM, Vin=48Vdc, nominal Vout unless otherwise noted.
ELECTRICAL CHARACTERISTICS CURVES Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage at 25°C. Figure 2: Power dissipation vs. load current for minimum, nominal, and maximum input voltage at 25°C. Figure 3: Typical full load input characteristics at room temperature.
ELECTRICAL CHARACTERISTICS CURVES Figure 4: Turn-on transient at full rated load current (CC mode) (5ms/div). Vin=48V.Top Trace: Vout, 2V/div; Bottom Trace: ON/OFF input, 5V/div. Figure 5: Turn-on transient at zero load current (5ms/div). Vin=48V.Top Trace: Vout, 2V/div; Bottom Trace: ON/OFF input, 5V/div. Figure 6: Turn-on transient at full rated load current (CC mode) (5ms/div). Vin=48V.Top Trace: Vout, 2V/div; Bottom Trace: input voltage, 20V/div.
ELECTRICAL CHARACTERISTICS CURVES Figure 8: Output voltage response to step-change in load current (50%-25% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF, tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (100mV/div, 200us/div), Bottom Trace: I out (5A/div). Figure 9: Output voltage response to step-change in load current (25%-50% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF, tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (100mV/div, 200us/div), Bottom Trace: I out (5A/div).
ELECTRICAL CHARACTERISTICS CURVES Copper Strip Vo(+) 10u 1u SCOPE RESISTIVE LOAD Vo(-) Figure 12: Input reflected ripple current, is, through a 12µH source inductor at 48Vin and 15A output current (20 mA/div, 2us/div). Figure 13: Output voltage noise and ripple measurement test setup. Figure 14: Output voltage ripple at 48Vin and rated load current (Io=15A)(20 mV/div, 2us/div) Load capacitance: 1µF ceramic capacitor and 10µF tantalum capacitor. Bandwidth: 20 MHz. Figure 15: Output voltage vs.
DESIGN CONSIDERATIONS Input Source Impedance The impedance of the input source connecting to the DC/DC power modules will interact with the modules and affect the stability. A low ac-impedance input source is recommended. If the source inductance is more than a few μH, we advise adding a 10 to 100 μF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the input of the module to improve the stability.
FEATURES DESCRIPTIONS Vi(+) Vo(+) Over-Current Protection Sense(+) The modules include an internal output over-current protection circuit, which will endure current limiting for an unlimited duration during output overload. If the output current exceeds the OCP set point, the modules will automatically shut down (hiccup mode). The modules will try to restart after shutdown. If the overload condition still exists, the module will shut down again.
FEATURES DESCRIPTIONS (CON.) Output Voltage Adjustment (TRIM) To increase or decrease the output voltage set point, the modules may be connected with an external resistor between the TRIM pin and either the SENSE(+) or SENSE(-). The TRIM pin should be left open if this feature is not used.
THERMAL CONSIDERATIONS Thermal Derating Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Heat can be removed by increasing airflow over the module. The hottest point temperature of the module is +122°C.
PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL RECOMMENDED PAD LAYOUT (SMD) DS_E36SR05015_10292013 11
LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE(for SMD models) Note: The temperature refers to the pin of E36SR, measured on the pin +Vout joint. LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE(for SMD models) Temp. Peak Temp. 240 ~ 245 ℃ 217℃ Ramp down max. 4℃/sec. 200℃ 150℃ Preheat time 100~140 sec. Time Limited 90 sec. above 217℃ Ramp up max. 3℃/sec. 25℃ Time Note: The temperature refers to the pin of E36SR, measured on the pin +Vout joint.
MECHANICAL DRAWING(WITH HEAT-SPREADER) * For modules with through-hole pins and the optional heatspreader, they are intended for wave soldering assembly onto system boards; please do not subject such modules through reflow temperature profile.
MECHANICAL DRAWING(WITHOUT HEAT-SPREADER) Surface-mount module Pin No. 1 2 3 4 5 6 7 8 Name +Vin ON/OFF -Vin -Vout -SENSE TRIM +SENSE +Vout Through-hole module Function Positive input voltage Remote ON/OFF Negative input voltage Negative output voltage Negative remote sense Output voltage trim Positive remote sense Positive output voltage Pin Specification: Pins 1-3,5-7 Pins 4 & 8 1.00mm (0.040”) diameter 2. 1.50mm (0.
PART NUMBERING SYSTEM E Type of Product 36 S Input Number of Voltage Outputs E- Eighth 36-18~75V Brick S- Single R 050 15 N R F Product Series Output Voltage Output Current ON/OFF Logic Pin Length/Type R- Regular 050- 5.0V 15-15A N- Negative R- 0.170” A Option Code F- RoHS 6/6 A(Lead Free) H- Standard Functions With Heatspreader MODEL LIST MODEL NAME INPUT OUTPUT EFF @ 100% LOAD E36SR3R320NRFA 18V~75V 4.5A 3.3V 20A 88% E36SR05015NRFA 18V~75V 5A 5.