Datasheet

ManualsBrandsDELTA ELECTRONICS ManualsPSU ComponentsDC/DC converter (print) 12 Vdc 20 A 240 W No. of outputs: 1 x

DATASHEET

DS_E48SP12020_08252011

FEATURES

 High efficiency: 94.5% @12V/20A

 Size:

58.4mm x 22.8mm x 10.9mm

(2.30”x0.90”x0.43”) W/O Heat spreader

58.4mm x 22.8mm x 12.7mm

(2.30”x0.90”x0.5”) With Heat spreader

 Industry standard pin out

 Fixed frequency operation

 Input UVLO, Output OCP & OVP, OTP

 Monotonic startup into normal and

Pre-biased loads

 2250V Isolation and basic insulation

 No minimum load required

 No negative current during power on or

power off;

 ISO 9001, TL 9000, ISO 14001, QS 9000,

OHSAS 18001 certified manufacturing

facility

 UL/cUL 60950-1 (US & Canada) recognized.

APPLICATIONS

 Telecom/DataCom

 Wireless Networks

 Optical Network Equipment

 Server and Data Storage

 Industrial/Test Equipment

OPTIONS

 Positive On/Off logic

 Short pin lengths available

 Latched over voltage protection

Delphi Series E48SP Eighth Brick Family

DC/DC Power Modules: 48V in, 12V/20A out

The Delphi Series E48SP, 36~75V input, Eighth Brick, single output,

isolated DC/DC converters are the latest offering from a world leader in

power systems technology and manufacturing ― Delta Electronics,

Inc. The E48SP product provides up to 240 watts of power in an

industry standard footprint and pinout. The E48SP converter

operates from an input voltage of 36V to 75V. Efficiency is 94.5% for

the 12V output at full load. With creative design technology and

optimization of component placement, these converters possess

outstanding electrical and thermal performance, as well as extremely

high reliability under highly stressful operating conditions. All models

are fully protected from abnormal input/output voltage, current, and

temperature conditions. The Delphi Series converters meet all safety

requirements with basic insulation.

Summary of content (15 pages)

PAGE 1
` FEATURES High efficiency: 94.5% @12V/20A Size: 58.4mm x 22.8mm x 10.9mm (2.30”x0.90”x0.43”) W/O Heat spreader 58.4mm x 22.8mm x 12.7mm (2.30”x0.90”x0.
PAGE 2
TECHNICAL SPECIFICATIONS (TA=25°C, airflow rate=300 LFM, Vin=48Vdc, nominal Vout unless otherwise noted.) PARAMETER NOTES and CONDITIONS E48SP12020 (Standard) Min.
PAGE 3
ELECTRICAL CHARACTERISTICS CURVES 96 20 95 18 94 16 36V 92 48V 91 75V 90 14 Power Loss(W) Efficiency(%) 93 36V 12 48V 10 75V 8 89 6 88 4 87 2 0 86 2 4 6 8 10 12 14 16 18 0 20 2 4 Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage at 25°C 6 8 10 12 14 16 18 20 Output Current(A) Output Current(A) Figure 2: Power dissipation vs.
PAGE 4
ELECTRICAL CHARACTERISTICS CURVES For Negative Remote On/Off Logic Figure 5: Turn-on transient at zero load current (10ms/div). Vin=48V. Top Trace: Vout, 5V/div; Bottom Trace: ON/OFF input, 5V/div Figure 6: Turn-on transient at full rated load current (constant current load) (10 ms/div). Vin=48V. Top Trace: Vout, 5V/div; Bottom Trace: ON/OFF input, 5V/div For Input Voltage Start up Figure 7: Turn-on transient at zero load current (10 ms/div). Vin=48V.
PAGE 5
ELECTRICAL CHARACTERISTICS CURVES Figure 9: Output voltage response to step-change in load current (75%-50% of Io, max; di/dt = 0.1A/µs, Vin=48V). Load cap: 10µF, tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (80mV/div, 200us/div); Bottom Trace: Io (10A/div, 200us/div). Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module..
PAGE 6
ELECTRICAL CHARACTERISTICS CURVES Copper Strip Vo(+) 10u 1u SCOPE RESISTIVE LOAD Vo(-) Figure 13: Input reflected ripple current, is, through a 12µH source inductor at nominal input voltage and rated load current (20 mA/div, 2us/div). Figure 14: Output voltage noise and ripple measurement test setup Figure 15: Output voltage ripple at nominal input voltage and rated load current (Io=20A)(20 mV/div, 2us/div) Load capacitance: 1µF ceramic capacitor and 10µF tantalum capacitor. Bandwidth: 20 MHz.
PAGE 7
DESIGN CONSIDERATIONS Safety Considerations Input Source Impedance The impedance of the input source connecting to the DC/DC power modules will interact with the modules and affect the stability. A low ac-impedance input source is recommended. If the source inductance is more than a few µH, we advise adding a 33 to 100 µF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the input of the module to improve the stability.
PAGE 8
FEATURES DESCRIPTIONS Over-Current Protection Remote On/Off The modules include an internal output over-current protection circuit, which will endure current limiting for an unlimited duration during output overload. If the output current exceeds the OCP set point, the modules will automatically shut down, and enter hiccup mode or latch mode, which is optional. The remote on/off feature on the module can be either negative or positive logic.
PAGE 9
THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel.
PAGE 10
THERMAL CURVES (WITHOUT HEAT SPREADER) THERMAL CURVES (WITH HEAT SPREADER) Figure 18: Temperature measurement location * The allowed maximum hot spot temperature is defined at 122℃ Figure 20: Temperature measurement location * The allowed maximum hot spot temperature is defined at 110℃ Output Current (A) E48SP12020(Standard) Output Current vs. Ambient Temperature and Air Velocity @Vin = 48V (Transverse Orientation) Output Current (A) E48SP12020(Standard) Output Current vs.
PAGE 11
PICK AND PLACE LOCATION RECOMMENDED PAD LAYOUT (SMD) SURFACE-MOUNT TAPE & REEL DS_E48SP12020_08252011 11
PAGE 12
LEADED (Sn/Pb) PROCESS RECOMMEND TEMPERATURE PROFILE (SMD MODEL) Temperature (°C ) 250 200 150 Ramp-up temp. 0.5~3.0°C /sec. 2nd Ramp-up temp. Peak temp. 1.0~3.0°C /sec. 210~230°C 5sec. Pre-heat temp. 140~180°C 60~120 sec. Cooling down rate <3°C /sec. 100 Over 200°C 40~50sec. 50 0 60 120 Time ( sec. ) 180 240 300 Note: The temperature refers to the pin of E48SP, measured on the pin +Vout joint. LEAD FREE (SAC) PROCESS RECOMMEND TEMPERATURE PROFILE (SMD MODEL) Temp. Peak Temp.
PAGE 13
MECHANICAL DRAWING (WITHOUT HEATSPREADER) SURFACE-MOUNT MODULE DS_E48SP12020_08252011 THROUGH-HOLE MODULE 13
PAGE 14
MECHANICAL DRAWING (WITH HEATSPREADER) *For modules with through-hole pins and the optional heatspreader, they are intended for wave soldering assembly onto system boards, please do not subject such modules through reflow temperature profile. THROUGH-HOLE MODULE Pin No. 1 2 3 4 5 Name +Vin ON/OFF -Vin -Vout +Vout Function Positive input voltage Remote ON/OFF Negative input voltage Negative output voltage Positive output voltage Pin Specification: Pins 1-3 Pins 4 & 5 1.00mm (0.040”) diameter 1.50mm (0.
PAGE 15
PART NUMBERING SYSTEM E 48 S P 120 20 N R Type of Product Input Voltage Number of Outputs Product Series Output Voltage Output Current ON/OFF Logic Pin Length/Type E- Eighth Brick 48-36V~75V S- Single P - High Power 120 - 12V 20 -20A N- Negative R- 0.170” N- 0.145” S- 0.188” T- 0.220” M- SMD F A Option Code F- RoHS 6/6 A - Standard (Lead Free) H - With heatspreader MODEL LIST MODEL NAME E48SP12020NRFA INPUT 36V~75V OUTPUT 9A 12V EFF @ 100% LOAD 20A 94.