Datasheet

DS_V48SR3R320_12072012
7
FEATURES DESCRIPTIONS
Soldering and Cleaning Considerations
Post solder cleaning is usually the final board assembly
process before the board or system undergoes electrical
testing. Inadequate cleaning and/or drying may lower the
reliability of a power module and severely affect the
finished circuit board assembly test. Adequate cleaning
and/or drying is especially important for un-encapsulated
and/or open frame type power modules. For assistance on
appropriate soldering and cleaning procedures, please
contact Delta’s technical support team.
Over-Current Protection
The modules include an internal output over-current
protection circuit, which will endure current limiting for an
unlimited duration during output overload. If the output
current exceeds the OCP set point, the modules will
automatically shut down, and enter hiccup mode or latch
mode, which is optional.
For hiccup mode, the module will try to restart after
shutdown. If the over current condition still exists, the
module will shut down again. This restart trial will continue
until the over-current condition is corrected.
For latch mode, the module will latch off once it shutdown.
The latch is reset by either cycling the input power or by
toggling the on/off signal for one second.
Over-Voltage Protection
The modules include an internal output over-voltage
protection circuit, which monitors the voltage on the
output terminals. If this voltage exceeds the over-voltage
set point, the module will shut down, and enter in hiccup
mode or latch mode, which is optional.
For hiccup mode, the module will try to restart after
shutdown. If the over voltage condition still exists, the
module will shut down again. This restart trial will continue
until the over-voltage condition is corrected.
For latch mode, the module will latch off once it shutdown.
The latch is reset by either cycling the input power or by
toggling the on/off signal for one second.
Over-Temperature Protection
The over-temperature protection consists of circuitry that
provides protection from thermal damage. If the
temperature exceeds the over-temperature threshold the
module will shut down, and enter in hiccup mode or latch
mode, which is optional.
For hiccup mode, the module will try to restart after
shutdown. If the over temperature condition still exists,
the module will shut down again. This restart trial will
continue until the over-temperature condition is corrected.
For latch mode, the module will latch off once it
shutdown. The latch is reset by either cycling the input
power or by toggling the on/off signal for one second.
Remote On/Off
The remote on/off feature on the module can be either
negative or positive logic. Negative logic turns the
module on during a logic low and off during a logic high.
Positive logic turns the modules on during a logic high
and off during a logic low.
Remote on/off can be controlled by an external switch
between the on/off terminal and the Vi(-) terminal. The
switch can be an open collector or open drain.
For negative logic if the remote on/off feature is not used,
please short the on/off pin to Vi(-). For positive logic if the
remote on/off feature is not used, please leave the on/off
pin floating.
Vo(+)Vi(+)
Vo(-)
Sense(-)
Sense(+)
Vi(-)
ON/OFF
Figure 19: Remote on/off implementation
Remote Sense
Remote sense compensates for voltage drops on the
output by sensing the actual output voltage at the point
of load. The voltage between the remote sense pins and
the output terminals must not exceed the output voltage
sense range given here:
[Vo(+) – Vo(–)] – [SENSE(+) – SENSE(–)] ≤ 10% × Vout
This limit includes any increase in voltage due to remote
sense compensation and output voltage set point
adjustment (trim).
Vi(-)
Vi(+)
Vo(-)
Vo(+)
Sense(+)
Sense(-)
Resistance
Contact
Contact and Distributio
n
Losses
Figure 20: Effective circuit configuration for remote sense
operation