Specifications

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PACKAGE OUTLINE
C
PIN 1 ID
0.9 MAX
0.05
0.00
4X
8
68X
0.3
0.2
64X 0.5
68X
0.7
0.5
4X (45 X0.42)
7.7 0.1
B
10.1
9.9
A
10.1
9.9
(0.2)
VQFN - 0.9 mm max heightNKE0068A
PLASTIC QUAD FLATPACK - NO LEAD
4214820/A 12/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
51
35
34
18
17
1
68
52
0.1 C A B
0.05 C
PIN 1 ID
(OPTIONAL)
SYMM
SYMM
0.1 C
SEATING PLANE
SCALE 1.700