User Manual

Technical Data Sheet
7/23/2004
2 Ton Epoxy®
Description:
Extremely strong, medium-cure, water-resistant clear adhesive that will self-level after application.
Intended Use:
Bonding parts in a structural environment or potting electronic components and assemblies
Product
features:
Cures without shrinking
Cures at room temperature
Good impact resistance
Produces strong, rigid bond on metal, ceramics, wood, concrete, glass, or combinations
Typical
Physical
Properties:
Technical data should be considered representative or typical only and should not be used for specification purposes.
Limitations:
None
Surface
Preparation:
Clean surface by solvent-wiping any deposits of heavy grease, oil, dirt, or other contaminants. Surface can also be
cleaned with industrial cleaning equipment such as vapor phase degreasers or hot aqueous baths. If working with metal,
abrade or roughen the surface to significantly increase the microscopic bond area and increase the bond strength.
Mixing
Instructions:
---- Proper homogenous mixing of resin and hardener is essential for the curing and development of stated strengths. ----
25 ML DEV-TUBE
1. Squeeze material into a small container the size of an ashtray.
2. Using mixing stick included on Dev-tube handle, vigorously mix components for one (1) minute.
3. Immediately apply to substrate.
50 ML/400ML/490 ML CARTRIDGES
1. Attach cartridge to Mark 5 dispensing system.
2. Open tip.
3. Burp cartridge by squeezing out some material until both sides are uniform (ensures no air bubbles are present during
mixing).
4. Attach mix nozzle to end of cartridge.
5. Apply to substrate.
Thermal Conductivity ASTM C 177
Dielectric Strength, volts/mil ASTM D 149
Compressive Strength ASTM D 695
Cured Hardness Shore D ASTM D 2240
Adhesive Tensile Shear ASTM D 1002
Color
Mixed Viscosity
Mix Ratio by Volume
Mix Ratio by Weight
Mixed Density
Working Time
Fixture Time
Functional Cure
Full Cure
Service Temperature
T-peel
Impact Resistance
Tensile Elongation
Shore Hardness
Gap-Fill
Dielectric Strength
% Solids by Volume
Adhesive Tensile Lap Shear[GBS]
Compression Strength
Specific Volume
Clear
8,000 cps
1:1
1:1
9.17 lbs/gal.: 1.10 gm/cc
8-12 min. (28 gm @ 72°F)
30-35 min. @ 72°F
2 hrs. @ 72°F
12 hrs.
Dry, -40°F to 200°F
2-3 pli
6.5 ft.-lb./in.(2)
1%
83 Shore D
Good
600 volts/mil
100
2,250 psi @ 0.010" bondline
11,000 psi
25.2 in.(3)/lb.
Cured 7 days @ 75° F
TESTS CONDUCTED
Uncured
Devcon, 30 Endicott Street, Danvers, MA 01923 Tel:[phone] Fax:[phone] www.devcon.comITW