ESP32C3WROOM02 ESP32C3WROOM02U Datasheet 2.4 GHz WiFi (802.11 b/g/n) and Bluetooth® 5 module Built around ESP32C3 series of SoCs, RISCV singlecore microprocessor 4 MB flash 15 GPIOs Onboard PCB antenna or external antenna connector ESP32C3WROOM02 ESP32C3WROOM02U Version1.0 Espressif Systems Copyright © 2021 www.espressif.
1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/sites/default/files/documentation/esp32-c3-wroom-02_datasheet_en.pdf 1.1 Features • 802.
1 Module Overview – 85 °C version module: –40 ~ 85 °C • Green certification: RoHS/REACH – 105 °C version module: –40 ~ 105 °C Certification Test • RF certification: FCC/CE/SRRC • HTOL/HTSL/uHAST/TCT/ESD/Latch-up 1.2 Description ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U are two general-purpose Wi-Fi and Bluetooth LE module. The rich set of peripherals and high performance make the two modules an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc.
1 Module Overview 1.
Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Description 3 1.3 Applications 4 2 Block Diagram 8 3 Pin Definitions 9 3.1 Pin Layout 9 3.2 Pin Description 9 3.3 Strapping Pins 10 4 Electrical Characteristics 12 4.1 Absolute Maximum Ratings 12 4.2 Recommended Operating Conditions 12 4.3 DC Characteristics (3.3 V, 25 °C) 12 4.4 Current Consumption Characteristics 13 4.5 Wi-Fi Radio 14 4.5.1 Wi-Fi RF Standards 14 4.5.
List of Tables List of Tables 1 Ordering Information 3 2 Pin Definitions 9 3 Strapping Pins 11 4 Parameter Descriptions of Setup and Hold Times for the Strapping Pins 11 5 Absolute Maximum Ratings 12 6 Recommended Operating Conditions 12 7 DC Characteristics (3.3 V, 25 °C) 12 8 Current Consumption Depending on RF Modes 13 9 Current Consumption Depending on Work Modes 13 10 Wi-Fi RF Standards 14 11 TX Power with Spectral Mask and EVM Meeting 802.
List of Figures List of Figures 1 ESP32-C3-WROOM-02 Block Diagram 8 2 ESP32-C3-WROOM-02U Block Diagram 8 3 Pin Layout (Top View) 9 4 Setup and Hold Times for the Strapping Pins 11 5 ESP32-C3-WROOM-02 Schematics 21 6 ESP32-C3-WROOM-02U Schematics 22 7 Peripheral Schematics 23 8 ESP32-C3-WROOM-02 Physical Dimensions 24 9 ESP32-C3-WROOM-02U Physical Dimensions 24 10 ESP32-C3-WROOM-02 Recommended PCB Land Pattern 25 11 ESP32-C3-WROOM-02U Recommended PCB Land Pattern 26 12 Dime
2 Block Diagram 2 Block Diagram 40 MHz Crystal 3V3 Antenna RF Matching ESP32-C3 GPIOs SPICS0 SPICLK SPID SPIQ SPIHD SPIWP VDD_SPI EN SPI Flash ESP32-C3-WROOM-02 Figure 1: ESP32C3WROOM02 Block Diagram 40 MHz Crystal 3V3 Antenna RF Matching ESP32-C3 GPIOs SPICS0 SPICLK SPID SPIQ SPIHD SPIWP VDD_SPI EN SPI Flash ESP32-C3-WROOM-02U Figure 2: ESP32C3WROOM02U Block Diagram Espressif Systems 8 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v1.
3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 7.1 Physical Dimensions. Keepout Zone 1 3V3 IO0 18 2 EN IO1 17 3 IO4 IO2 16 4 IO5 IO3 15 IO19 14 IO18 13 GND GND GND GND Pin 19 GND GND GND GND GND 5 IO6 6 IO7 7 IO8 TXD 12 8 IO9 RXD 11 9 GND IO10 10 Figure 3: Pin Layout (Top View) 3.
3 Pin Definitions Table 2 – cont’d from previous page Name 1 No.
3 Pin Definitions To change the strapping bit values, you can apply the external pull-down/pull-up resistances, or use the host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-C3 family. After reset, the strapping pins work as normal-function pins. Table 3 lists detailed booting configurations of the strapping pins.
4 Electrical Characteristics 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
4 Electrical Characteristics Table 7 – cont’d from previous page Symbol Parameter VIL_nRST Min Chip reset voltage Typ –0.3 1 VDD is the I/O voltage for a particular power domain of pins. 2 VOH and VOL are measured using high-impedance load. — Max Unit 0.25 × VDD 1 V 4.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes.
4 Electrical Characteristics 4.5 WiFi Radio 4.5.1 WiFi RF Standards Table 10: WiFi RF Standards Name Description Center frequency range of operating channel 1 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 11b: 1, 2, 5.5 and 11 Mbps 20 MHz Data rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.
4 Electrical Characteristics Table 12 – cont’d from previous page Rate Min Typ SL1 (dB) (dB) (dB) 802.11n, HT20, MCS7, @17.5 dBm — –29.5 –27 802.11n, HT40, MCS0, @18.5 dBm — –26.5 –5 802.11n, HT40, MCS7, @17 dBm — –29.5 –27 1 SL stands for standard limit value. 4.5.3 WiFi RF Receiver (RX) Specifications Table 13: RX Sensitivity Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.0 — 802.11b, 2 Mbps — –96.0 — 802.11b, 5.5 Mbps — –93.0 — 802.11b, 11 Mbps — –88.
4 Electrical Characteristics Table 14: Maximum RX Level Min Typ Max (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 0 — Rate Table 15: RX Adjacent Channel Rejection Rate Min Typ Max (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.
4 Electrical Characteristics Table 17: Transmitter Characteristics Bluetooth LE 1 Mbps Parameter Description In-band emissions Modulation characteristics Carrier frequency offset Carrier frequency drift Min Typ Max Unit F = F0 ± 2 MHz — –37.62 — dBm F = F0 ± 3 MHz — –41.95 — dBm F = F0 ± > 3 MHz — –44.48 — dBm ∆ f 1avg — 245.00 — kHz ∆ f 2max — 208.00 — kHz ∆ f 2avg /∆ f 1avg — 0.93 — — — — –9.00 — kHz |f0 − fn |n=2, 3, 4, ..k — 1.17 — kHz |f1 − f0 | — 0.
4 Electrical Characteristics Table 20: Transmitter Characteristics Bluetooth LE 500 Kbps Parameter Description In-band emissions Modulation characteristics Carrier frequency offset Carrier frequency drift Min Typ Max Unit F = F0 ± 2 MHz — –37.90 — dBm F = F0 ± 3 MHz — –41.30 — dBm F = F0 ± > 3 MHz — –42.80 — dBm ∆ f 2avg — 220.00 — kHz ∆ f 2max — 205.00 — kHz — — –11.90 — kHz |f0 − fn |n=1, 2, 3, ..k — 1.37 — kHz |f0 − f3 | — 1.
4 Electrical Characteristics Table 22: Receiver Characteristics Bluetooth LE 2 Mbps Parameter Description Sensitivity @30.8% PER — — –93 — dBm Maximum received signal @30.
4 Electrical Characteristics Table 24 – cont’d from previous page Parameter Adjacent channel selectivity C/I Image frequency Adjacent channel to image frequency Espressif Systems Description Min Typ Max Unit F = F0 + 1 MHz — –6 — dB F = F0 – 1 MHz — –7 — dB F = F0 + 2 MHz — –34 — dB F = F0 – 2 MHz — –37 — dB F ≥ F0 + 3 MHz — –38 — dB F ≤ F0 – 3 MHz — –40 — dB F ≥ F0 + 4 MHz — –40 — dB F ≤ F0 – 4 MHz — –42 — dB — — –40 — dB F = Fimage + 1 MHz — –45 —
4 3 2 1 5 Module Schematics 5 Module Schematics This is the reference design of the module. D D GND XOUT C2 TBD 2 1 The value of R1 varies with the actual PCB board. GND 40MHz(±10ppm) 0 VDD33 GND 3 U1 GND C1 TBD The values of C1 and C2 vary with the selection of the crystal. 4 GND GND XIN Espressif Systems 5 33 0 C7 10uF 0.
5 4 3 2 1 GND XOUT R1 GND ANT1 C8 CONN TBD TBD C9 GND TBD GND LNA_IN GPIO0 GPIO1 GPIO2 CHIP_EN GPIO3 1 2 3 4 5 6 7 8 LNA_IN VDD3P3 VDD3P3 XTAL_32K_P XTAL_32K_N GPIO2 CHIP_EN GPIO3 SPIQ SPID SPICLK SPICS0 SPIWP SPIHD VDD_SPI VDD3P3_CPU The values of C8, L2 and C9 vary with the actual PCB board. NC: No component. U2 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v1.
5 4 3 6 Peripheral Schematics 6 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). VDD33 0.
7 Physical Dimensions and PCB Land Pattern 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions Unit: mm 18±0.15 3.2±0.15 0.4 0.7 2.9 8.04 18 x 0.45 1.15 0.4 0.7 6.7 2.9 18 x 0.9 0.71 0. 5 12.37 15.7 Ø 18 x 0.9 0.9 1.5 18 x Ø0.55 12 20±0.15 6 0.8 18 x 0.85 Top View Bottom View Side View Figure 8: ESP32C3WROOM02 Physical Dimensions Unit: mm 18±0.15 3.2±0.15 2.75 0.8 2.9 2.9 0.4 0.7 6.7 18 x 0.9 2.3 0.78 8.85 12.75 0. 5 Ø 18 x 0.9 0.9 1.5 12 14.3±0.
7 Physical Dimensions and PCB Land Pattern 7.2 Recommended PCB Land Pattern Unit: mm Via for thermal pad Copper 6 Antenna Area 18 x 1.5 7.1 18 18 1 20 1.5 2.9 0.9 18 x 0.9 0.4 0.4 0.7 0.7 6.7 2.9 9.96 9 10 17.5 0.5 0.5 Figure 10: ESP32C3WROOM02 Recommended PCB Land Pattern Espressif Systems 25 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v1.
7 Physical Dimensions and PCB Land Pattern Unit: mm Via for thermal pad Copper 18 18 x 1.5 0.7 6.7 2.9 9.96 9 14.3 1.5 2.9 0.9 18 x 0.9 0.4 0.4 0.7 1.4 18 1 10 17.5 0.5 0.5 Figure 11: ESP32C3WROOM02U Recommended PCB Land Pattern Espressif Systems 26 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v1.
7 Physical Dimensions and PCB Land Pattern 7.3 Dimensions of External Antenna Connector ESP32-C3-WROOM-02U uses the first generation external antenna connector as shown in Figure 12. This connector is compatible with the following connectors: • U.FL Series connector from Hirose • MHF I connector from I-PEX • AMC connector from Amphenol Unit: mm Figure 12: Dimensions of External Antenna Connector Espressif Systems 27 ESP32-C3-WROOM-02 & WROOM-02U Datasheet v1.
8 Product Handling 8 Product Handling 8.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and /60%RH. If the above conditions are not met, the module needs to be baked. 8.
9 Related Documentation and Resources 9 Related Documentation and Resources Related Documentation • ESP32-C3 Technical Reference Manual – Detailed information on how to use the ESP32-C3 memory and peripherals. • ESP32-C3 Series Datasheet – Specifications of the ESP32-C3 hardware. • Certificates http://espressif.com/en/support/documents/certificates • Documentation Updates and Update Notification Subscription http://espressif.
Revision History Revision History Date Version Release notes • Updated module description on the title page • Deleted Section ”About This Document” • Restructured Section 1.1 Features • Updated Table 12 TX EVM Test • Updated Table 15 RX Adjacent Channel Rejection 2021-08-20 v1.0 • Updated Chapter 5 Module Schematics • Updated ESP32-C3-WROOM-02U Physical Dimensions • Added descriptions in Section 7.
Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
