Data Sheet

Fully Integrated, Hall Effect-Based Linear Current Sensor IC
with
2.1 kVRMS Isolation and a Low-Resistance Current Conductor
ACS712
4
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
COMMON OPERATING CHARACTERISTICS
1
over full range of T
A
, C
F
= 1 nF, and V
CC
= 5 V, unless otherwise specified
Characteristic Symbol Test Conditions Min. Typ. Max. Units
ELECTRICAL CHARACTERISTICS
Supply Voltage V
CC
4.5 5.0 5.5 V
Supply Current I
CC
V
CC
= 5.0 V, output open – 10 13 mA
Output Capacitance Load C
LOAD
VIOUT to GND – – 10 nF
Output Resistive Load R
LOAD
VIOUT to GND 4.7 – – kΩ
Primary Conductor Resistance R
PRIMARY
T
A
= 25°C – 1.2 – mΩ
Rise Time t
r
I
P
= I
P
(max), T
A
= 25°C, C
OUT
= open – 3.5 – μs
Frequency Bandwidth f –3 dB, T
A
= 25°C; I
P
is 10 A peak-to-peak – 80 – kHz
Nonlinearity E
LIN
Over full range of I
P
– 1.5 – %
Symmetry E
SYM
Over full range of I
P
98 100 102 %
Zero Current Output Voltage V
IOUT(Q)
Bidirectional; I
P
= 0 A, T
A
= 25°C –
V
CC
×
0.5
– V
Power-On Time t
PO
Output reaches 90% of steady-state level, T
J
= 25°C, 20 A present
on leadframe
– 35 – µs
Magnetic Coupling
2
– 12 – G/A
Internal Filter Resistance
3
R
F(INT)
1.7 kΩ
1
Device may be operated at higher primary current levels, I
P
, and ambient, T
A
, and internal leadframe temperatures, T
A
, provided that the Maximum
Junction Temperature, T
J
(max), is not exceeded.
2
1G = 0.1 mT.
3
R
F(INT)
forms an RC circuit via the FILTER pin.
COMMON THERMAL CHARACTERISTICS
1
Min. Typ. Max. Units
Operating Internal Leadframe Temperature T
A
E range –40 – 85 °C
Value Units
Junction-to-Lead Thermal Resistance
2
R
θJL
Mounted on the Allegro ASEK 712 evaluation board 5 °C/W
Junction-to-Ambient Thermal Resistance R
θJA
Mounted on the Allegro 85-0322 evaluation board, includes the power con-
sumed by the board
23 °C/W
1
Additional thermal information is available on the Allegro website.
2
The Allegro evaluation board has 1500 mm
2
of 2 oz. copper on each side, connected to pins 1 and 2, and to pins 3 and 4, with thermal vias connect-
ing the layers. Performance values include the power consumed by the PCB. Further details on the board are available from the Frequently Asked
Questions document on our website. Further information about board design and thermal performance also can be found in the Applications Informa-
tion section of this datasheet.