Datasheet

ENS160 Datasheet v0.95 preliminary / December 2020
35
18 Soldering Information
The ENS160 uses an open LGA package. This package can be soldered using a standard reflow
process in accordance with IPC/JEDEC J-STD-020D.
Figure 20: Solder Reflow Profile Graph
The detailed settings for the reflow profile are shown in the table below.
Table 38: Solder Reflow Profile
Parameter
Reference
Rate / Unit
Average temperature gradient in preheating
2.5K/s
Soak time
t
SOAK
2..3 min
Soak temp range
Ts max
200°C
Ts min
150°C
Time above 217°C (T
1
)
t
1
Max. 60s
Time above 230°C (T
2
)
t
2
Max. 50s
Time above T
PEAK
-10°C (T
3
)
t
3
Max. 10s
Peak temperature in reflow
T
PEAK
260°C
Temperature gradient in cooling
Max. -5K/s
It is recommended to use a no-clean solder paste. There should not be any board wash
processes, to prevent cleaning agents or other liquid materials contacting the sensor area.
Time [s]
Temperature
[°C]
T
PEAK
T
3
T
2
T
1
t
SOAK
t
3
t
2
t
1